MacDermid Alpha to Present Research on High-Reliability Alloys at SMTA Philadelphia Chapter Meeting


Reading time ( words)

MacDermid Alpha Electronics Solutions, a world leader in the production of electronics soldering and bonding materials, will present at the SMTA Philadelphia Chapter meeting being held on March 12th, 2020 at Lutron Electronics, Inc. in Coopersburg, Pennsylvania.

Jason Fullerton, Customer Technical Support Engineer at MacDermid Alpha, is one of two featured speakers at this event. Fullerton will present Advances in Lead-free Solder Technologies for High Reliability Applications. This paper will explore lead-free alloy development, enhancements in solder paste performance, and processing differences between these alloys and typical SAC and tin-lead alloys. “Environmental regulations have driven the electronics industry to adopt lead-free solders. However, high reliability applications continue to use legacy tin-lead solder alloys,” said Fullerton. “We’ll discuss how evolving designs, service environments, and reliability requirements have driven development of new types of solder alloys.”

The second speaker will be Greg Smith, Manager of Stencil Technology at BlueRing Stencils. Smith will present Root Cause Stencil Design for SMT Components Thermal Lands. This paper will explore recent studies on stencil design to minimize voiding on quad flat no-lead (QFN) thermal lands and the effect of the window pane design on void area percentage after reflow for surface mount technology (SMT) component thermal pads without introducing float to the component. Areas of focus will be specific window pane gap sizes, total area printed, and the distance of the outer pane edges to the copper thermal land edge will be varied to determine guidelines for thermal pad stencil design.

The Chapter Meeting will begin at 5:15 pm with dinner and networking, followed by the presentations which begin at 6:15 pm. This is the first meeting organized by newly appointed Chapter President, Anna Lifton, Research and Development Manager at MacDermid Alpha. Event sponsors are StenTech and Argo/Zeta with Lutron Electronics hosting the evening’s event.

The event is open to SMTA members and non-members. Those interested can register at the Philadelphia Chapter page on the SMTA website.

You can learn more about MacDermid Alpha’s solutions to optimize component reliability and assembly at MacDermidAlpha.com.

About MacDermid Alpha Electronics Solutions

Through the innovation of specialty chemicals and materials under our Alpha, Kester, Compugraphics, and MacDermid Enthone brands, we provide solutions that power electronics interconnection. We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain. The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partners clients. Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time. Find out more at MacDermidAlpha.com.

About SMTA

The Surface Mount Technology Association (SMTA) is a non-profit international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations. For more information, visit http://www.smta.org.

Share

Print


Suggested Items

Catching Up With Nova Engineering

04/27/2021 | Dan Beaulieu, D.B. Management Group
When searching for companies to interview, I always look for something unique and that makes the company special. Truth be told, I am a collector of stories about good, well-run, unique companies that we can learn something from. Nova Engineering is one of those companies.

Hans-Peter Tranitz: Dieter Bergman IPC Fellowship Award Recipient

04/22/2021 | Patty Goldman, I-Connect007
In this wide-ranging interview, Patty Goldman speaks with Continental Automotive’s Peter Tranitz about his IPC involvement with press-fit and other automotive standards which have earned him the coveted Dieter Bergman IPC Fellowship Award.

Excerpt—The Printed Circuit Assembler’s Guide to... SMT Inspection: Today, Tomorrow, and Beyond, Chapter 3

04/22/2021 | Brent Fischthal, Koh Young America
Initiatives like the IPC Connected Factory Exchange (CFX) and IPC-Hermes-9852 underpin efforts within the industry to develop standards and help create a smart factory. These M2M communication standards, guided in part by Industry 4.0, are altering the manufacturing process by improving metrics such as first pass yield and throughput by applying autonomous process adjustments.



Copyright © 2021 I-Connect007. All rights reserved.