Former IPC President’s Award Recipient Mark A. Savrin Passed Away

Reading time ( words)

It is with great regret that we report the passing of Mark A. Savrin of Philadelphia on December 6. Mark was a chemical engineer with RCA for many years and active on several committees in IPC. He held Master’s degrees from both Temple and Drexel Universities. He was a recipient of the IPC President’s Award in 1974 and served as chairman of IPC’s Technical Activities Executive Committee (TAEC) for the 1976–1978 term. He is survived by his beloved wife Pat, daughter Fern and son Kerry, and three grandchildren, as well as two brothers. Contributions in his memory may be made to Congregations of Shaare Shamayim, 9768 Verree Rd., Phila., PA 19115 or a charity of the donor's choice.



Suggested Items

Technical Conference—Balancing Conventional and Disruptive Technologies

04/08/2021 | Matt Kelly, IPC
I thought the three keynotes given by IPC President and CEO John Mitchell, Industry Week Editor-in-Chief Travis Hessman, and IPC Chief Economist Shawn DuBravac, were spot on. They all spoke to the fact that the way products are conceived, designed, manufactured, and used is changing rapidly. While the keynotes had different focus areas, I noted an important similarity—they all underscored the need for increased industry collaboration to help bring the factory and supply chain of the future to life.

Growing Opportunities with 3D Printed Electronics

05/22/2019 | Barry Matties, I-Connect007
Dr. Kurt Christenson, senior scientist at Optomec, discusses the company’s Aerosol Jet technology, which eliminates the need for wire bonding by printing interconnects on 3D surfaces. Christenson also explores the current state of the technology and highlights the market segments and applications with the most to benefit from being able 3D print electronic components, such as resistors, capacitors, antennas, and transistors.

Creating Smart Surfaces with Electronic Functionality

05/06/2019 | Pete Starkey, I-Connect007
Of all of the technical user presentations I attended at the AltiumLive design summit in Munich, the one I found most fascinating introduced an innovative technology that encouraged a bit of lateral thinking and appealed to my creative side: the IMSE, or injection-moulded structural electronics.

Copyright © 2021 I-Connect007. All rights reserved.