Dr. Jennie Hwang to Address Solder Joint Reliability at SMTAI 2019


Reading time ( words)

Solder joint reliability plays a critical role in the reliability of the entire spectrum of end-use electronic products from consumer to industrial, from computing to IoT, from medical to military applications. In lead-free electronics, solder joint reliability becomes increasingly important to the manufacture and performance of the chip level, package level and board level interconnections. Understanding the essential factors behind solder joint reliability is a necessity to designing and manufacturing reliable products.

On Monday, September 23, Dr Jennie S. Hwang leverages her decades of comprehensive real-world experiences and deep knowledge, having solved most challenging reliability problems, to address solder joint reliability by integrating scientific fundamentals with practical requirements. Join your industry colleagues to hear the true authority in solder joint reliability at SMTA International. Dr. Hwang will discuss relevant and crucial aspects of solder joint reliability at PDC 09 – “Solder Joint Reliability - Principles and Applications.” Attendees are encouraged to bring their own selected systems for deliberation.

Register: https://www.smta.org/smtai/register.cfm
Info: Tanya Martin email: tanya@smta.org
PDC 09 Solder Joint Reliability – Principles and Applications   8:30am — 12:00pm

Topics Covered

  • Premise – critical players, definition of reliability, solder joint thermo-mechanical degradation – fatigue and creep interaction
  • Solder joint failures modes - interfacial, near-interfacial, bulk, inter-phase, intra-phase, voids-induced, others
  • Solder joint failure mechanisms – ductile, brittle, ductile-brittle transition fracture
  • Solder joint strengthening metallurgy
  • Illustration of microstructure evolution vs. strengthening in Sn Cu+x,y,z and SnAgCu+x,y,z systems
  • Solder joint voids vs. reliability - causes, effects, criteria
  • Solder joint surface-crack –causes, effects
  • Distinctions and commonalties between Pb-free and SnPb solder joints
  • Thermal cycling conditions - effects on test results and test results interpretation
  • Testing solder joint reliability – discriminating tests and discerning parameters
  • Life-prediction model vs. reliability
  • Solder joint performance in harsh environments
  • What alloys are on the horizon and what impact will be on reliability
  • Relative reliability ranking among commercially available solder systems
  • Best practices and competitive manufacturing;
  • Ultimate reliability

Share

Print


Suggested Items

Catching Up With Nova Engineering

04/27/2021 | Dan Beaulieu, D.B. Management Group
When searching for companies to interview, I always look for something unique and that makes the company special. Truth be told, I am a collector of stories about good, well-run, unique companies that we can learn something from. Nova Engineering is one of those companies.

Hans-Peter Tranitz: Dieter Bergman IPC Fellowship Award Recipient

04/22/2021 | Patty Goldman, I-Connect007
In this wide-ranging interview, Patty Goldman speaks with Continental Automotive’s Peter Tranitz about his IPC involvement with press-fit and other automotive standards which have earned him the coveted Dieter Bergman IPC Fellowship Award.

Excerpt—The Printed Circuit Assembler’s Guide to... SMT Inspection: Today, Tomorrow, and Beyond, Chapter 3

04/22/2021 | Brent Fischthal, Koh Young America
Initiatives like the IPC Connected Factory Exchange (CFX) and IPC-Hermes-9852 underpin efforts within the industry to develop standards and help create a smart factory. These M2M communication standards, guided in part by Industry 4.0, are altering the manufacturing process by improving metrics such as first pass yield and throughput by applying autonomous process adjustments.



Copyright © 2021 I-Connect007. All rights reserved.