Indium Corporation Introduces New Ball-Attach Flux


Reading time ( words)

Indium Corporation continues to expand its flux portfolio with WS-823—a proven, one-step ball grid array (BGA) ball-attach flux designed to eliminate the costly and warpage-inducing prefluxing step, especially on Cu-OSP substrate.

SA-Dip%20flux.jpgWhile the standard ball-attach process requires two steps, especially on a Cu-OSP substrate, WS-823 is a halogen-free, water-wash flux designed for a single-step ball-attach process that eliminates the prefluxing step in order to create reliable ball-to-pad joints. 

WS-823 provides:

  • Tackiness suitable for holding solder spheres in place during reflow
  • Excellent solderability on a wide range of surfaces, including AuNi and oxidized Cu-OSP
  • Uniform pin transfer over extended periods, eliminating changes in joint quality over time and uneven deposit sizes, which can lead to “missing ball”
  • A formula engineered for low-voiding, thereby increasing joint strength
  • Good cleanability with room temperature DI water, avoiding the formation of white residue

Share

Print


Suggested Items

Catching Up With Nova Engineering

04/27/2021 | Dan Beaulieu, D.B. Management Group
When searching for companies to interview, I always look for something unique and that makes the company special. Truth be told, I am a collector of stories about good, well-run, unique companies that we can learn something from. Nova Engineering is one of those companies.

KIC Adds Wave Process Inspection to Product Line

03/30/2021 | Real Time with...IPC
Miles Moreau, general manager for EMEA, Americas & Australia at KIC, shares some details on the new Wave Process Inspection (WPI) solution that KIC is currently rolling out. This solution brings real-time process control capabilities to wave soldering equipment, adding and extending capabilities.

NovaCentrix Expands Solder Capabilities

03/19/2021 | Real Time with...IPC
Stan Farnsworth of NovaCentrix discusses how the company has expanded into electronics manufacturing in the past year with its photonic curing and soldering tools.



Copyright © 2021 I-Connect007. All rights reserved.