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The early bird deadline for registration to this year's SMTA International Technical Conference is on August 28.
Key highlights for this year include a keynote by Yole Developpement CTO Rozalia Beica, who will talk about 3D technology trends and manufacturing challenges; a special feature area that will include live printing ultra-fine pitch deposits, 0201 and 01005 devices; and a "Robotics Alley" in the exhibition hall, which will offer a glimpse into the amazing advances that are occurring in robotics, sensors and advanced manufacturing.
SMTAI 2015's conference will run from September 27 to October 1, while the exhibition will be from September 29 to 30. The event will be held at Donald E. Stevens Convention Center in Rosemont, Illinois.
For more information or to register, click here.
Nolan Johnson, I-Connect007
Dr. Tom Rucker is vice president in technology development at Intel and was a keynote speaker at the IPC Advanced Packaging Symposium, which helped set the table for the rest of the agenda. Tom understands this “radical and seismic” shift in terms of technology and breaks down what it means for the semiconductor and PCB fab industries. There’s absolutely a place at the table for PCB fabricators, but what are the first steps?
I-Connect007 Editorial Team
We asked you to send in your questions for Happy Holden, Joe Fjelstad, Eric Camden, John Mitchell, and Greg Smith in our “Just Ask” series. Now, MacDermid Alpha Electronics Solutions’ Paul Salerno gets a chance to answer a question. Paul Salerno is a global portfolio manager for SMT applications focused on the automotive and consumer market segments. He holds a bachelor’s degree in materials engineering as well as an MBA in finance and marketing from Rutgers University.