Indium Corporation’s Dr. Lasky Offers SMT IQ Test


Reading time ( words)

Indium Corporation’s Dr. Ron Lasky, Senior Technologist, has created a new SMT IQ Test for new or veteran industry professionals looking for a fun way to measure their surface mount technology (SMT) knowledge.

The free test, which features 10 multiple-choice questions, can be accessed on Dr. Lasky’s blog and Indium Corporation’s LinkedIn account. Based on the number of correct results, respondents will be ranked from SMT Trainee (three correct answers or fewer) all the way up to SMT Guru (for those who achieve a perfect score).

Five lucky participants will be randomly selected to win a $25 digital gift card. Respondents will have to provide their email address when completing the survey in order to be eligible.

Dr. Lasky is a Senior Technologist at Indium Corporation, as well as a Professor of Engineering and the Director of the Lean Six Sigma program at Dartmouth College. He has more than 30 years of experience in electronics and optoelectronics packaging at IBM, Universal Instruments, and Cookson Electronics. Dr. Lasky has authored six books, and contributed to nine more, on science, electronics, and optoelectronics, and has authored numerous technical papers. Additionally, he has served as an adjunct professor at several colleges, teaching more than 20 different courses on topics ranging from electronics packaging, materials science, physics, mechanical engineering and science, and religion. Dr. Lasky holds numerous patent disclosures and is the developer of several SMT processing software products relating to cost estimating, line balancing, and process optimization. He is the co-creator of engineering certification exams that set standards in the electronics assembly industry worldwide. Dr. Lasky was awarded the Surface Mount Technology Association’s Founder’s Award in 2003. Dr. Lasky holds four degrees, including a Ph.D. from Cornell University in materials science, and is a licensed professional engineer.

Share

Print


Suggested Items

The Test Connection Focusing on Services

03/22/2021 | Real Time with...IPC
Bert Horner, president of The Test Connection, explains why he highlighted the company's test services during IPC APEX EXPO. He also discusses some of the lessons the company learned during the pandemic.

EIPC Technical Snapshot: Cleanliness

03/01/2021 | Pete Starkey, I-Connect007
John Ling’s invitation to the fifth in EIPC’s series of Technical Snapshots was as droll as we have come to expect: “In these confined days of lockdown, and exhortations to stay at home and only go out for exercise, this only exercises the natural inclination to hop on a ‘plane to some sunshine.’ Although not the same as Factor 20, one of our webinars gives a high degree of protection from harmful ignorance, and you do not have to go out in the cold.”

Chapter 1 Excerpt: The Printed Circuit Assembler’s Guide to Process Validation

12/31/2020 | Graham Naisbitt, Gen3 Systems
The original principle underlying the IPC’s ionic cleanliness requirement was that the mobility of surface ions, detectable from SIR measurements, would correlate to a maximum value of detectable ionic elements permissible on the circuit surface. The industry required a test that was both fast and accurate for process control. Thus, a simplified ion chromatograph that was able to detect ionic elements without differentiation was created.



Copyright © 2021 I-Connect007. All rights reserved.