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AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Flopy Feng received Best Presentation Award for the technical session presented at the 2020 SMTA China South Technology Conference in Shenzen, China.
Flopy’s presentation, “Pin-In-Paste,” details the Pin-in-Paste (PiP) process including PCB and stencil design considerations as well as solder paste selection and reflow guidelines. The PiP technique can be more cost effective by eliminating the need for a wave or selective soldering process and the associated costs.
Flopy Feng is a Technical Support Manager for AIM Solder. Having worked as a process supervisor for many years, he is experienced in process evaluation and optimization. With over 20 years’ of experience in the SMT industry, Flopy supports AIM customers in south China.