AIM Appoints Timothy O’Neill Director of Product Management


Reading time ( words)

AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce the appointment of Timothy O’Neill to the position of Director of Product Management.

As AIM’s Director of Product Management, Timothy’s new role will include managing products throughout the product life cycle, gathering and prioritizing product and customer requirements, defining the product vision, and working closely with the R&D team to continue developing world-class solder products.

With over 25 years of experience in the solder industry, Timothy has co-authored several papers on PCB assembly subjects. He is a Certified IPC Specialist, a technical writer and presenter for industry trade publications and events. His commitment and dedication to sharing innovative solutions to challenging problems in the electronics assembly market have earned him recognition from the SMTA as Speaker of Distinction.

“This is a very important and exciting new role for both Tim and the company,” said AIM’s Executive Vice President, David Suraski. “Tim has been a valuable resource for AIM customers for many years and we are confident that he will excel in his new role and look forward to his valuable contributions.”

Share

Print


Suggested Items

Catching Up With Nova Engineering

04/27/2021 | Dan Beaulieu, D.B. Management Group
When searching for companies to interview, I always look for something unique and that makes the company special. Truth be told, I am a collector of stories about good, well-run, unique companies that we can learn something from. Nova Engineering is one of those companies.

Hans-Peter Tranitz: Dieter Bergman IPC Fellowship Award Recipient

04/22/2021 | Patty Goldman, I-Connect007
In this wide-ranging interview, Patty Goldman speaks with Continental Automotive’s Peter Tranitz about his IPC involvement with press-fit and other automotive standards which have earned him the coveted Dieter Bergman IPC Fellowship Award.

Excerpt—The Printed Circuit Assembler’s Guide to... SMT Inspection: Today, Tomorrow, and Beyond, Chapter 3

04/22/2021 | Brent Fischthal, Koh Young America
Initiatives like the IPC Connected Factory Exchange (CFX) and IPC-Hermes-9852 underpin efforts within the industry to develop standards and help create a smart factory. These M2M communication standards, guided in part by Industry 4.0, are altering the manufacturing process by improving metrics such as first pass yield and throughput by applying autonomous process adjustments.



Copyright © 2021 I-Connect007. All rights reserved.