KYZEN’s T.C. Loy Presents at the IPC Southeast Asia High Reliability Conference in Vietnam


Reading time ( words)

KYZEN has announced that T.C. Loy, KYZEN Sdn Bhd’s technical sales manager, will present at the 2019 IPC Southeast Asia High Reliability Conference – Vietnam, scheduled to take place August 14, 2019 at the Eastin Grand Hotel Saigon. Loy will present: “Developing Cleaning Process Parameters.”

A wide range of contamination can be found on electronic assemblies. In addition to flux residue, you may find board surface and internal residues, component contamination, and of course, contamination transfer from board handling. The typical cleaning process when designed to clean the flux residue will remove the other residual contaminants that can lead to Electro Chemical Migration.

This presentation will focus on establishing a qualification and considerations needed to develop a robust and reliable cleaning process to remove all residues. Loy will discuss the flux contamination removal of the cleaning process to establish process stability.    

About KYZEN

KYZEN is a global leader in providing environmentally responsible, RoHS compliant precision cleaning chemistries for industries ranging from electronics and advanced packaging to metal finishing and aerospace applications. Since its founding in 1990, KYZEN’s innovative cleaning technologies, scientific expertise and customer support have been repeatedly recognized with the industry’s most prestigious awards. For more information, visit www.kyzen.com.

Share

Print


Suggested Items

Catching Up With Nova Engineering

04/27/2021 | Dan Beaulieu, D.B. Management Group
When searching for companies to interview, I always look for something unique and that makes the company special. Truth be told, I am a collector of stories about good, well-run, unique companies that we can learn something from. Nova Engineering is one of those companies.

Hans-Peter Tranitz: Dieter Bergman IPC Fellowship Award Recipient

04/22/2021 | Patty Goldman, I-Connect007
In this wide-ranging interview, Patty Goldman speaks with Continental Automotive’s Peter Tranitz about his IPC involvement with press-fit and other automotive standards which have earned him the coveted Dieter Bergman IPC Fellowship Award.

Excerpt—The Printed Circuit Assembler’s Guide to... SMT Inspection: Today, Tomorrow, and Beyond, Chapter 3

04/22/2021 | Brent Fischthal, Koh Young America
Initiatives like the IPC Connected Factory Exchange (CFX) and IPC-Hermes-9852 underpin efforts within the industry to develop standards and help create a smart factory. These M2M communication standards, guided in part by Industry 4.0, are altering the manufacturing process by improving metrics such as first pass yield and throughput by applying autonomous process adjustments.



Copyright © 2021 I-Connect007. All rights reserved.