IPC Standards Committee Reports, Part 2 – Assembly and Joining, Component Traceability, Flexible Circuits, High Speed/High Frequency


Reading time ( words)

Component Traceability

The 2-19a Critical Components Traceability Task Group worked through comments submitted to the working draft of IPC-1782, Standard for Traceability of Critical Items Based on Risk. Once the comments have been resolved, the task group will distribute IPC-1782 for Final Draft for Industry Review in early summer, with a goal to ballot the document for publication in late summer. This standard will establish minimum requirements for traceability of PCB assembly parts and processes throughout the entire supply chain, with particular initial emphasis on component traceability.

Flexible Circuits

The D-11 Flexible Circuits Design Subcommittee met to resolve comments to the Final Draft for Industry Review of IPC-2223D, Sectional Design Standard for Flexible Printed Boards. Comments addressed flexible cross-sectional construction examples and factors that affect impedance and capacitance control for flex and rigid-flex printed board applications. The document will be balloted for a targeted Q3 2016 release.

The D-12 Flexible Circuits Performance Subcommittee met to advance the Working Draft to IPC-6013D, Qualification and Performance Specification for Flexible Printed Boards. The group addressed issues involving bends, folds, wrinkles and creases in cover film materials and also reviewed criteria for plated microvia structures.

High Speed/High Frequency

The D-22 High Speed/High Frequency Performance Subcommittee met to resolve negative votes to IPC-6018C, Qualification and Performance Specification for High Frequency (Microwave) Printed Boards.  The group also began the review of comments to the Final Draft for Industry review of the corresponding IPC-6018CS Space and Military Avionics Applications Addendum. Both documents are targeted for a Q3 2016 release.

The D-24a TDR Test Methods Task Group met to review data from the Gage R&R Validation Program for the forthcoming “B” Revision to IPC-TM-650, Method 2.5.5.7, Characteristic Impedance of Lines on Printed Boards by TDR, ahead of its submission to the IPC 7-11 Test Methods Subcommittee for approval and release.

The D-24b Bereskin Test Methods Task Group met to prepare the official project request (IPC TAEC PIN) addressing the Bereskin stripline resonator test method that lends itself to the test and measurement of Dk and Df of thin dielectric materials up to 20 GHz. A 1st Working Draft of the new method will be provided for review and comment in May 2016.

The D-24c High Frequency Test Methods Task Group meet to review data from five participating companies in a round robin test program that will assess the state-of-the-art of test material provides and testing labs in the measurement of dielectric properties of materials at frequencies above 10 GHz. A variety of test methods are being utilized based on current practices utilized in commerce.

Share

Print


Suggested Items

Catching Up With Nova Engineering

04/27/2021 | Dan Beaulieu, D.B. Management Group
When searching for companies to interview, I always look for something unique and that makes the company special. Truth be told, I am a collector of stories about good, well-run, unique companies that we can learn something from. Nova Engineering is one of those companies.

Hans-Peter Tranitz: Dieter Bergman IPC Fellowship Award Recipient

04/22/2021 | Patty Goldman, I-Connect007
In this wide-ranging interview, Patty Goldman speaks with Continental Automotive’s Peter Tranitz about his IPC involvement with press-fit and other automotive standards which have earned him the coveted Dieter Bergman IPC Fellowship Award.

Excerpt—The Printed Circuit Assembler’s Guide to... SMT Inspection: Today, Tomorrow, and Beyond, Chapter 3

04/22/2021 | Brent Fischthal, Koh Young America
Initiatives like the IPC Connected Factory Exchange (CFX) and IPC-Hermes-9852 underpin efforts within the industry to develop standards and help create a smart factory. These M2M communication standards, guided in part by Industry 4.0, are altering the manufacturing process by improving metrics such as first pass yield and throughput by applying autonomous process adjustments.



Copyright © 2021 I-Connect007. All rights reserved.