TRI Premieres New Inspection Solutions at NEPCON South China 2016


Reading time ( words)

Test Research, Inc. (TRI) will feature a new generation of SPI, AOI, AXI and ICT inspection solutions at NEPCON South China 2016 exhibition. Visit us at booth C22 in Hall 1 of Shenzhen Convention & Exhibition Center from August 30 - September 1, 2016 for a personal tour of the latest developments in TRI’s award-winning solutions for PCBA inspection.

TRI’s 2016 new lineup introduces the TR7500QE stop-and-go 9D AOI system designed for best inspection coverage with maximum accuracy with 2D+3D clear image and accurate 3D solder inspection. 

TR7007Q is a high-performance 3D SPI system with 4 projectors, combining very high resolution imaging and intelligent software for detailed, reliable inspection of industry’s smallest SMT components. 

Also launching in 2016 is a new multi-core ICT system, TR5001Q SII Inline. Featuring up to 4-core parallel testing, the new in-circuit tester’s intuitive programming application software and high performance hardware enable rapid testing and serial programming of up to 4 boards at once.

Discover how TRI’s complete range of PCBA test solutions works together to bring you maximum value in production line and minimize production costs. Ranging from SPI, AOI, AXI, MDA and ICT, TRI’s systems are designed to interoperate with other manufacturing equipment to minimize down times, optimize production quality and reduce operator work load.  Visit us at booth C22 in hall 1 for a personal tour of TRI’s solution lineup.

About TRI

TRI offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. From Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), and 3D Automated X-ray Inspection (AXI) systems to Manufacturing Defect Analyzers (MDAs) and In-Circuit Test equipment, TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements.

Share

Print


Suggested Items

Catching Up With Nova Engineering

04/27/2021 | Dan Beaulieu, D.B. Management Group
When searching for companies to interview, I always look for something unique and that makes the company special. Truth be told, I am a collector of stories about good, well-run, unique companies that we can learn something from. Nova Engineering is one of those companies.

Hans-Peter Tranitz: Dieter Bergman IPC Fellowship Award Recipient

04/22/2021 | Patty Goldman, I-Connect007
In this wide-ranging interview, Patty Goldman speaks with Continental Automotive’s Peter Tranitz about his IPC involvement with press-fit and other automotive standards which have earned him the coveted Dieter Bergman IPC Fellowship Award.

Excerpt—The Printed Circuit Assembler’s Guide to... SMT Inspection: Today, Tomorrow, and Beyond, Chapter 3

04/22/2021 | Brent Fischthal, Koh Young America
Initiatives like the IPC Connected Factory Exchange (CFX) and IPC-Hermes-9852 underpin efforts within the industry to develop standards and help create a smart factory. These M2M communication standards, guided in part by Industry 4.0, are altering the manufacturing process by improving metrics such as first pass yield and throughput by applying autonomous process adjustments.



Copyright © 2021 I-Connect007. All rights reserved.