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IPC Technical Staff Liaisons—Your ‘Shepherds’ in the IPC Standards Development Process
05/06/2021 | John Perry, IPC
Excerpt: The Printed Circuit Assembler’s Guide to… Smart Data, Chapter 3
05/05/2021 | Sagi Reuven and Zac Elliott, Siemens Digital Industries Software
Process Control in Solder and Reflow
05/05/2021 | Nolan Johnson, I-Connect007
An Inside Look at the IPC Committee Process
05/05/2021 | I-Connect007 Editorial Team
A Tribute to Dieter Bergman
05/04/2021 | David Bergman, IPC
SMT :: Assembly
IPC Technical Staff Liaisons—Your ‘Shepherds’ in the IPC Standards Development Process
If you have ever attended an IPC standards development meeting, whether it be in person or through a web meeting, then you’ve seen or heard us—that collection of IPC staff members within the IPC Technical Department that schedule the myriad face-to-face or online standards meetings taking place at annual IPC events or throughout the year. We’re the ones you hear from when IPC circulates a new standard working draft, promotes it to Final Draft for Industry Review (FDIR) for broader industry input, or notifies you that the document is ready for balloting towards release.
Excerpt: The Printed Circuit Assembler’s Guide to… Smart Data, Chapter 3
There are many different and valid perspectives on the performance of a factory. For instance, the fact that the factory is on shutdown may be significant to a planner who is concerned with overall factory capacity. However, the shutdown is less significant to the production manager, who simply wants to know if the machines will run efficiently when they are scheduled to run.
Process Control in Solder and Reflow
Nolan Johnson speaks with KIC’s Miles Moreau to get his perspective on topics such as wave process inspection (WPI), wave solder, and vacuum reflow, and how they will fit into Industry 4.0 and smart factories.
Nolan’s Notes: Driving Cost Out of the Supply Chain
Supply chain issues have become mainstream news as virtually all supply chains were affected in some manner by the pandemic lockdowns. The interactions of supply, demand, and distribution became a topic of scrutiny even for my 80-something parents; we all became experts at understanding supply chain when we had to explain exactly why toilet paper was peculiarly absent from store shelves, while there was plenty of liquor still available. The vagaries of the distribution chain for all sorts of daily necessities suddenly became our concern; we no longer could take the supply chain for granted.
Catching Up With Nova Engineering
When searching for companies to interview, I always look for something unique and that makes the company special. Truth be told, I am a collector of stories about good, well-run, unique companies that we can learn something from. Nova Engineering is one of those companies.
Hans-Peter Tranitz: Dieter Bergman IPC Fellowship Award Recipient
In this wide-ranging interview, Patty Goldman speaks with Continental Automotive’s Peter Tranitz about his IPC involvement with press-fit and other automotive standards which have earned him the coveted Dieter Bergman IPC Fellowship Award.
Excerpt—The Printed Circuit Assembler’s Guide to... SMT Inspection: Today, Tomorrow, and Beyond, Chapter 3
Initiatives like the IPC Connected Factory Exchange (CFX) and IPC-Hermes-9852 underpin efforts within the industry to develop standards and help create a smart factory. These M2M communication standards, guided in part by Industry 4.0, are altering the manufacturing process by improving metrics such as first pass yield and throughput by applying autonomous process adjustments.
Excerpt: The Printed Circuit Assembler’s Guide to… Smart Data, Chapter 2
Companies have been collecting data in large volumes. Highly varied data from manufacturing operations comes in quickly that needs to be validated, and its value prioritized so that it can be turned into something useful—transformed from big data to smart data. The amount of data available has grown exponentially into big data. Twenty years ago, a PCB work order resulted in 100 data records, megabytes of data; today, it is 10 billion records, terabytes of data. The investment in collecting this data and storing it is high. However, without a way to analyze the data, without analytics, it will not result in ROI.
Smart Is Not A Binary Concept
“Smart” is not simply an “on” or “off” state. Just like people, some solutions are “smarter” than others; as we see from the various ways of measuring intelligence within humans, there are many kinds of “smarts.” When looking to invest in a smart manufacturing strategy, the playing field is more complex than it may appear. We should first understand and define what “smart” means, to what extent it exists, and the other requirements and dependencies that are needed to get the best value from investment.
Driving Down Cost in the Supply Chain
Driving cost out of the supply chain goes beyond reduction of raw material cost. Though many of the manufacturers today concentrate on negotiation with their raw material supplier(s) the hidden cost of internal supply chain goes undetected. To address the cost of the entire supply chain we should not only look at direct material cost but also the cost of internal supply chain. At Epoch we looked at four areas in particular which include: planning/tracking, storage/delivery, inventory management, and supplier relationships.
Excerpt: The Printed Circuit Assembler’s Guide to... SMT Inspection: Today, Tomorrow, and Beyond, Chapter 1
Today, optical inspection systems are the preferred solution for in-line quality control in the SMT industry. Systems such as solder paste inspection (SPI) or automated optical inspection (AOI) systems for pre- and post-reflow are almost standard in every production facility.
Excerpt: The Printed Circuit Assembler’s Guide to… Smart Data
Whenever we discuss data, keep in mind that people have been collecting data, verifying it, and translating it into reports for a long time. And if data is collected and processes are changed automatically, people still will be interpreting and verifying the accuracy of the data, creating reports, making recommendations, solving problems, tweaking, improving, and innovating. Whatever data collection system is used, any effort to digitalize needs to engage and empower the production team at the factory. Their role is to attend to the manufacturing process but also to act as the front line of communications and control.
