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The year 2015 saw many technology milestones reached and challenges overcome as R&D became more cutting edge. From high-performance sensors to 3D printing, automotive electronics, wearables, virtual reality and robotics, innovations abound in all technology sectors, helping improve almost every facet of our lives. Last month's CES 2016 exhibition showcased these latest and emerging technologies, and provided a glimpse of how the future will look.
In its recent whitepaper, market analyst IHS listed key technology segments to watch out for this year, which it expects will bring the global technology industry to even greater heights in 2016. Among these sectors are thinner, lighter and more flexible displays; ultrasonic sensors; data mining and predictive analytics; medical technology; connected home; automotive intelligence; and solar power.
While all of these developments bode well for the electronics manufacturing industry, they also offer many challenges in terms of the way they are being manufactured. The trend toward smaller, lighter, faster, lower-power and cheaper devices continues to put a strain on equipment and production processes, and remains top priority for electronics designers and manufacturers.
This leads me to this issue of SMT Magazine, which features "what's new" in the electronics manufacturing and assembly industry from a business and technology standpoint.
Editor's Note: This article originally appeared in the February 2016 issue of SMT Magazine.