Aqueous Technologies’ Mike Konrad to Present Live Webinar


Reading time ( words)

Mike Konrad will present a live webinar entitled “Improving Reliability of Circuit Assemblies in Harsh Environments” on Tuesday, February 5, 2019.

With the rapid expansion of IOT, many circuit assemblies are now functioning in unfamiliar environments, many of these environments are harsh. Additionally, many new electronic applications control critical systems such as automotive electronics. This webinar focuses on the influence contamination plays on reliability of circuit assemblies, particularly when operated in harsh environments. Several contamination-related failure mechanisms will be presented including electro-chemical migration (dendritic growth, parasitic leakage) and conductive anodic filament (CAF). Methods to determine how clean is clean enough will be discussed.

This webinar is part of Aqueous Technologies non-commercial Tech-Tuesday educational events and is offered free of charge. Registration is now open here: https://bit.ly/2Dk8DQI

Mike Konrad is the founder and CEO of Aqueous Technologies, is an SMTA Distinguished Speaker and is the host of the Reliability Matters podcast available on iTunes.

Share

Print


Suggested Items

Chapter 1 Excerpt: The Printed Circuit Assembler’s Guide to Process Validation

12/31/2020 | Graham Naisbitt, Gen3 Systems
The original principle underlying the IPC’s ionic cleanliness requirement was that the mobility of surface ions, detectable from SIR measurements, would correlate to a maximum value of detectable ionic elements permissible on the circuit surface. The industry required a test that was both fast and accurate for process control. Thus, a simplified ion chromatograph that was able to detect ionic elements without differentiation was created.

Watch Coatings Uncoated Webinar, Part 6 Now: Field Failures, Silicon vs. Sulfur

02/19/2020 | I-Connect007 Editorial Team
The sixth episode of the popular webinar series, "Coatings Uncoated," is now available to view. Based on an interesting case study concerning a telecommunications giant experiencing a high degree of field failures, coatings specialist Phil Kinner explains the mechanism behind the failures and why the silicone option proved unsuccessful. Part six of this micro webinar series concludes with a full explanation of the successful solution.

LPKF on Stencils and Depaneling

02/11/2020 | I-Connect007 Editorial Team
Stephan Schmidt and Mirela Orlowski of LPKF Laser & Electronics North America discuss laser technology in cutting stencils and depaneling circuit boards as a factor in shrinking component sizes and why few people in the industry realize how much of an impact the stencil can have on the manufacturing line.



Copyright © 2021 I-Connect007. All rights reserved.