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SMTA Europe announces Session 6, Technical Program on Automotive Electronics at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25, 2018.
Electronic products may be subjected to thermal excursions resulting from the power on/off cycling and changes in the environment temperature. The board geometry and architecture can affect the thermal-mechanical reliability of the PCB materials. Dr. Eric Cotts from Binghamton University will present on PCB Materials and Fabrication. Dr. Cotts will share his thoughts on designing for excellence.
The plastic package that houses integrated circuits can degrade when exposed to high temperatures. Erik Spory of Global Circuit Innovations will present on a hermetic ceramic package design that provides a die pad surface for applications up to 250°C without connectivity degradation. Mr. Spory will also reference this technology option for use into other applications which expose IC to harsh environments.
With technology thrusts into automotive and aviation, electronics need to be designed to operate reliably at temperatures between 150°C and 175°C. Dr. Craig Hillman of DfR Solutions will present on insights and tradeoffs in designing passives, crystals, magnetics, discretes, integrated circuits, connectors, PCBs and solders to operate reliability within high temperature environments. Dr. Hillman will show how Point of Failure models can be sued to understand the risks of high temperature environments over time and how to effectively mitigate those risks through circuit design, derating and material selection.