2015's Most Read SMT Interviews


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Zentech’s John Vaughan on the Mil/Aero Sector: “It’s Headed Up”

I-Connect007 Publisher Barry Matties and Zentech’s John Vaughan had a chance to discuss industry concerns within the mil/aero segment at IPC APEX EXPO 2015. The two also shared thoughts on the space industry.

Ready to Hire! Blackfox Provides IPC Class 3 Training to Veterans

Read this interview with Al Dill, president and CEO of Blackfox Training Institute, for an in-depth discussion on Blackfox’s expansion plans for North America and Malaysia. Dill also describes the highly successful veteran’s training program in Longmont, Colorado.

California Congressman Mike Honda Discusses American Manufacturing

Barry Matties, Publisher of I-Connect007, sat down with Congressman Honda, who represents District 17 in the Silicon Valley, and talked with him about American manufacturing, infrastructure, education and some of the current thinking in America.

A Conversation (and Day) with Joe Fjelstad

Industry veteran Joe Fjelstad, CEO and founder of Verdant Electronics, met up with Barry Matties recently to spend a day together enjoying their conversation that ebbed and flowed between a wide variety of topics including the “war against failure.”

American Standard Circuits’ Unique Offerings Contribute to Long-term Success

At the recent IMS RF and microwave show in Arizona, Anaya Vardya, CEO of American Standard Circuits discussed the current market trends, the company’s recent equipment investments, and where ASC’s growth will likely come from.

BGA or CGA: When Is It Right for You?

This interview with TopLine president and founder Martin Hart focuses on column grid array (CGA) and how CGA can solve delamination problems. CGAs, also known as CCGA, are not necessarily new but are making a strong comeback in the high reliability market.

A Look at the High-Reliability Interconnect Market

In an interview with I-Connect007, Mark Cormier of Miraco Inc. discusses his company’s activities and capabilities, the latest trends and drivers in the high-reliability segment, and their strategies when it comes to managing their assembly work as well as their audit processes to find EMS providers.

Solder Jet Printing: Is It the Right Time?

Publisher Barry Matties gets an update from Nico Coenen, sales director for Mycronic, on their solder jet printing system. Mycronic has been developing and pioneering this technology for 10 years and they believe now is the time for it to gain real traction.

A Look at Saki’s Approach to 2D, 3D and X-ray Technology

At NEPCON 2015 we sat down with Nori Koike, COO of Saki of Japan, to discuss the latest demands for 3D and their approach to inspection. Saki has built a line-up of tools that covers the inspection spectrum.

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Catching Up With Nova Engineering

04/27/2021 | Dan Beaulieu, D.B. Management Group
When searching for companies to interview, I always look for something unique and that makes the company special. Truth be told, I am a collector of stories about good, well-run, unique companies that we can learn something from. Nova Engineering is one of those companies.

Hans-Peter Tranitz: Dieter Bergman IPC Fellowship Award Recipient

04/22/2021 | Patty Goldman, I-Connect007
In this wide-ranging interview, Patty Goldman speaks with Continental Automotive’s Peter Tranitz about his IPC involvement with press-fit and other automotive standards which have earned him the coveted Dieter Bergman IPC Fellowship Award.

Excerpt—The Printed Circuit Assembler’s Guide to... SMT Inspection: Today, Tomorrow, and Beyond, Chapter 3

04/22/2021 | Brent Fischthal, Koh Young America
Initiatives like the IPC Connected Factory Exchange (CFX) and IPC-Hermes-9852 underpin efforts within the industry to develop standards and help create a smart factory. These M2M communication standards, guided in part by Industry 4.0, are altering the manufacturing process by improving metrics such as first pass yield and throughput by applying autonomous process adjustments.



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