What Makes a Great Supply Chain Manager?
Building a competitive and reliable supply chain is a critical success factor for any manufacturing business. This is especially true today, where we face constant volatility and disruption across global supply chains. In this environment, effective supply chain leadership is more critical than ever. So, what makes a great supply chain manager?
10 Ways to Identify Counterfeit ICs
How about a little refresher on some of the most effective techniques for component inspection using X-ray? While other visual inspection techniques provide important insight into component quality and authenticity, nothing exceeds X-ray inspection for fast, accurate, non-destructive evaluation. The following are 10 ways to identify a fake IC using X-ray.
KIC Adds Wave Process Inspection to Product Line
Miles Moreau, general manager for EMEA, Americas & Australia at KIC, shares some details on the new Wave Process Inspection (WPI) solution that KIC is currently rolling out. This solution brings real-time process control capabilities to wave soldering equipment, adding and extending capabilities.
BTU Discusses Time-Saving New Technologies
Nolan Johnson and BTU's Rob DiMatteo drill down into the company's new capabilities in vacuum reflow and new technology for flux management, a system that greatly reduces downtime for cleaning and maintenance, among other benefits.
NovaCentrix Expands Solder Capabilities
Stan Farnsworth of NovaCentrix discusses how the company has expanded into electronics manufacturing in the past year with its photonic curing and soldering tools.
Advanced Inspection Solutions and Intelligent Factory Automation
Effective inspection is the key to advancing the quality of the manufacturing operation. With the benefit of AI to spot the early signs, any trends away from optimum can be resolved before they become problems. MIRTEC President Brian D’Amico explains.
Expanded Suite for Component Storage Needs
Super Dry’s Richard Heimsch will be showcasing the expanded suite of storage management controls as well as some long-term storage solutions at this year's event.
Lessons Learned During Pandemic Fuel KYZEN's Customer Support, Growth
Tom Forsythe shares how KYZEN applied pandemic experiences to their delivery of customer support. The company's R&D has continued, including AquaNox product line formulations for water soluble organic acids, where cleaning has historically not been necessary but now is increasingly required.
Real Time with...IPC APEX EXPO 2021: Optimizing Pin Inspection In Automotive With True3D Tech
Guest Editor Michael Ford and Gustavo Jimenez, Koh Young's sales manager for Northern Mexico, discuss some of the company's newest technologies, including True3D™ technology for pin inspection, which has proven popular with the automotive segment.
What Makes a Good Process Engineer?
Nolan Johnson recently spoke with Tuan Tran, director of customer solutions at Green Circuits, about what makes a successful process engineer. They also discuss a typical day in the life of a process engineer—from pre-manufacturing through post-DFM, for process improvement. As Tuan points out, there are a variety of paths to becoming a great process engineer.
Coming Out Ahead With Smart Processes
During a recent interview with Dr. Tim Rodgers that focused on supply chain management, the conversation also touched on smart factories. We’ve included Tim’s insights on smart processes here.
EIPC Technical Snapshot: Cleanliness
John Ling’s invitation to the fifth in EIPC’s series of Technical Snapshots was as droll as we have come to expect: “In these confined days of lockdown, and exhortations to stay at home and only go out for exercise, this only exercises the natural inclination to hop on a ‘plane to some sunshine.’ Although not the same as Factor 20, one of our webinars gives a high degree of protection from harmful ignorance, and you do not have to go out in the cold.”
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
We’re seeing an increase in optimism as more people are vaccinated and states under lockdown begin flipping open their shutters. This positive outlook is spreading, albeit slowly.
Building A Better, Brighter LED Headlamp with Top-Side Alignment Process (TAP)
An emerging trend in the automotive industry is the adoption of advanced LED headlamp lighting systems. These systems drive challenging placement requirements for LED packages. In this paper, we will review these unique challenges and discuss a novel approach to high-accuracy placement of LED packages enabling a scalable production solution.
Implementing Digital Twin Best Practices From Design Through Manufacturing Webinar Review
I-007e recently released a highly informative series of short webinars called Implementing Digital Twin Best Practices from Design Through Manufacturing presented by industry expert Jay Gorajia, the Director of Siemens Global Digital Manufacturing Services. The webinar is an excellent overview how data that is generated using a digital twin model can be effectively utilized to improve business execution using the Siemens tool suite.
Tech 2 Tech: KYZEN’s Short Technical Sessions a Big Hit
Nolan Johnson gets an update from Tom Forsythe on KYZEN’s Tech 2 Tech sessions. These brief 15-minute sessions were set up during the pandemic by KYZEN for customers, prospects, and new engineers around cleaning, and have since found traction with their manufacturers, reps and distributors.
2021: The Year of X = Xc – 1
Throughout 2021, I-Connect007 will focus on our theme, “X = Xc – 1,” in which we will explore continuous improvement in a practical way. Get talking about continuous improvement as a business method and the conversation often hinges around large programs and grand transformations. “Company culture” and “corporate transformation” are terms that often appear in these conversations. Often, it seems, continuous improvement is simply a huge undertaking.
