Nano Stencil Clean Launched

Reading time ( words)

From the makers of Smart Sonic Stencil Cleaners and 440-R SMT Detergent, Nano Stencil Clean was formulated specifically to safely clean all types of solder paste from nano-coated stencils and misprinted PCBs.

The new technology of applying a nano coating to solder paste stencils has shown significant advances to improving print yields.  However, many of the nano chemistries used to provide a hydrophobic and oleophobic surface to the apertures and underside of the stencil are sensitive to elevated pH cleaning chemistries.  Until the introduction of Nano Stencil Clean, manufacturers of cleaning chemicals would recommend using their “pH Neutral” cleaning chemistry.  The pH Neutral cleaner would have less ill effects on the nano coating.  But, because the pH Neutral product was not designed to clean solder paste, it was less effective on removing various types of solder paste from the nano coated stencil.  In addition, because solvents have a neutral pH, many “pH Neutral” products obtain their neutral pH by mixing solvents into a little water and calling it a “water-based” chemistry.  These “pH Neutral” products are high in VOCs and environmentally problematic.

Nano Stencil Clean is the first cleaning chemistry designed specifically to safely clean all types of solder paste from nano coated stencils.  Nano Stencil Clean is environmentally safe and user safe with a low pH and nearly zero VOC content.  It contains no CFCs, HCFCs, terpenes, alcohol or other hazardous ingredients and performs in ultrasonic, spray or manual cleaning applications.  It is safe on all metals and plastics and REACH and RoHS compliant.



Suggested Items

Catching Up With Nova Engineering

04/27/2021 | Dan Beaulieu, D.B. Management Group
When searching for companies to interview, I always look for something unique and that makes the company special. Truth be told, I am a collector of stories about good, well-run, unique companies that we can learn something from. Nova Engineering is one of those companies.

Hans-Peter Tranitz: Dieter Bergman IPC Fellowship Award Recipient

04/22/2021 | Patty Goldman, I-Connect007
In this wide-ranging interview, Patty Goldman speaks with Continental Automotive’s Peter Tranitz about his IPC involvement with press-fit and other automotive standards which have earned him the coveted Dieter Bergman IPC Fellowship Award.

Excerpt—The Printed Circuit Assembler’s Guide to... SMT Inspection: Today, Tomorrow, and Beyond, Chapter 3

04/22/2021 | Brent Fischthal, Koh Young America
Initiatives like the IPC Connected Factory Exchange (CFX) and IPC-Hermes-9852 underpin efforts within the industry to develop standards and help create a smart factory. These M2M communication standards, guided in part by Industry 4.0, are altering the manufacturing process by improving metrics such as first pass yield and throughput by applying autonomous process adjustments.

Copyright © 2021 I-Connect007. All rights reserved.