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CyberOptics Corporation, a leading global developer and manufacturer of high-precision 3D sensing technology solutions will unveil the new Dual-Mode MRS sensor for the SE3000 SPI system in Booth #2541 at the 2022 IPC APEX EXPO, Jan. 25-27, 2022 at the San Diego Convention Center in California. The company will also demonstrate the SQ3000 Multi-Function system for AOI, SPI and CMM and feature the new SQ3000+ Multi-Function system for advanced applications.
The new Dual-Mode MRS sensor for the SE3000 SPI system provides maximum flexibility for dedicated solder paste inspection applications, with one mode for high speed inspection and another mode for high resolution inspection. The new sensor is an extension of the proprietary Multi-Reflection Suppression sensor portfolio that provides industry-leading performance in semiconductor and SMT markets. The SE3000 is ideal for measuring height, area, volume, registration and bridging, as well as detecting insufficient paste, excess height, smear, offset and more.
“We designed the Dual-Mode MRS sensor specifically for our SE3000 system to provide both superior performance and versatility for SPI,” said Dr. Subodh Kulkarni, President and CEO, CyberOptics, “We’re providing yet another solution that can significantly improve our customers’ yields, processes and productivity.”
At APEX, the company will also feature the SQ3000™+ Multi-Function system for inspection and metrology, an extension of the multi-award-winning SQ3000 platform deemed best-in-class, that not only conducts AOI and SPI, but uniquely delivers in-line, full coordinate measurement (CMM) data in seconds, not hours. The all-in-one system offers a combination of unmatched high accuracy and high speed, with an even higher resolution MRS sensor that inhibits reflection-based distortions caused by shiny components and surfaces.
The SQ3000+ is specifically designed for high-end applications including advanced packaging, mini-LED, advanced SMT for medical, military, aerospace and advanced electronics, 008004/0201 SPI, socket metrology and other challenging CMM applications.