Meet Cooler Cao: SMT007 Columnist
Meet Cooler Cao, the author of one of our newest SMT007 columns, Global Connections. Cooler will cover all aspects of cables, cable assemblies, and wire harness technologies. His aim is to help companies who design and use these technologies to find the best connection solutions.
This Month in SMT007 Magazine: The Skilled Worker
Why do we train and educate our employees? Here, I will share my perspective based on what is happening in facilities trying to outsource their products, as I see that many companies are losing the tribal knowledge of how things are manufactured and the basic skills necessary to physically build a product.
This Month in SMT007 Magazine—Continuous Improvement: As Simple as X = Xc – 1
X=Xc – 1 is a conceptual equation for continuous improvement. You define X and work to reduce it by a factor of 1. This could be one work hour, one process step, one day less in a cycle, and so on. We recently met with Dr. Ron Lasky to discuss the concept of X=Xc – 1 and get his advice on generating enthusiasm among readers and the next generation about continuous improvement. As this discussion illustrates, many process improvements are small in scale, not yearlong, major efforts.
Chapter 1 Excerpt: The Printed Circuit Assembler’s Guide to Process Validation
The original principle underlying the IPC’s ionic cleanliness requirement was that the mobility of surface ions, detectable from SIR measurements, would correlate to a maximum value of detectable ionic elements permissible on the circuit surface. The industry required a test that was both fast and accurate for process control. Thus, a simplified ion chromatograph that was able to detect ionic elements without differentiation was created.
Book Excerpt: The Printed Circuit Assembler’s Guide to Smart Data, Chapter 1
Accurate data is required to adjust processes and to ensure quality over time. This is difficult because not all data is in the same format, and not all sensors perform the same over time. How do you know what the best data to collect is and how to filter out the junk data from useful or smart data? This is not an easy task when the interfaces to data collection sources are complex, and they do not speak the same language, often requiring the vendor’s help to get data out of the machine and then spending time normalizing the data to turn it into something useful. This is a challenge for companies trying to set up a custom data collection system themselves.
Happy’s Essential Skills: Recruiting and Interviewing
Printed circuit manufacturing was not one of the jobs that electrical engineers in HP wanted to do. EEs were also not the best choice for printed circuit manufacturing because chemical engineers, chemists, and mechanical engineers had more skills useful to support the PCB manufacturing process. Therefore, I was authorized to recruit external hires. To recruit chemical engineers, we went to those universities noted for their focus on industries like electronics, process control, and environmental...
EIPC Technical Snapshot: PCB Surface Finishes
For the third in a series of Technical Snapshot webinars, EIPC chose to focus on PCB surface finishes, comparing specific properties, examining corrosion behaviour and discussing selection criteria for low-loss, high frequency applications.
Book Excerpt: The Printed Circuit Assembler’s Guide to Process Validation
It is assumed that readers are familiar with manufacturing electronic circuit assemblies in accordance with IPC-J-STD-001 or IEC 61189-1; both are titled “Requirements for Soldered Electrical and Electronic Assemblies.” In October 2018, IPC-J-STD-001 Revision G was amended and released with a new Section 8 of the document titled “Cleaning.” The change was primarily the removal of a “cleanliness” level of 1.56 mg/square cm of NaCl equivalence. This small change has great significance in relation to how companies ensure the electrochemical reliability of their products.
Book Excerpt: The Printed Circuit Assembler’s Guide to Smart Data
Whenever we discuss data, keep in mind that people have been collecting data, verifying it, and translating it into reports for a long time. And if data is collected and processes are changed automatically, people still will be interpreting and verifying the accuracy of the data, creating reports, making recommendations, solving problems, tweaking, improving, and innovating. Whatever data collection system is used, any effort to digitalize needs to engage and empower the production team at the factory. Their role is to attend to the manufacturing process but also to act as the front line of communications and control.
SMTA Europe Solder Finish Webinar Addresses Defects Causes and Cures
“What is your most common PCB problem?” A survey conducted by Bob Willis had revealed finish solderability to be the predominant contender, and it was clear that the choice of solderable finish applied to surface mount boards could have a significant effect on the assembly yield and cost of the final circuit. SMTA Europe organised an informative and enlightening webinar this month entitled “Guide to PCB Solder Finishes—Process Defects Causes and Cures,” with soldering specialist Bob Willis as presenter.
Training Is Hard, But It’s Also Soft
There is a disconnect in many manufacturing companies. This article is not about that disconnect, but rather a topic that gets clouded and the objectives made more difficult by that prevalent disconnect. Business owners, vice presidents, and operational executives are expected to have a vision for the company strategy. But what is not always fully known is the broad strokes of how to get there.
Lorain County Community College’s Successful MEMS Program
The I-Connect007 editorial team had the pleasure of an extended and detailed conversation with Johnny Vanderford and Courtney Tenhover from Lorain County Community College (LCCC). Vanderford and Tenhover are at the heart of the microelectromechanical systems (MEMS) program at LCCC that is emerging as a model for a successful technical higher-education program. This conversation was lively, and the enthusiasm at LCCC is infectious, as it should be; their results are impressive.
Siemens and Computrol: Achieving Operational Excellence in Electronics Manufacturing
I-Connect007’s Happy Holden and Nolan Johnson speak with Zac Elliott, technical marketing engineer at Siemens Digital Industries Software, and Farid Anani, VP of operations at Computrol, about how to achieve operational excellence in electronics manufacturing. They start by discussing the dynamic wherein automation projects may initially create islands of automation and the need to eventually connect those islands to achieve even greater operational efficiencies. The discussion then moves to how to make the data smarter and more useful for analysis and optimization.
