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SHENMAO America, Inc. is pleased to introduce its newly developed Joint-Enhanced Flux SMEF-Z3. The new no-clean flux has been designed for fine-pitch assembly and LED die attach.
SMEF-Z3 is compatible with solder paste; the flux can be applied after solder paste printing and cured simultaneously during reflow process. The cured flux enhances solder joint reliability. It can be used for pin-transfer and stencil printing processes.
SHENMAO is unique in the research and development of solder materials in Taiwan.
With the global trend of lead-free development, SHENMAO established the Advanced Materials Development Center in Taiwan. The company cooperates with the Industrial Technology Research Institute (Taiwan), Electronics Assembly and IC-packaging manufacturers.