SMTA International Technical Committee Announces Best Presentation and Paper Awards from the 2019 Conference


Reading time ( words)

The SMTA is pleased to announce the Best Papers from SMTA International 2019. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings.  For these exceptional achievements, a cash award and plaque are given to primary authors of all winning papers.

Chris Gourlay, Imperial College London won the Best of Proceedings category for the paper "Phase Formation and Solid Solubility in High Reliability Pb-Free Solders Containing Bi, Sb, In."

Richard Coyle, Ph.D., Nokia Bell Labs, came in second for the paper “Vacuum Reflow Processing of Ball Grid Array Packages to Reduce Solder Joint Voiding and Improve Attachment Reliability.”

Yoshinori Ejiri, Hitachi Chemical Co., Ltd. took third place for the paper “Wire Bonding Reliability of Electroless Ni/Pd/Au Plating Influence of Electroless Pd Deposition Reaction.”

The winner from SMTA International 2019 for the Rich Freiberger Best of Conference Award, as selected by the conference attendees, is Michael Konrad, Aqueous Technologies, for the presentation entitled "IPC's New Cleanliness Testing Standard is Now Active. What's New? What Stays the Same?" The award is based on the conference attendees' rating of each speaker at the technical session.

Best Student Presentation was awarded to Faramarz Hadian, Binghamton University, for the paper “Study Electromigration in SnBiAg / SAC(305) Mixed Solder Alloy.”

The authors will formally be presented their awards during SMTA International on September 27−October 1, 2020 in Rosemont, Illinois. For information on participating in the 2020 SMTA International Conference, visit the Call for Papers page at https://smta.org/smtai/call_for_papers.cfm. Abstracts can be uploaded directly on-line and are still being accepted.

The papers are available in the conference proceedings available in the SMTA Bookstore at https://www.smta.org/store/book_store.cfm. The individual articles are available for SMTA members to download from the knowledge base.

For more information contact Tanya Martin: tanya@smta.org or +1-952-920-7682 or visit https://www.smta.org.

SMTAA Global Association Working at a Local Level

The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.

Share

Print


Suggested Items

Catching Up With Nova Engineering

04/27/2021 | Dan Beaulieu, D.B. Management Group
When searching for companies to interview, I always look for something unique and that makes the company special. Truth be told, I am a collector of stories about good, well-run, unique companies that we can learn something from. Nova Engineering is one of those companies.

Hans-Peter Tranitz: Dieter Bergman IPC Fellowship Award Recipient

04/22/2021 | Patty Goldman, I-Connect007
In this wide-ranging interview, Patty Goldman speaks with Continental Automotive’s Peter Tranitz about his IPC involvement with press-fit and other automotive standards which have earned him the coveted Dieter Bergman IPC Fellowship Award.

Excerpt—The Printed Circuit Assembler’s Guide to... SMT Inspection: Today, Tomorrow, and Beyond, Chapter 3

04/22/2021 | Brent Fischthal, Koh Young America
Initiatives like the IPC Connected Factory Exchange (CFX) and IPC-Hermes-9852 underpin efforts within the industry to develop standards and help create a smart factory. These M2M communication standards, guided in part by Industry 4.0, are altering the manufacturing process by improving metrics such as first pass yield and throughput by applying autonomous process adjustments.



Copyright © 2021 I-Connect007. All rights reserved.