SMTA China Presents Seven Best-Paper/Presentation Awards and Two Best Exhibit Awards


Reading time ( words)

SMTA China announces that it presented awards for seven papers at the SMTA China 10th Anniversary Reception, held on Tuesday, August 30, 2016 at Shenzhen Convention & Exhibition Center in conjunction with the NEPCON South China Show.

IBM Procurement China Limited’s Robin Hou was awarded The Best Paper of Technology Conference One for the paper titled “The Challenge and Solution for Rework of Array Components.”

SMTAChina10thAnnivAwards.JPG

Flex’s Henley Zhou was awarded The Best Paper of Technology Conference Two for the paper titled “The Failure Analysis and Improvement Solution for Typical Defect From Eye of Needle Press Fit Process.”

Pacrim Technology Inc.’s Dr. Wayne Koh received the award for The Best Presentation of Technology Conference One for the presentation titled “Package Warpage Control and SMT Solder Joint Defects.”

Flex’s Henley Zhou received the award for The Best Presentation of Technology Conference Two for the presentation titled “The Failure Analysis and Improvement Solution for Typical Defect From Eye of Needle Press Fit Process.”

Jason Chan, from KYZEN, received the award for The Best Presentation of Vendor Conference One for the presentation titled “Video Analysis of Solder Paste Release From Stencils.”

Jason Chuah, from Kirsten Soldering AG, received the award for The Best Presentation of Vendor Conference Two for the presentation titled “The Breakthrough of THT Soldering Solution.”

Dragon Zhang, from BPM Microsystems, received the award for The Best Presentation of Vendor Conference Three for the presentation titled “The Landmark Innovation for Device Programming.”

Kirsten received the award for The Best Emerging Exhibit of the Year 2016 China South with the product “Modula The Soldering System,” Model “The Modula Wave.”

BTU received the award for The Best Exhibit Technology of the Year 2016 China South with the product “Reflow Oven”, Model of “PYRAMAX 125N.”

For more information about the SMTA China, contact Ms. Peggy Chen at +86-21-5609-3010; E-mail: peggychen@smta.org.cn.

Share

Print


Suggested Items

Catching Up With Nova Engineering

04/27/2021 | Dan Beaulieu, D.B. Management Group
When searching for companies to interview, I always look for something unique and that makes the company special. Truth be told, I am a collector of stories about good, well-run, unique companies that we can learn something from. Nova Engineering is one of those companies.

Hans-Peter Tranitz: Dieter Bergman IPC Fellowship Award Recipient

04/22/2021 | Patty Goldman, I-Connect007
In this wide-ranging interview, Patty Goldman speaks with Continental Automotive’s Peter Tranitz about his IPC involvement with press-fit and other automotive standards which have earned him the coveted Dieter Bergman IPC Fellowship Award.

Excerpt—The Printed Circuit Assembler’s Guide to... SMT Inspection: Today, Tomorrow, and Beyond, Chapter 3

04/22/2021 | Brent Fischthal, Koh Young America
Initiatives like the IPC Connected Factory Exchange (CFX) and IPC-Hermes-9852 underpin efforts within the industry to develop standards and help create a smart factory. These M2M communication standards, guided in part by Industry 4.0, are altering the manufacturing process by improving metrics such as first pass yield and throughput by applying autonomous process adjustments.



Copyright © 2021 I-Connect007. All rights reserved.