Catching up With VRI’s Sérgio Rosendal Ribeiro
Dan Beaulieu speaks with Sérgio Rosendal Ribeiro of VRI, a Brazilian PCBA company entering the North American market, who is about to open up a location in Florida. They also discuss the overall business climate in South America.
Catching up With QCMS General Manager Rick McAnally
Founded in 2007, QCMS is one of the more interesting EMS companies on the East Coast. They are actually a sister company to Niche Electronics located in Pennsylvania. Dan Beaulieu interviews QCMS General Manager Rick McAnally.
KYZEN’s Popular Cleaning Series Continues
Wondering what to look for in a PCB cleaning agent? In just 10 minutes, you will learn from Jack Reinke what impacts your waste stream as part of the latest installment of KYZEN’s Tech2Tech series. This special webinar is held live at two times: 7:18 a.m. and 5:33 p.m. PST December 3, 2020.
The Heterogeneous Integration Roadmap for Aerospace and Defense
Most people in the semiconductor industry are familiar with the International Technology Roadmap for Semiconductors (ITRS), which provided guidance for the industry starting in 1991 (as the National Technology Roadmap for Semiconductors). As the benefits of Moore’s Law became more difficult and more expensive to achieve, the organization decided to publish a final version in 2016. The baton was handed to the Heterogeneous Integration Roadmap (HIR), with the realization that heterogeneous integration—assembling different types of devices rather than monolithic fabrication—is an important enabler for continued progress in the semiconductor industry.
SMTA Europe Webinar: What Is a Good Solder Joint, and How Can Solder Joints Be Tested?
What is a good solder joint? And how can they be tested not only for purposes of process characterisation, optimisation, monitoring, and control but also for ensuring their long-term reliability? Pete Starkey details a webinar organised by the Europe Chapter of SMTA that was presented by Bob Willis, an expert in soldering, assembly technologies, and failure analysis.
Part 11 of Siemens’ Digital Twin Webinar Series: Data-Driven Manufacturing
I-007e Micro Webinars recently released a free, on-demand series titled “Implementing Digital Twin Best Practices From Design Through Manufacturing” with Siemens' Jay Gorajia. In Part 11, Gorajia discusses, “Data-Driven Manufacturing: Making Big Data Into Smart Data.”
Part 10 of Siemens’ Digital Twin Webinar Series: Inventory Management
I-007e Micro Webinars recently released a free, on-demand series titled “Implementing Digital Twin Best Practices From Design Through Manufacturing” with Siemens' Jay Gorajia. In Part 10, Gorajia looks at “Inventory Management in the Warehouse and on the Shop Floor.” Material accounts for 80% of PCB assembly costs. If not managed correctly, margins can be cut even further.
Part 9 of Siemens’ Digital Twin Webinar Series: Intelligent Data Acquisition and Normalization
I-007e Micro Webinars recently released a free, on-demand series titled “Implementing Digital Twin Best Practices From Design Through Manufacturing” with Siemens' Jay Gorajia. In Part 9, Gorajia’s topic is “Intelligent Data Acquisition and Normalization.” He asks, “With the considerable investment in automation of the PCB assembly process, why is it a challenge to get data from the production line?”
This Month in SMT007 Magazine: Test and Measurement in a Smart Factory
Nolan Johnson spoke with MIRTEC President Brian D’Amico about how the role of test and measurement equipment is changing in the smart factory and how shops can adjust to make use of the new technology. D’Amico shares this insight: “While approximately 90% of U.S. electronics manufacturers recognize the potential of Industry 4.0 to improve productivity, many are slow to adopt smart factory solutions within the manufacturing process.”
Real Time with… AltiumLive 2020: Vince Mazur Previews New Design Rule Features
Altium Technical Marketing Manager Vince Mazur discusses his presentation at the recent AltiumLive, which focused on updates to Altium Designer's approach to creating design rules and constraints. Vince explains that these features will be more intuitive for the user, and the update, which is currently in beta, will be released in the future. The company is shifting from “rule-centric” design rules features to capabilities that are more “design-centric,” with applicable rules for each object available at one click.
Reducing Flux Splatter in Sensors and Camera Modules
With the increased use of electronics in new technology areas, flux formulations are being developed to address the new and existing requirements. For sensors and camera modules used for Advanced Driver Assistance System (ADAS) and internet of things (IoT) applications, there is a demand for no-clean flux formulations in lead-free solder paste, which can reduce flux splattering during reflow.
IPC Standards Development: Business Challenges and an Inside View
With increasing frequency, standardising the standards, such as ISO 9201, imposes certain rules that must be met to ensure “fair play” amongst the supply chain. There will be those familiar with hearing about “false positives/negatives” and “never trust the salesman,” so mitigating these is no easy task. However, there is the chance for each 5-30 Task Group to review industry requirements and set out the work program for the ensuing period. With that in mind, much of what follows is based on comments we learn about from our industry around the world, many of whom are not yet IPC members. Yes, this is a membership recruitment drive, unashamedly, as well as a search for volunteers willing to help create the standards of tomorrow.
