DDM Novastar to Introduce New Semi-Automatic Inspection System at IPC APEX EXPO 2019


Reading time ( words)

DDM Novastar Inc will launch its new NovaScope semi-automatic optical inspection system (SOI) at IPC APEX EXPO 2019 in San Diego (booth 1633, January 29-31). The NovaScope SOI System offers a ‘best in class’ solution that bridges the gap between manual PCB inspections and fully automatic AOI machines. This new versatile system offers fast and easy programming, automatic reporting, automatic photo documentation, reduced operator fatigue and optional side viewing.

The NovaScopeinspects and archives images of printed circuit board assemblies. It significantly increases the speed and accuracy of manual visual inspections, and it comes at a fraction of the price of a fully automated AOI. Programming can be done in a matter of minutes using the integrated Gerber, XY Placement List, and Bill of Materials import features. There is also a utility for simple matrix type scanning and inspecting of the board. Inspection area sizes range from 18” x 12” up to 24”x 18” and offer optional side view capability for oblique viewing in 8 programmable positions around each component.

The NovaScope is a powerful inspection tool for:

  • High Reliability applications (MIL-Spec, Medical, Automotive)
  • Hi-Mix, Low-Volume operations
  • First Article Inspection
  • Photo Documentation
  • Conformal Coating
  • Assembly Line Auditing
  • Cleanliness / FOD/Tin Whisker detection

The system automatically moves a digital microscope to the inspection points, sets the lighting, camera height and angle, zooms to the region of interest, and displays a live image of the inspection area. The system displays a golden board image for visual comparison.

DDM2.jpgThe images are automatically captured and can be stored as part of a post inspection report. The inspection can be done by component, by board region, or by a combination of both. Inspections can be performed for many reasons: verify part presence, rotation, polarity, registration, text, solder, solder paste, bent leads, bent pins, jumpers, cut traces, or any other top down or side visual feature on the PCB.

Available Options: In addition to options enhanced microscopes, and views, the systems can be configured as desktop unit or floor model, drawer or SMEMA conveyor, manual or programmable width control.

Share

Print


Suggested Items

Catching Up With Nova Engineering

04/27/2021 | Dan Beaulieu, D.B. Management Group
When searching for companies to interview, I always look for something unique and that makes the company special. Truth be told, I am a collector of stories about good, well-run, unique companies that we can learn something from. Nova Engineering is one of those companies.

Hans-Peter Tranitz: Dieter Bergman IPC Fellowship Award Recipient

04/22/2021 | Patty Goldman, I-Connect007
In this wide-ranging interview, Patty Goldman speaks with Continental Automotive’s Peter Tranitz about his IPC involvement with press-fit and other automotive standards which have earned him the coveted Dieter Bergman IPC Fellowship Award.

Excerpt—The Printed Circuit Assembler’s Guide to... SMT Inspection: Today, Tomorrow, and Beyond, Chapter 3

04/22/2021 | Brent Fischthal, Koh Young America
Initiatives like the IPC Connected Factory Exchange (CFX) and IPC-Hermes-9852 underpin efforts within the industry to develop standards and help create a smart factory. These M2M communication standards, guided in part by Industry 4.0, are altering the manufacturing process by improving metrics such as first pass yield and throughput by applying autonomous process adjustments.



Copyright © 2021 I-Connect007. All rights reserved.