Register Today for BTU's Solder Reflow Fundamentals Workshop during SMTAI


Reading time ( words)

BTU International's Fred Dimock, Manager of Process Technology, will conduct a reflow workshop during SMTA International at the Donald Stephens Convention Center in Rosemont, IL. The workshop, entitled “Solder Reflow Fundamentals – Understanding and Obtaining Profiles,” is scheduled to take place Sunday, September 25 at 8:30 a.m. CDT in room 52.

This workshop is an expansion of the reflow portion of a workshop that was given at the American Competitive Institute in 2011 and was the basis of the reflow chapter in the SMTA Handbook of Electronic Assembly and A Guide to SMTA Certification by Ron Lasky, etc.

This class will focus on the fundamentals of solder reflow and reflow oven operation. It is designed for new or current SMT engineers/technicians that are seeking a better understanding of the reflow process. Dimock will discuss recipes vs. profiles, heat transfer and oven control, why profiles are shaped the way they are and how to obtain profiles. Additional topics of discussion will include TC accuracy and mounting, profilers, test vehicles, eutectic vs. lead-free process windows, and process repeatability.

Dimock also will chair Session LF1 entitled, “Alloy Compositions for Enhanced Interconnection Performance,” scheduled to take place Thursday, September 29 at 8:30 a.m. CDT in room 47/49.

Dimock is the Manager of Process Technoly at BTU International and is a long-standing member of the SMTA Technical Committee. He holds an Associate’s Degree in Mechanical Design from Wentworth in Boston and a Bachelor’s Degree in Ceramic Engineering from the State University of New York at Alfred. (SUNY)  His extensive experience in thermal processing includes positions at Corning, General Electric, and Osram-Sylvania before joining BTU.

Dimock has assisted many companies with process refinements and has authored numerous articles on lead-free solder, process control, and the operation of continuous furnaces. He has taught numerous SMTA solder reflow classes and participated in the 5-45 Subcommittee for the development of IPC-7801 Reflow Oven Process Control Standard.

Register for the workshop today here. For more information about BTU International, visit www.btu.com.

About BTU International

BTU International, a wholly-owned subsidiary of Amtech Group (Nasdaq: ASYS), is a global supplier and technology leader of advanced thermal processing equipment and processes to the electronics manufacturing and alternative energy markets. BTU equipment is used in the production of printed circuit board assemblies and semiconductor packaging as well as in the manufacturing of solar cells and nuclear fuel. BTU has operations in North Billerica, Massachusetts, and Shanghai, China, with direct sales and service in the U.S.A., Asia and Europe.

Share

Print


Suggested Items

Catching Up With Nova Engineering

04/27/2021 | Dan Beaulieu, D.B. Management Group
When searching for companies to interview, I always look for something unique and that makes the company special. Truth be told, I am a collector of stories about good, well-run, unique companies that we can learn something from. Nova Engineering is one of those companies.

Hans-Peter Tranitz: Dieter Bergman IPC Fellowship Award Recipient

04/22/2021 | Patty Goldman, I-Connect007
In this wide-ranging interview, Patty Goldman speaks with Continental Automotive’s Peter Tranitz about his IPC involvement with press-fit and other automotive standards which have earned him the coveted Dieter Bergman IPC Fellowship Award.

Excerpt—The Printed Circuit Assembler’s Guide to... SMT Inspection: Today, Tomorrow, and Beyond, Chapter 3

04/22/2021 | Brent Fischthal, Koh Young America
Initiatives like the IPC Connected Factory Exchange (CFX) and IPC-Hermes-9852 underpin efforts within the industry to develop standards and help create a smart factory. These M2M communication standards, guided in part by Industry 4.0, are altering the manufacturing process by improving metrics such as first pass yield and throughput by applying autonomous process adjustments.



Copyright © 2021 I-Connect007. All rights reserved.