Part 8 of Siemens’ Digital Twin Webinar Series: On-Demand Machine Part Data
I-007e Micro Webinars recently released a free, on-demand series titled “Implementing Digital Twin Best Practices From Design Through Manufacturing” with Siemens' Jay Gorajia. In Part 8, Gorajia addresses, “On-Demand Machine Part Data for PCB Assembly Equipment.”
How to Benefit From Robotic Soldering Processes
Webinars are in vogue! But in Pete Starkey's experience, the master of the technical webinar with many years’ experience of delivering first-rate events is Bob Willis—electronics assembly specialist, soldering expert, and provider of training and consultancy in electronics manufacture. Here, Pete recaps Bob’s presentation on the upcoming robotic soldering experience.
Just Ask Greg: Advice on Purchasing SMT Stencils
We asked you to send in your questions for Happy Holden, Joe Fjelstad, Eric Camden, and John Mitchell in our “Just Ask” series. Now, Greg Smith, an SMT007 columnist, gets a chance to answer a question.
Part 7 of Siemens’ Digital Twin Webinar Series: Optimizing Inspection and Test Engineering
Have you ever wondered what digital twin is, how it's used, and its benefits? Are you interested in learning ways to optimize and streamline how data flows from design, production planning, process engineering, and manufacturing? Then this micro webinar series is for you! Throughout this 12-part series, Jay Gorajia from Siemens Industries Software describes how to leverage the digital twin concept—from design to production planning and process engineering—through manufacturing execution and supply chain. The goal of the series is to define a blueprint for organizations seeking to digitalize and optimize their design to manufacturing processes and manufacturing operations.
Real Time with… SMTAI 2020: Women’s Leadership Program Cruises Through Important Topics
The virtual environment didn’t stop a large gathering of women (and men) from learning, sharing, and enjoying the Women’s Leadership Program during SMTAI 2020. Michelle Te shares her experience.
Virtual SMTAI 2020 Offers a Primer for Trade Show Managers
I really must hand it to Tanya Martin and Ryan Flaherty for pulling off something as audacious as a virtual version of SMTA International, which took place in cyberspace on September 28–30. SMTA did it in record time. A few months ago, SMTAI was still slated to be a live event in metro Chicago. When COVID-19 travel restrictions made a live event impossible, they stopped on a dime, switched to a virtual event, and never looked back.
Part 5 of Siemens’ Digital Twin Webinar Series: Managing the Digital Thread
I-007e Micro Webinars recently released a free, on-demand series titled “Implementing Digital Twin Best Practices From Design Through Manufacturing” with Siemens' Jay Gorajia. In part 5, Gorajia discusses “Managing the Digital Thread From Design to PCB Assembly Engineering.”
Real Time with… SMTAI 2020: Full List of Interviews With Industry Leaders
The virtual SMTA International Electronics Exhibition took place on September 28–30, and I-Connect007 is here to provide you with comprehensive coverage of the event. We’ve assembled the full list of show-related interviews from before, during, and after SMTAI 2020 with the industry’s top executives, engineers, and managers—all without leaving your office. Visit Real Time with… SMTAI 2020 to view our video series, photo gallery, and more.
Real Time with… SMTAI 2020: Reflections on the Technical Conference
This year’s SMTA International Conference and Exposition went virtual! Pete Starkey explains how the SMTA team did a fine job in difficult circumstances to present an interactive show and technical conference. Here, he highlights four of the papers that particularly caught his interest.
Real Time with...SMTAI 2020: Creative Electron Moves Toward Autonomous Systems
Andy Shaughnessy recently spoke with Dr. Bill Cardoso, CEO of Creative Electron, a provider of advanced X-ray inspection systems. Bill discusses some of the new technologies the company will demonstrate in their virtual booth at SMTAI, including a next-generation X-ray parts counter and a new software platform that offers better automation than ever. He also explains the company’s plan to migrate from automation to autonomous systems by using AI to help remove humans from the process.
Real Time With… SMTAI 2020: Mixing It Up in the Virtual Marketplace
SMTAI 2020 wrapped up on September 30, 2020, completing its three-day run on a virtual platform. This format was uncharted territory for SMTA, exhibitors, presenters, and attendees alike. It is remarkable—and a credit to the organization in the face of a pandemic—that SMTA chose to jump to a virtual format when it could have been so very easy to simply cancel the event altogether. SMTA showed its commitment to the technical conference participants by ensuring their research would publish as intended, as well as to the sponsors and exhibitors who support the event through underwriting and participation.
Manufacturing Test Strategy Tools: Part 4 of Siemens’ Digital Twin Webinar Series
I-007e Micro Webinars recently released a free, on-demand series titled “Implementing Digital Twin Best Practices From Design Through Manufacturing” with Siemens' Jay Gorajia. In Part 4, Gorajia discusses “Manufacturing Test Strategy Tools in the Hands of Designers.”
Manufacturing Test Strategy Tools: Part 4 of Siemens’ Digital Twin Webinar Series
I-007e Micro Webinars recently released a free, on-demand series titled “Implementing Digital Twin Best Practices From Design Through Manufacturing.” Each of the 12 segments can be viewed in about five minutes. In Part 4, Jay Gorajia discusses “Manufacturing Test Strategy Tools in the Hands of Designers.”
