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IEC Mourns the Passing of Board Member Michael W. Osborne
July 1, 2021 | IEC Electronics Corp.Estimated reading time: Less than a minute
IEC Electronics Corp. deeply regrets to announce that Michael W. Osborne, a respected member of the Company’s Board of Directors, has died. No decision has been made at this time regarding the composition of the Board of Directors moving forward.
Jeffrey T. Schlarbaum, President and CEO of IEC Electronics Corp. commented, “The entire IEC family mourns this loss. On behalf of the Board of Directors, management team and employees, we extend our deepest condolences to Mike’s family. Mike provided exceptional guidance to IEC during his time on our Board, providing his industry and financial expertise to improve our Company. Even more importantly, in addition to his thoughtful insight and sharply strategic reasoning, he also contributed humor and a common sense approach to many Board discussions, and he will be greatly missed.”
Suggested Items
Aaron Woolf, Dylan Peterson Join SIA Team
04/22/2024 | SIAThe Semiconductor Industry Association (SIA) announced Aaron Woolf and Dylan Peterson have joined the SIA team. Woolf will serve as director of global policy for economic security and Peterson will be a communications associate. SIA represents 99% of the U.S. semiconductor industry by revenue and nearly two-thirds of non-U.S. chip firms.
Fineline Global Group Acquires IBR
04/19/2024 | PRNewswireIBR Leiterplatten GmbH & Co. KG joins the Fineline Global Group and is now an integral part of one of the leading suppliers of PCBs. Fine Line Gesellschaft für Leiterplattentechnik mbH acquired 100% shares of IBR.
Cicor Shareholders Approve All Proposals
04/19/2024 | Cicor Technologies Ltd.At the Annual General Meeting of Cicor Technologies Ltd. in Zurich, the shareholders approved all proposals.
IMAPS & IPC to Host Onshoring Workshop
04/16/2024 | IPCThe International Microelectronics Assembly and Packaging Society (IMAPS) and IPC will host an Onshoring Workshop to discuss ongoing progress and forward-looking strategies to drive the Onshoring Advanced Packaging and Assembly, April 29 – May 1, 2024, in Arlington, Virginia.
Argonne, RIKEN Sign a Memorandum of Understanding in Support of AI for Science
04/16/2024 | BUSINESS WIRELeaders in high performance computing in the U.S. and Japan have signed a memorandum of understanding (MOU) establishing a cooperative relationship in support of artificial intelligence (AI) computing projects.