10 Ways to Identify Counterfeit ICs


Reading time ( words)

In my monthly column, I’ve expressed concern about the likelihood of increased counterfeiting as a knock-on effect of the chip shortage. Because the incentives for counterfeiters are high right now, as an industry we must be somewhat more vigilant in maintaining our best practices for preventing fake parts from corrupting the supply chain and our products. 

Under normal circumstances the cost associated with counterfeit electronic components exceeds $5 billion annually. The pressures of the current chip shortage will likely push those losses even higher for as long as the supply remains tight. Still, we all can agree that, if fake parts were to enter your inventory or end up in your products, while the reputational damage to your business will likely be significant, it can also be tough to quantify. Even harder yet would be assigning cost should counterfeit components in critical applications contribute to injury or loss of life.  

So, how about a little refresher on some of the most effective techniques for component inspection using X-ray? While other visual inspection techniques provide important insight into component quality and authenticity, nothing exceeds X-ray inspection for fast, accurate, non-destructive evaluation. The following are 10 ways to identify a fake IC using X-ray. 

To read this entire article, which appeared in the March 2021 issue of SMT007 Magazine, click here.

Share

Print


Suggested Items

Excerpt—The Printed Circuit Assembler’s Guide to... SMT Inspection: Today, Tomorrow, and Beyond, Chapter 3

04/22/2021 | Brent Fischthal, Koh Young America
Initiatives like the IPC Connected Factory Exchange (CFX) and IPC-Hermes-9852 underpin efforts within the industry to develop standards and help create a smart factory. These M2M communication standards, guided in part by Industry 4.0, are altering the manufacturing process by improving metrics such as first pass yield and throughput by applying autonomous process adjustments.

Overcoming Component Selection and Sourcing Challenges

04/14/2021 | John R. Watson, Altium
Most PCB designers know precisely how Captain James T. Kirk felt because we often feel the same way when starting a new design. We are launching into something that we ultimately don't know how it will turn out. We don't know the difficulties we'll face or problems we’ll need to fix. While we can control the design process and use our skills to make reasonable decisions, there are often huge hazards awaiting us in the "unknown." One worsening problem for all designers is component procurement.

Excerpt: The Printed Circuit Assembler’s Guide to... SMT Inspection: Today, Tomorrow, and Beyond, Chapter 1

04/08/2021 | Brent Fischthal, Koh Young America
Today, optical inspection systems are the preferred solution for in-line quality control in the SMT industry. Systems such as solder paste inspection (SPI) or automated optical inspection (AOI) systems for pre- and post-reflow are almost standard in every production facility.



Copyright © 2021 I-Connect007. All rights reserved.