Real Time with...SMTAI 2020: STI Electronics Brings Training to the Show
Nolan Johnson talks training with David Raby, president and CEO of STI Electronics. David walks Nolan through STI’s role as a provider of training and EMS services, and the two talk about the strategic need for training and skilled staff in manufacturing. Dave outlines what visitors can find in the company’s virtual booth, and the two conclude by discussing hot topics in training.
Real Time with… SMTAI 2020: First-Time SMTAI Exhibitor Datest
Nolan Johnson speaks with Robert Boguski, president of first-time SMTAI exhibitor Datest. Rob brings Nolan up to speed on the company’s suite of services as a contract test facility and outlines the information that will be available in the Datest virtual booth at SMTAI.
Real Time with... SMTAI 2020: First-Day Wrap-Up
SMTA International 2020 kicked off on Monday morning with attendees and exhibitors mingling and chatting about the latest SMT products and services—virtually, of course. Debbie Carboni, former SMTA VP of Expos, reported that there were “only a few hiccups,” which were addressed quickly and effectively. “This is much better than any other virtual event I have participated in,” she said.
Real Time with...SMTAI 2020: The Test Connection Celebrates 40 Years
Andy Shaughnessy spoke with Bert Horner, VP of engineering support for The Test Connection, about the company’s plans for the upcoming SMTAI virtual show. Bert explains that The Test Connection will address their core competency, engineering, and test services, as well as design tools, such as ASTER Technologies’ DFT analyzer TestWay and the SMH FlashRunner test programmer. He also notes a few of the positive things that the company learned during the COVID-19 lockdown and how the family firm celebrated its 40th anniversary this year.
Virtual SMTA International 2020 Opens Today
SMTA International 2020 kicks off today, and I-Connect007 will bring you complete coverage of this brand-new, virtual event through Real Time with… SMTAI 2020. The virtual SMTAI Electronics Exhibition runs through September 30. Throughout the week, we’ll be capturing and featuring video interviews with the industry’s top executives, engineers, and managers. Stay up to date with the latest developments in the SMT community—all without leaving your office.
Real Time with...SMTAI 2020: How to Network Virtually at the Show
Nolan Johnson networks with SMTA’s Tamara Shephard, membership engagement manager, and Karlie Severinson, events and administrative manager. Shephard and Severinson share how SMTAI has built multiple platforms to bring attendees, exhibitors, and presenters together. SMTAI will host networking opportunities on the virtual show floor to connect to exhibitors, multiple servers on Discord to connect technical program participants, live social events hosted on Zoom, and general social media outreach using the hashtag #SMTAI2020.
Real Time with...SMTAI 2020: The Latest in Test and Inspection From MIRTEC
Brian D’Amico, president of MIRTEC, shares an SMTAI 2020 update with Nolan Johnson. They discuss what visitors can expect to find at MIRTEC’s virtual booth, the current business environment for test and inspection equipment, and how the company has adapted their demonstration and evaluation processes to fit in inside current COVID-19 business protocols.
Real Time with...SMTAI 2020: SelecTech - Flooring Solutions That Won’t Give You Static
Tom Ricciardelli, president and CEO of SelecTech, talks about technical flooring solutions with Nolan Johnson. Ricciardelli discusses some of the challenges to keeping a grounding floor working in a facility and brings Johnson up to speed on how the company’s flooring systems can be installed without factory downtime.
Real Time with… SMTAI 2020: Cimetrix’s Universal Translator—Sapience for Industry 4.0
Ranjan Chatterjee—vice president of smart factory solutions for Cimetrix—and Nolan Johnson discuss new developments in the Sapience product. Chatterjee teases some of the new features in Sapience for Industry 4.0 and shares that smart factory implementation is becoming increasingly quick and straightforward with Cimetrix’s approach to automation. Chatterjee also outlines what exhibit visitors can expect to find in the company’s booth.
Optimize Your PCB DFM Processes: Part 3 of Siemens’ Digital Twin Webinar Series
I-007e Micro Webinars recently released a free, on-demand series titled “Implementing Digital Twin Best Practices From Design Through Manufacturing.” Each of the 12 segments can be viewed in about five minutes.
Real Time with...SMTAI 2020: Aegis' Ontology Drives Digital Twin Process
Andy Shaughnessy speaks with Michael Ford, senior director of emerging industry strategy for Aegis Software, about its newest concept—Ontology—which the company will discuss during SMTAI. He also explains how Ontology relates to the company’s existing MES products, as well as how it dovetails with the digital twin process.
Catching up With Cabletree’s Thomas Chang
Dan Beaulieu has always been interested in exploring the wire harness and cable areas business, so he jumped at the chance to talk with Thomas Chang, the president and owner of Cabletree. Here, they discuss the cable assembly segment and how Cabletree serves EMS companies.
Real Time with… SMTAI 2020: SCHUNK Brings New Router to SMTA International
Nolan Johnson connects with SCHUNK Electronic Solutions’ Tom Herndon, regional sales manager, to discuss the company’s upcoming exhibits at SMTAI. Tom shares what visitors to SCHUNK’s booth can expect to find, including a virtual walking tour of the company’s headquarters facility in Germany. Tom also previews SCHUNK’s newest router, ideal as an entry-level router for shops looking to upgrade or automate.
