I-Connect007 Editor’s Choice: Five Must-Reads for the Week


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Another active news week in the electronics industry! February is launching with a high-G burn, to be sure. And if you’re a fan of The Expanse, like I am, then you’ve probably already watched through to the Season 5 finale; this means you have attention to spare for industry news all of a sudden. And if you haven’t reached the current end of the line for The Expanse, then today’s list is just what you need while you catch up.

This week, the five news Items you simply need to read include details about IPC APEX EXPO, and EMS market news from IPC as well. We also have new loss modeling software, AS9100 compliance news, and a stackup discussion. IPC APEX EXPO 2021 is fast approaching; don’t forget to preview the new virtual program with the February issue of SMT007 Magazine, available now.

IPC APEX EXPO 2021 Offers More than 100 Future-focused Educational Opportunities  
Published February 1

Changing technologies, advanced materials and the driving force of new processes will take center stage throughout the IPC APEX EXPO 2021 technical conference and professional development sessions, which will take place virtually March 8-12. Dr. John Mitchell, IPC president, points out a unique benefit to this year’s format, “Even if you can’t see some sessions live—you have 90 days to catch up on what you missed. Now for the first time, you can see and experience all of the content you might have missed in the past!” 

Wild River ISI-56 Platform Accelerates SerDes Testing 
Published February 2

Al Neves, founder and CTO of Wild River Technology, updates Andy Shaughnessy on the release of their new ISI-56 loss modeling platform. Al explains why it was so critical that this tool meets the stringent requirements of the IEEE P370 specification (which he helped develop), and why he believes this is currently the best tool for SerDes testing and characterization. 

North American EMS Industry Sales up 8.5% in December 
Published January 29

IPC announced the December 2020 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. Spoiler alert: the book-to-bill ratio stands at 1.10. Read the rest of the article for more detail. 

Seven Tips for Your Next Stackup Design 
Published February 1

As Eric Bogatin shares, “rarely do we have the luxury of designing a board just for connectivity. When interconnects are not transparent, we must engineer them to reduce the noise they can generate. This is where design for signal integrity, power integrity and EMC—collectively high-speed digital engineering—are so important.” 

Ventec UK Continues to Maintain Highest AS9100 D Quality Compliance 
Published February 1

Ventec International Group Co., Ltd. is pleased to announce that the company’s European headquarters in Leamington Spa, UK, continues to maintain the highest AS9100 Revision D compliance in accordance with the Aerospace Supplier Quality System Certification Scheme following successful completion of its surveillance audit.

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I-Connect007 Editor’s Choice: Five Must-Reads for the Week

03/26/2021 | Andy Shaughnessy, Design007 Magazine
This week, we have a round-up of stories from around the industry, including a Real Time with… IPC APEX EXPO interview with Ventec, an article by Tamara Jovanovic about eliminating “garbage in, garbage out,” a review of an EIPC webinar by Pete Starkey, and news about another trade show going virtual this summer. And last but certainly not least, we bring you our one-minute video salute to all the fantastic people in this industry who we’ve worked with for decades. Enjoy!

Bonding Hybrid Multilayer Constructions at Rogers Corporation

03/10/2021 | Real Time with...IPC
John Ekis, Rogers Corporation's market segment director for aerospace and defense, discusses the SpeedWave family of low-dielectric constant, ultra-low-loss prepreg materials with excellent filling and bonding characteristics for hybrid multilayer constructions. SpeedWave prepreg is also compatible with FR-4 fabrication processes and lead-free PCB assembly processing. SpeedWave is available in multiple spread and open weave glass style and resin content combinations, and is also compatible with FR-4 fabrication processes and lead-free PCB assembly processing.

Focus on Smart Processes, Not Just Smart Factories

03/02/2021 | Nolan Johnson, PCB007
Nolan Johnson talks to Audra Thurston, Todd Brassard, and Meredith LaBeau about how Calumet is focusing on smart processes, and not as much on smart factories. While modern manufacturing equipment and next-gen technologies can be impressive, so much innovation still hinges on human beings. Calumet believes by investing in their workforce and instilling a culture of innovation throughout their company and supply chain, they’ll see faster advancement.



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