-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Polyonics Issued First US Patent for ESD Coatings
November 4, 2020 | PolyonicsEstimated reading time: 1 minute
Polyonics®, a leader in high temperature and harsh environment label and tag materials, announced the issuance of their first ever US Patent for technology that improves the antistatic properties and durability of their electrostatic dissipative (ESD) coatings and label materials.
Developed by Polyonics’ coating experts, the invention, covered by US Patent No 10,689,548, will be used to design durable surface coatings and high temperature label materials that withstand harsh PCB processes while meeting all the standards for ESD applications. Label materials engineered with a highly durable top surface, low-charging label peel and a static dissipative face help eliminate at- or post-assembly product loss associated with ESD events and the additional costs due to label failure and rework.
This new technology is intended to work with their durable topcoats that meet ANSI/ESD S20.20 standards and ANSI/ ESD STM11.11 requirements for static dissipative label materials. In addition to being used where a low voltage charged and discharged energy is desired, including for printed circuit boards, electronic components and other electric charge-sensitive areas, it may be used for high temperature labels, such as those used in automotive and aeronautic applications.
Polyonics materials have remained at the forefront of PCB label technology for over 20 years through vigorous R&D programs. “This patent is just one example of our commitment to the advancement and continuous improvement of our distinctive chemistries so we can develop label materials that meet the critical functionality and durability requirements needed to withstand harsh PCB manufacturing processes,” said Jim Clemente, President and CEO of Polyonics.
Suggested Items
IDTechEx Explores the Role of 3D Cu-Cu Hybrid Bonding in Powering Future HPC and AI Products
04/18/2024 | PRNewswireSemiconductor packaging has evolved from traditional 1D PCB levels to cutting-edge 3D hybrid bonding at the wafer level, achieving interconnecting pitches as small as single micrometers and over 1000 GB/s bandwidth. Key parameters, including Power, Performance, Area, and Cost, are crucial considerations
Intel Brings AI-Platform Innovation to Life at the Olympic Games
04/18/2024 | BUSINESS WIREIntel announced its plans for the Olympic and Paralympic Games Paris 2024. Bringing AI Everywhere, Intel will implement artificial intelligence technology powered by Intel processors on the world’s biggest stage.
Adura Solutions Exhibits at Del Mar 2024
04/18/2024 | Adura SolutionsSumit Tomar, CEO of Adura Solutions, has announced that his company will be exhibiting at this year's Del Mar Electronics and Manufacturing Show to be held at the Del Mar Fairgrounds, San Diego, California, April 24-25.
Australian Flow Batteries and The SCHMID Group Announce Groundbreaking Memorandum of Understanding
04/17/2024 | SCHMID GroupAustralian Flow Batteries Pty Ltd (AFB), a leader in innovative energy solutions and economical, safe, and reliable power storage, and SCHMID Energy Systems GmbH a company of the German SCHMID Group, a global technology leader with a rich history in delivering innovative solutions across multiple industries including Electronics, Renewables, and Energy Storage sectors, are thrilled to announce the signing of a Memorandum of Understanding (MoU)
Ansys Joins BAE Systems’ Mission Advantage Program to Advance Digital Engineering Across US Department of Defense
04/16/2024 | ANSYSAnsys announced it is working with BAE Systems, Inc., to accelerate the adoption of digital engineering and MBSE across the Department of Defense (DoD).