Polyonics Issued First US Patent for ESD Coatings


Reading time ( words)

Polyonics®, a leader in high temperature and harsh environment label and tag materials, announced the issuance of their first ever US Patent for technology that improves the antistatic properties and durability of their electrostatic dissipative (ESD) coatings and label materials.

Developed by Polyonics’ coating experts, the invention, covered by US Patent No 10,689,548, will be used to design durable surface coatings and high temperature label materials that withstand harsh PCB processes while meeting all the standards for ESD applications. Label materials engineered with a highly durable top surface, low-charging label peel and a static dissipative face help eliminate at- or post-assembly product loss associated with ESD events and the additional costs due to label failure and rework.

This new technology is intended to work with their durable topcoats that meet ANSI/ESD S20.20 standards and ANSI/ ESD STM11.11 requirements for static dissipative label materials. In addition to being used where a low voltage charged and discharged energy is desired, including for printed circuit boards, electronic components and other electric charge-sensitive areas, it may be used for high temperature labels, such as those used in automotive and aeronautic applications.

Polyonics materials have remained at the forefront of PCB label technology for over 20 years through vigorous R&D programs. “This patent is just one example of our commitment to the advancement and continuous improvement of our distinctive chemistries so we can develop label materials that meet the critical functionality and durability requirements needed to withstand harsh PCB manufacturing processes,” said Jim Clemente, President and CEO of Polyonics.

Share

Print


Suggested Items

Excerpt: The Printed Circuit Assembler’s Guide to... SMT Inspection: Today, Tomorrow, and Beyond, Chapter 1

04/08/2021 | Brent Fischthal, Koh Young America
Today, optical inspection systems are the preferred solution for in-line quality control in the SMT industry. Systems such as solder paste inspection (SPI) or automated optical inspection (AOI) systems for pre- and post-reflow are almost standard in every production facility.

Real Time with...IPC APEX EXPO 2021: Optimizing Pin Inspection In Automotive With True3D Tech

03/09/2021 | Real Time with...IPC
Guest Editor Michael Ford and Gustavo Jimenez, Koh Young's sales manager for Northern Mexico, discuss some of the company's newest technologies, including True3D™ technology for pin inspection, which has proven popular with the automotive segment.

Real Time with… IPC APEX EXPO 2021: Developments in Digital Manufacturing

03/08/2021 | Real Time with...IPC
Michael Ford and Pete Starkey discuss the industry trend towards digital manufacturing, the latest in 3D CAD technology, ontological data and the benefits of the new IPC standard for digital twins.



Copyright © 2021 I-Connect007. All rights reserved.