I-Connect007 Editor’s Choice: Five Must-Reads for the Week


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We’re driving headlong into 2022, and there’s a lot going on in the world of PCB design, fabrication, and assembly. It’s trade show season now. IPC APEX EXPO starts in less than two weeks, and we’re all getting ready for what is, for many, the first trade show in years. Do you know where you put your business cards after your last show in 2020? I keep half a box of biz cards in my glove compartment; I’m not going to make that mistake again.

Trade shows are well represented in this week’s Top Five, along with news about a new Isola eBook on advanced materials and an article on the Factory of the Future. I imagine you’ll find more information about high-performance materials and the Smart Factory at IPC APEX EXPO.

I hope to see you all in San Diego, but if you can’t make it, check in with I-Connect007 throughout the week for the latest show updates.

New Book From Isola Highlights Importance of Material Selection
Published January 13

The latest I-007eBook, The Printed Circuit Designer’s Guide to... High Performance Materials, authored by Isola’s Michael Gay, provides PCB designers and design engineers with guidelines for selecting the proper advanced material for each application. This free eBook can help you weave your way through the maze of available high-performance materials available now.

CES 2022: Half Virtual, Still Valuable, and Here’s Why
Published January 13

Consumer Editor Dan Feinberg has been covering the changing technology at CES for over a decade. But this year, Dan is covering the show virtually, and apparently, about half of the usual attendees also decided to log into the show instead of traveling to Las Vegas. Still, as Dan explains in this post-show review, there was plenty of innovation on display at this year’s CES.

AltiumLive 2022 CONNECT Announces European Summit Dates
Published January 13

Altium has announced the dates for its European AltiumLive event, February 2-4, 2022. Taking place one week after its U.S. counterpart, the European Summit will also be a virtual affair, with tracks including Design Principles and Practices; Simulation, Test & Measurement; Supply Chain; Manufacturing, and classes devoted to Altium tools. Registration for the European AltiumLive is open now.

Making the Most of a Smart Factory Initiative
Published January 11

In this conversation from the January issue of SMT007 Magazine, Editor Nolan Johnson speaks with Koh Young’s Joel Scutchfield about the company’s focus on the Smart Factory Initiative. They also discuss trends in the global market, including artificial intelligence, predictive maintenance, and data analytics. 

Happy Holden’s Five Must-Reads of 2021
Published January 10

As we entered 2022, we asked Happy Holden to review the articles that we published last year and pick his Top Five. Always up for a challenge, Happy went through our 2021 offerings and named his five favorites, along with his criteria for selecting them. We hope you enjoy this insight into the kind of articles that Happy finds interesting.

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Suggested Items

Material Application for Mini Backlight Unit

04/12/2022 | Aaron Chen, Wazam New Material Co. Ltd.
In 1980, about 90% of the materials used to make PCBs was FR-4. As time went by, technology developed, and electronic devices relentlessly integrated into every area of our lives. The constant acceleration of upgrading meant endless challenges and opportunities for CCL suppliers. Wazam New Material Co. Ltd. is a CCL supplier that strives to be attentive to the needs of its end customers and provide comprehensive solutions. One example is the mini backlight unity (MBLU) application material.

Engineering RF Dielectric Material to Enable 5G/6G Antenna Devices

04/11/2022 | Chudy Roosevelt Nwachukwu, ITEQ Corporation
Accurate characterization of frequency-dependent inhomogeneous dielectric material properties is key to the optimal design of high performance and cost-effective PCB antennas. These antennas will be required to enable the plethora of devices forecasted for 5G/6G communication. Therefore IT-88GMW, an advanced resin system reinforced with tightly woven thin glass fibers has been formulated to improve the Q-factor of interconnects and passive components fabricated on PCB laminates.

Improved Thermal Interface Materials For Cooling High-Power Electronics

03/31/2022 | Jeff Brandman, Aismalibar North America
Heat has been a significant concern in electronics since the beginning of the electronics age when hot glowing vacuum tubes were first used to receive and transmit data bits. The transistor and integrated circuit effectively solved that basic problem, but increases in integration resulted in increased concentration of heat, exacerbated by relentless increases in operating frequency. While improvements in electronics technology have been able to mitigate many thermal issues at chip level thanks to improved semiconductor designs devised to operate at lower voltages (thus requiring less energy) the thermal management challenge continues to vex electronic product developers.



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