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The IWLPC Technical Committee is pleased to announce the Best Papers in WLP, 3D, Advanced Manufacturing and Test tracks as chosen by the technical committee. Papers were evaluated based on technical merit, relevance, originality, knowledge of subject, quality of material, and quality of presentation.
The Best 3D Track Paper was awarded to Max Min, Ph.D., Samsung Foundry, for “Accelerating Innovations in the New Era of HPC, 5G and Networking with Advanced 3D Packaging Technologies.”
The Best Wafer-Level Packaging (WLP) Track Paper went to Jae-Gwon Jang, Samsung, for "Advanced RDL Interposer PKG Technology for Heterogeneous Integration."
The Best Advanced Manufacturing and Test (AMT) Track Paper was awarded to Bryan Kasprowicz, Photronics, for the paper "Defect Printability for 2/2 RDL and the Impact of Advanced Reticle Processes.”