Palo Alto Networks, Flextronics Ink Amended Manufacturing Services Agreement

Reading time ( words)

Palo Alto Networks Inc. and Flextronics Telecom Systems Ltd entered into an Amended and Restated Flextronics Manufacturing Services Agreement that replaces in its entirety the existing Flextronics Manufacturing Services Agreement dated September 20, 2010 between the company and Flextronics.

Pursuant to the agreement, Flextronics will continue to manufacture and assemble Palo Alto Networks' products using design specifications, quality assurance and related service programs, and standards that the company establishes, and procure components and assemble the company's products based on the company's demand forecasts.

The agreement has an initial term of three years, which is automatically renewed for one-year terms, unless terminated by either party.



Suggested Items

3D Printing and Additive Manufacturing in PCBA

05/28/2018 | Zohair Mehkri, David Geiger, Anwar Mohammed, and Murad Kurwa, Flex
There are several materials that are available for 3D printing for various engineering uses. Various vendors offer over hundreds of different materials that are either specific to an application or to a specific desired characteristic. For this study, eight materials that are regularly used for engineering applications were evaluated and characterized to determine which can be used in PCB processes.

Case Study: Flex Smart Factory at Fuyong

08/24/2016 | Jeff Li, et al.*, Flex
This paper discusses Flex's experience with their current project called Smart Factory, which is being implemented at their Fuyong facility in Shenzhen, China. It also highlights some of the benefits they have achieved, including traceability, improved productivity and quality, and minimized defects through process predictability.

Overview Miniaturization on Large Form Factor PCBA

02/24/2016 | D. Geiger, A. Mohammed, M. Kurwa, AEG, Flextronics International Inc.
Many of the miniaturization technologies were developed for the consumer market, targeted mainly at the smart phone. Many designers in other areas such as medical and telecom are looking at ways to miniaturize the product or increase the functional density. This article explores some of the common miniaturization technologies and their application to larger form factor boards.

Copyright © 2021 I-Connect007. All rights reserved.