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Shenmao America Intros BGA and Micro BGA Bumping Solder Paste as SEMICON West 2016
July 7, 2016 | SHENMAO America Inc.Estimated reading time: Less than a minute
Shenmao America Inc. will showcase its bumping solder paste PF608-PI-21 (Sn/Ag4.0/Cu0.5/x) and PF606-P-BS1 (Sn/Ag3.0/Cu0.5/x) at the SEMICON West 2016 event happening from July 12–14 in San Francisco, California.
The PF608-PI-21 and PF606-P-BS1 aim to decrease voids in wafer bumping process. Shenmao Micro Material Institute applications engineers focused on developing the bumping solder paste formula with excellent stencil printing transfer rate and the lowest void to optimize manufacturing process performance.
The world’s largest IC packaging and test service OSAT utilizes Shenmao Bumping Solder Paste in production.
Suggested Items
SHENMAO America to Exhibit at MEPTEC
10/25/2016 | SHENMAO America Inc.SHENMAO America Inc. will be showcasing its semiconductor packaging materials at the upcoming MEPTEC Semiconductor Packaging Roadmap Symposium, which will be held on November 14, 2016 at the Holiday Inn Silicon Valley San Jose in California.
A New Dispensing Solder Paste for Laser Soldering Technology
07/20/2016 | Watson Tseng, et al., Shenmao America Inc.A new solder paste of alloy composition of Sn-3.0Ag-0.5Cu in a dispensing way is developed for the automatic laser soldering processes. This paper presents the results of soldering BGA spheres on circuit boards with minimal voiding and no splash or solder balling issues.
Shenmao America to Showcase Water Soluble Flux at the SEMICON West
07/11/2016 | SHENMAO America Inc.Shenmao America Inc. will introduce its SMF-WB02/SMF-WB51 Water Soluble Flux at the SEMICON West event happening this week (July 12–14) at the Moscone Center in San Francisco, California.