Real Time with… SMTAI 2020: Insituware Offers Handheld Process Controls for the Smart Factory
Nolan Johnson speaks with Insituware CEO and Chief Engineer Michael Frederickson. Insituware’s expertise in materials control and measurement brings some innovative new handheld measurement devices to the manufacturing floor. Mike and Nolan discuss how these new devices contribute to accuracy, compliance, and real-time process optimization—all key factors in the smart factory environment. Mike also teases what the company will demonstrate in their virtual booth at SMTAI.
Just Ask Eric: Nano-Coating on Stencils?
First, we asked you to send in your questions for Happy Holden and Joe Fjelstad in our “Just Ask” series. Now, it’s Eric Camden’s turn! A regular SMT007 columnist, Eric is a lead investigator at Foresite Inc., an analytical testing and consulting laboratory. As a reliability expert, Eric has worked with many large OEMs and contract manufacturing companies to optimize their manufacturing processes. Today's question involves the use of nano coatings on stencils.
Real Time with…SMTAI 2020: SMTA International Goes Virtual
Nolan Johnson connected with three SMTA principals—KYZEN’s Debbie Carboni, SMTA’s Ryan Flaherty, and Rockwell’s Greg Vance—to discuss the upcoming 2020 SMTA International (SMTAI) event, the first major electronics manufacturing conference and exhibition to go virtual this year. The panel gives an overview of exhibits, technical conference presentations, and professional networking in this new format. and provides some coaching on how to to get the most from this virtual event.
Real Time with…SMTAI 2020: Koh Young on New Products and the Role of AI
Nolan Johnson speaks with Joel Scutchfield, director of sales for the Americas, about Koh Young's exhibit at SMTAI. Scutchfield outlines all the new products being displayed in the virtual booth and discusses the increased role that the company sees for AI in their products and the smart factory flow.
Real Time with…SMTAI 2020: KYZEN on How Maximized Stencil Life Improves Yields
KYZEN Executive Vice President Tom Forsythe shares company updates on stencil cleaning with Nolan Johnson. KYZEN recently announced its newest stencil cleaning product—KYZEN E5631. Forsythe details how the product is best used, as well as the benefits it brings to maximizing stencil life and improving manufacturing yields.
What Is Digital Twin Technology, and Why Is It So Important?
Happy Holden describes how Siemens' 12-part webinar series, “Implementing Digital Twin Best Practices From Design Through Manufacturing,” is an excellent series designed to educate the electronic manufacturing engineer on the progress of using a digital thread to improve products and performance.
Improving Tech Support During a Pandemic
Koh Young’s Quintin Armstrong, senior manager of technical services and applications for the Americas, discusses the work that has been going on at the company around field support, including pre- and post-sales support training, and how those areas have been affected by COVID-19.
This Month in SMT007 Magazine: Robustness Is Not the Same as Reliability
Bob Neves discusses a disconnect he sees in reliability testing between what’s being tested and what happens out in the field, as well as why most reliability tests these days should instead be considered robustness tests.
Organizational and Team Management in Times of Change
Ross Berntson, president and COO of Indium Corporation, shares his perspective, thoughts, and lessons learned on managing his global organization as Indium Corporation responds to health issues, market demand shifts, and organizational change. This interview was conducted in May 2020.
An EMS Perspective on Inventory Management
Foad Ghalili of Epoch International discusses the inventory management practices the company has in place between its two facilities in Fremont, California, and Dalian, China; and how upgrading to an electronic management system made maintaining a much larger inventory possible.
Real Stories of Applied Advanced Analytics in the Electronics Manufacturing Smart Factory
The smart factory is starting to become a reality, as part of the overarching Industry 4.0 paradigm. With the technology enablers, such as industrial IoT (IIoT) and cloud computing, electronics manufacturing operational technology (OT) are on a converging course with traditional information technology (IT). Beyond the challenges of data acquisition and transformation, the true “proof in the pudding” is in the quick ROI from advanced analytics. We will share examples of successful, profitable implementation of applied machine learning (ML) in the electronics manufacturing line, where measurement science meets data science.
Just Ask Joe: The Occam Process
First, we asked you to send in your questions for Happy Holden. Now, it’s Joe Fjelstad’s turn! Inventor, columnist, instructor, and founder of Verdant Electronics, Joe has been involved with rigid PCBs and flexible circuits for decades, and he’s ready to share some of his knowledge with our readers. We hope you enjoy “Just Ask Joe.”
Increase Traceability, Prevent Counterfeiting
Michael Ford, senior director of emerging industry strategy for Aegis Software and I-Connect007 columnist, speaks about the increasing importance of traceability in manufacturing and throughout the supply chain, including how it affects such areas as counterfeit components and inventory management.
Just Ask Joe: The Land Warrior Project
First, we asked you to send in your questions for Happy Holden. Now, it’s Joe Fjelstad’s turn! Inventor, columnist, instructor, and founder of Verdant Electronics, Joe has been involved with rigid PCBs and flexible circuits for decades, and he’s ready to share some of his knowledge with our readers. We hope you enjoy “Just Ask Joe.”
8 Measures for Sales and Operations Planning in Turbulent Times, Part 5
In this series, CEPHAS principal Fane Friberg highlights the interdependent elements of an effective S&OP process for leaders of supply chain management. While some companies tend to fall back on the status quo, Freiberg highlights why it’s critical to actually increase the frequency of the S&OP rather than decrease the operations. He has reviewed the importance of staying committed, strategic imperatives, participation, and technology. Today, he discusses rough-cut capacity planning.
