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Heraeus Electronics celebrates the first anniversary of its Center of Excellence for Advanced Packaging in Singapore. Equipped with state-of-the-art technologies and housing a 10k climate-controlled cleanroom, it offers innovative metrologies delivering in-depth data and analysis to provide materials solutions to customers for advanced packaging and system-in-package applications.
The Center of Excellence is home for both innovation and applications teams ever since its inauguration in April 2020. “We intentionally selected Singapore as it offers an excellent pool of scientists and engineers,” says Dr. Michael Joerger, Heraeus Electronics Executive Vice President and Global Head of Innovation. “The team is dedicated to capture megatrends in 5G communication, IoT (Internet of Things), and AI (Artificial Intelligence) which depend heavily on the miniaturization of semiconductor electronics systems. These demand advanced packaging applications we are keen to enable by offering materials and applications solutions to our customers.”
Customers strongly benefit from the Center of Excellence’s full range of capabilities, its close proximity to customers and markets, and its expertise and services for packaging solutions, resulting in shorter time to market, greater responsiveness, reduced R&D costs, and optimized performance. The Center of Excellence is considered a one-stop-shop to efficiently provide relief to customers’ development processes. In the past year, it has helped customers improve voiding performance and enabled all-in-one printing for a variety of SiP designs.
Located in the western part of Singapore, it compliments Heraeus Electronics application centers based in Germany, China, the United States.