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Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry has unveiled a new generation 3D AOI solutions, setting the performance standard for 3D PCBA inspection. The new TR7700Q/TR7700QI systems are geared toward mainstream productions, easily handling both high volume and high mix manufacturing. Visit us at NEPCON Japan, ELECTROTEST booth E17-20 in Tokyo Big Sight from January 13-15, 2016 for a personal demo of the your next 3D inspection system.
The new mid-range TR7700Q series stop-and-go 3D AOI solution offers future-proof configurations for inspecting both large automotive components and mobile and PC applications including smallest 0250125mm/008004in chips used in wearables. TRI's engineers have eliminated compressed air from the automated intelligent conveyor (IACS), increasing system reliability, and lowering downtime, installation and maintenance costs.
TRI's redesigned 3D inspection system brings adaptive height resolution to optimize inspection accuracy based on the PCBA type. Using 8 programmable Digital Fringe Projections, the TR7700Q series readily finds solder shape and volume defects, coplanarity issues, lifted pins and chip position defects.
Discover how TRI’s new 3D AOI can improve your inspection capability and maximize inspection value in the production line. The latest intelligent programming software is designed to interoperate with other manufacturing equipment to minimize down times, optimize production quality and reduce operator work load. Visit us at NEPCON.
TRI offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. From Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), and 3D Automated X-ray Inspection (AXI) systems to Manufacturing Defect Analyzers (MDAs) and In-Circuit Test equipment, TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements.