IPC & SMTA to Host High-Reliability Cleaning & Conformal Coating Conference


Reading time ( words)

IPC Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference, scheduled to take place October 25-27, 2016 at Hyatt Rosemont, Rosemont, IL. The conference is focused on best practices for designing, cleaning and coating highly dense electronic assemblies to assure reliability in today’s mobile society.

The first day of the conference features Cleaning and Conformal Coating Workshops. The morning Workshop will focus on “DFX – Design for Excellence; Focus on DFR-Design for Reliability of Hardware to be cleaned.” The instructor will be Dale Lee, Senior DFX Engineer, Plexus Corporation.

The afternoon Workshop focuses on “Robust Coating Processes in the Factory: Methods, Critical Parameters, Problems and Remedies.” The instructors will be Doug Pauls, Principal Materials & Process Engineer at Rockwell Collins and Jason Keeping, P.Eng, Corporate Engineering Project Manager, Ruggedized Electronics Sector at Celestica Inc.

The second and third days will feature the Technical Conference. Sessions will be dedicated to the following topics:

  1. Processes for Achieving Reliability  and Ruggedization
  2. Cleaning Materials, Machines, Rinsing and Process Control
  3. Conformal Coating for Class 2 and 3 Electronic Assemblies
  4. Customer Cleaning Challenges and Needs
  5. Ultra-Thin Nanocoatings in Electronics Assembly Operations Come learn about these valuable lessons and more at the IPC/SMTA Cleaning and Conformal Coating Conference.

Come learn about these valuable lessons and more at the IPC/SMTA Cleaning and Conformal Coating Conference.

Click here for theetailed agenda outline.

Share

Print


Suggested Items

Excerpt: The Printed Circuit Assembler’s Guide to… Smart Data, Chapter 2

04/21/2021 | Sagi Reuven and Zac Elliott, Siemens Digital Industries Software
Companies have been collecting data in large volumes. Highly varied data from manufacturing operations comes in quickly that needs to be validated, and its value prioritized so that it can be turned into something useful—transformed from big data to smart data. The amount of data available has grown exponentially into big data. Twenty years ago, a PCB work order resulted in 100 data records, megabytes of data; today, it is 10 billion records, terabytes of data. The investment in collecting this data and storing it is high. However, without a way to analyze the data, without analytics, it will not result in ROI.

Overcoming Component Selection and Sourcing Challenges

04/14/2021 | John R. Watson, Altium
Most PCB designers know precisely how Captain James T. Kirk felt because we often feel the same way when starting a new design. We are launching into something that we ultimately don't know how it will turn out. We don't know the difficulties we'll face or problems we’ll need to fix. While we can control the design process and use our skills to make reasonable decisions, there are often huge hazards awaiting us in the "unknown." One worsening problem for all designers is component procurement.

Implementing Digital Twin Best Practices From Design Through Manufacturing Webinar Review

01/27/2021 | Dana Korf, Korf Consultancy
I-007e recently released a highly informative series of short webinars called Implementing Digital Twin Best Practices from Design Through Manufacturing presented by industry expert Jay Gorajia, the Director of Siemens Global Digital Manufacturing Services. The webinar is an excellent overview how data that is generated using a digital twin model can be effectively utilized to improve business execution using the Siemens tool suite.



Copyright © 2021 I-Connect007. All rights reserved.