Avoid the Void: Indium Corporation’s Indium8.9HF Solder Paste To Be Featured at SMTAI


Reading time ( words)

Indium Corporation will feature its halogen-free Indium8.9HF no-clean solder paste at SMTA International (SMTAI) 2016 on Sept. 27 and 28, in Rosemont, Illinois.

Indium8.9HF is specifically formulated to Avoid the Void™ while delivering high transfer efficiency with low variability.

This no-clean solder paste is perfectly suited for a variety of applications, especially automotive, due to its unique oxidation barrier technology.

In addition to outstanding print transfer and response-to-pause, Indium8.9HF Solder Paste also provides a number of other benefits, including excellent pin-in-paste solderability and hole-fill, robust reflow capability, and a wide process window.

Indium8.9HF Solder Paste is part of Indium Corporation’s family of high-performance, lead-free, low-voiding, no-clean solder pastes that help manufacturers to Avoid the Void™. For more information about Indium8.9HF, visit Indium Corporation’s booth #429, email askus@indium.com, or click here.

 

Share

Print


Suggested Items

Catching Up With Nova Engineering

04/27/2021 | Dan Beaulieu, D.B. Management Group
When searching for companies to interview, I always look for something unique and that makes the company special. Truth be told, I am a collector of stories about good, well-run, unique companies that we can learn something from. Nova Engineering is one of those companies.

Hans-Peter Tranitz: Dieter Bergman IPC Fellowship Award Recipient

04/22/2021 | Patty Goldman, I-Connect007
In this wide-ranging interview, Patty Goldman speaks with Continental Automotive’s Peter Tranitz about his IPC involvement with press-fit and other automotive standards which have earned him the coveted Dieter Bergman IPC Fellowship Award.

Excerpt—The Printed Circuit Assembler’s Guide to... SMT Inspection: Today, Tomorrow, and Beyond, Chapter 3

04/22/2021 | Brent Fischthal, Koh Young America
Initiatives like the IPC Connected Factory Exchange (CFX) and IPC-Hermes-9852 underpin efforts within the industry to develop standards and help create a smart factory. These M2M communication standards, guided in part by Industry 4.0, are altering the manufacturing process by improving metrics such as first pass yield and throughput by applying autonomous process adjustments.



Copyright © 2021 I-Connect007. All rights reserved.