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Three Indium Corporation experts will share their expertise at the SMTA China East Technology Conference on April 24-26 in Shanghai, China.
Wisdom Qu, area tech manager, Eastern China, will present Printing Process Design for High-Density, Low-Space Components. This presentation examines the impact of miniaturization on the printing process as PCBs in electronic assemblies become denser and more compact, potentially leading to insufficient solder deposits or skipped areas during printing. Qu will also share process recommendations, including stencil types, stencil under wiping methods, and solvent selections to achieve good printing.
Fiona Chen, manager of research & development, will present Novel Fluxes with Decreased Viscosity After Reflow for Flip-Chip and SiP Assembly. While a tacky flux is necessary to secure the chip during handling and reflow, the reflow itself can increase the tackiness of the flux. This can impede the operator’s ability to remove the flux residue after reflow in order to achieve high reliability. Chen’s presentation will review a novel flux solution to this challenge.
Evan Yin, assistant manager for Indium Corporation’s Process Development Lab in Suzhou, China, will present Impact of Stencil Quality & Technology on Solder Paste Printing Performance. His presentation examines the impact of increased miniaturization in packaging and board-level assembly as part of the Internet of Things (IoT). As the industry moves to smaller and finer pitches, screen printing becomes a critical process with little if any margin for error when producing high quality electronics assemblies.
Qu provides technical support for Indium Corporation's electronics assembly materials, semiconductor and advanced assembly materials, and epoxy flux products. Based in Suzhou, Qu has extensive experience in surface-mount technology and is an SMTA Certified Process Engineer.
Chen is the Manager of Research & Development at Indium Corporation’s Suzhou facility. She is responsible for new technology and product development and is working on the development of electronics SMT assembly solder materials with an emphasis on new flux chemistry development for lead-free soldering applications.
Yin is responsible for equipment engineering at Indium Corporation’s Process Development Lab in Suzhou, PRC. He provides technical support and services, such as product and process recommendations and troubleshooting, and conducts product evaluations and qualifications. Yin has worked in the surface mount technology field for more than 15 years.
About Indium Corporation
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.