SMTA Additive Electronics TechXchange Speakers List Announced


Reading time ( words)

SMTA_TechXchange_speakers.jpgThe Additive Electronics TechXchange, organized by SMTA, is scheduled for Thursday, October 15, 2020. This will be a virtual event and is open to SMTA members and non-members alike. SMTA members attend this session for free, and it’s $150 for non-members. Here is the list of featured speakers for the upcoming event, including a keynote presentation and more. For full details and to register, visit smta.org/additive.

Prismark_Jeff_Doubrava (1).jpgKeynote Speaker: Jeff Doubrava, Managing Partner, Prismark Partners LLC
“Outlook for Advanced Printed Circuit Board Fabrication: Applications, Technologies, and Production”

Before joining Prismark, Jeff spent 20 years with Shipley/Rohm and Haas, most recently as global business director for the printed wiring board materials business. Jeff holds a B.A. in chemistry from the University of Rochester and an M.B.A. from Babson College. He holds several U.S. patents for his development of enabling electronic materials.

Pradeep_Lall.jpgPradeep Lall, Ph.D., Auburn University
Process Development for Additive Printing of Multilayer Flexible Substrates With Z-Axis Interconnects”

Pradeep Lall is the MacFarlane Endowed Distinguished Professor with the Department of Mechanical Engineering and Director of the NSF-CAVE3 Electronics Research Center at Auburn University. He holds Joint Courtesy Appointments in the Department of Electrical and Computer Engineering and the Department of Finance. He is a member of the technical-council, academic co-lead of the asset-monitoring TWG, and past-member of the governing council of NextFlex Manufacturing Institute.

Jonathan_Viventi.jpgJonathan Viventi, Ph.D., Duke University
“Flexible Electronics for Neural Interfaces”

Jonathan Viventi is an Assistant Professor of Biomedical Engineering at Duke University. Dr. Viventi earned his Ph.D. in bioengineering from the University of Pennsylvania and his M.Eng. and B.S.E. degrees in electrical engineering from Princeton University. Dr. Viventi's research applies innovations in flexible electronics, low-power analog circuits, and machine learning to create new technology for interfacing with the brain at a much finer scale and with broader coverage than previously possible.

Juan_Landeros.jpgJuan Landeros, Intel Corporation
“Design Drivers for Advancements in PCB Fabrication Technologies”

Juan Landeros is a principal engineer in the technology development group at Intel. He has worked on substrate and PCB design rule development across multiple technology generations and diverse set of platform definitions. Juan currently leads the PCB design rule roadmap. Juan is a graduate of San Jose State University with a degree in materials engineering.

Kourtney_Wright.jpgKourtney Wright, Ph.D., Lockheed Martin

Dr. Kourtney Wright is a senior research scientist at the Advanced Technology Center within Lockheed Martin Space. She leads projects to further develop and expand the applications for LM’s CuantumFuse copper pastes and inks. Dr. Wright received her Ph.D. in chemistry from Rice University in 2017, where she studied organometallic chemistry.

Judy_Dickson_300.jpgJudy Dickson, Ph.D., Northrop Grumman
“Advanced PWBs: A Collaboration Between Design, Operations, and the Supply Chain”

Judy Dickson joined Northrop Grumman in August 2017 as part of the Future Technical Leaders (FTL) program. She graduated summa cum laude with a B.S. in mechanical engineering from the University of Central Florida in 2012. She then went on to receive M.S. and Ph.D. degrees in materials science and engineering from the Georgia Institute of Technology, where she was a National Defense Science and Engineering Graduate (NDSEG) Fellow. Before Northrop Grumman, she worked with Siemens and Universal Alloy Corporation.

Steve_Vetter_200.jpgSteve Vetter, NSWC Crane
"Very High-Density Interconnect Process Development”

Mr. Steve Vetter has worked in the electronics interconnect industry throughout most of his 35-year professional career. A graduate of Western Kentucky University with a Bachelor of Science in Electrical Engineering Technology, Mr. Vetter has held quality, manufacturing and design engineering and management positions for small independent PCB manufacturers and assemblers as well as captive facilities for large defense contractors. Currently an electronics engineer for the Naval Surface Warfare Center, Crane, Indiana, Mr. Vetter provides technical support for the PCB executive agent assignment and serves as the technology development charter area lead.

The Additive Electronics TechXchange examines the manufacturing and design processes enabling line width and space from .003" to 5 microns as well as other new advanced technologies intended to meet the ever-increasing challenges of smaller, lighter and more powerful electronic devices. This year the event organizers expect to dive deeper into market trends, usage and where additive fits within low, medium and high-volume production for this portion of manufacture where the electronics industry straddles the line between PCB and IC substrate.

Sponsoring companies include AGC Taconic, American Standard Circuits, Inc., Averatek Corporation, Calumet Electronics Corporation, FTG - Firan Technology Group, Insulectro, MacDermid Alpha Electronics Solutions, and SUSS MicroTec. The conference is supported by I-Connect007.

To learn more about the conference, including an audio interview with the organizers, click here.

Share

Print


Suggested Items

SMTA Europe Solder Finish Webinar Addresses Defects Causes and Cures

12/14/2020 | Pete Starkey, I-Connect007
“What is your most common PCB problem?” A survey conducted by Bob Willis had revealed finish solderability to be the predominant contender, and it was clear that the choice of solderable finish applied to surface mount boards could have a significant effect on the assembly yield and cost of the final circuit. SMTA Europe organised an informative and enlightening webinar this month entitled “Guide to PCB Solder Finishes—Process Defects Causes and Cures,” with soldering specialist Bob Willis as presenter.

Reducing Flux Splatter in Sensors and Camera Modules

10/30/2020 | Jasbir Bath, Shantanu Joshi, and Noriyoshi Uchida, Koki Solder America And Koki Company Limited
With the increased use of electronics in new technology areas, flux formulations are being developed to address the new and existing requirements. For sensors and camera modules used for Advanced Driver Assistance System (ADAS) and internet of things (IoT) applications, there is a demand for no-clean flux formulations in lead-free solder paste, which can reduce flux splattering during reflow.

How to Benefit From Robotic Soldering Processes

10/28/2020 | Pete Starkey, I-Connect007
Webinars are in vogue! But in Pete Starkey's experience, the master of the technical webinar with many years’ experience of delivering first-rate events is Bob Willis—electronics assembly specialist, soldering expert, and provider of training and consultancy in electronics manufacture. Here, Pete recaps Bob’s presentation on the upcoming robotic soldering experience.



Copyright © 2021 I-Connect007. All rights reserved.