Handling Supply Chain Disruption in Silicon Valley
Nolan Johnson spoke with Najat Badriyeh, CEO and president of Naprotek, about the current state of the supply chain as a contract manufacturer in Silicon Valley, adjustments the company has made, and what she anticipates for the future.
Navigating the Current Supply Chain
Robb Engle, executive VP of Sono-Tek, and Nolan Johnson discuss what the company has seen as far as supply chain challenges and changes to respond to in the past few months in response to COVID-19 and its related effects.
This Month in SMT007 Magazine: Electronics Manufacturing—A Critical Industry and Supply Chain
Chris Peters represents the U.S. Partnership for Assured Electronics, where he advocates for electronics manufacturing as a critical industry. Here, he describes the current status, the supply chain, and what he sees in Washington, D.C.
Dr. Ron Lasky: A Solder Alloy and Solder Paste Overview
The I-Connect007 editorial team spoke with Dr. Ron Lasky about why the world has not embraced some of the exciting alloys that companies like Indium Corporation have developed. He also provides an overview of solder alloys, including the difficulty of qualifying SAC305.
MTV Offers Solder Paste Testing Solution
The miniaturization test vehicle (MTV) is a common benchmark test board that can gauge about 25 different paste properties and analyze how different solder pastes will perform in an assembly line. Chrys Shea details the work she’s done to develop and release the MTV.
Burak Aksoy: An Update on DOWSIL EA-3838 Fast Adhesive
On June 10, Nolan Johnson spoke with Burak Aksoy, technical service and development scientist for Dow Silicones. Aksoy updated Johnson on the recent introduction of DOWSIL™ EA-3838, a fast-curing adhesive formulated for use in industrial manufacturing and assembly applications.
The iNEMI 2019 Roadmap: Flexible Hybrid Electronics
The emerging trend for “electronics on everything, everything with electronics” was the theme of iNEMI’s webinar presentation of the highlights of its recently published Flexible Hybrid Electronics Roadmap Chapter, delivered by Girish Wable, senior engineering services manager with Jabil. Pete Starkey provides an overview.
Check Out the 3D June SMT007 Magazine Cover
How much can we really trust what we see? As the cover of this issue of SMT007 Magazine reminds us, there's often much more going on than meets the eye.
This Month in SMT007 Magazine: Leaning on Leadership
It goes without saying that in times of crisis or great uncertainty, we often look to those in leadership positions to guide us and give us direction. In this interview with Barry Matties and Nolan Johnson, Tom Forsythe, executive VP of KYZEN, shares his insight on leadership and what he believes makes a good leader.
The iNEMI 2019 Board Assembly Roadmap
iNEMI continues to publish chapters of its 2019 Roadmap and recently presented an overview of its Board Assembly Roadmap Chapter in a webinar prefaced by Grace O’Malley, vice president of global operations. The new chapter is just the latest addition to this global effort from 23 working groups contributing expert input from all aspects of the electronics industry.
High-reliability, Low-temperature Solder Alloys
Increased digitalization and greater connectivity have been driving miniaturization and more complex and integrated designs in electronics. As the real estate on PCBs shrinks, so does the size of packages. However, the drive for finding design solutions for increased performance has continued to expand. The solder joint is an essential part of assemblies for electronic devices as it provides electrical, thermal, and mechanical connections. Therefore, soldering materials have been evolving to enable such a technological revolution.
This Month in SMT007 Magazine: How Engineers Can Use SPI Tools for Verification
Koh Young’s Ray Welch and Brent Fischthal detail how engineers can work with SPI tools to verify how small they can go in component size with their solder paste application, and how the company’s SPI equipment is helping not only to verify but also to help drive the development collaboration between solder paste and stencil printer manufacturers, and inspection tools and software.
‘Coatings Uncoated!’ Micro-webinar Series Review
I-Connect007 collaborated with Electrolube’s Phil Kinner to create a 12-part series of 5-minute micro-webinar sessions entitled “Coatings Uncoated!” offering the opportunity to gain a comprehensive basic understanding of the technology of conformal coatings, chemical types and application techniques, benefits and limitations, and the practicalities of where and how to use them.
Smart Factory Implementation, Part 2
During one of our recent interviews, conducted as government leaders around the globe were issuing lockdowns, an industry expert had to pause and whisper some gentle and loving “goodnight and sleep well” words to a small child who was headed off to bed. Under these conditions, we’re working with our families and loved ones gathered close. It reminds me that we all have people for whom we do our work, strive to build successful businesses, and make the world a better place.
The Convergence of Technologies and Standards in Smart Manufacturing
Ranjan Chatterjee of Cimetrix and Daniel Gamota of Jabil teamed up to bring you this article, originally published as the paper "The Convergence of Technologies and Standards Across the Electronic Products Manufacturing Industry (SEMI, OSAT, and PCBA) to Realize Smart Manufacturing."
Case Study: Example of ASKEY Applying QML Validation
The PCB007 China team paid a visit to the ASKEY plant in Wujiang, Jiangsu, to learn more about their QML process. In this interview with Qixian Zhang, vice GM of ASKEY’s Electronics Product Quality Assurance Department, he discusses what QML means to ASKEY and the electronics industry as a whole.
Process Ionic Contamination Test (PICT) Standard Roundtable With Industry Experts
With standards committees set to release the first of four new test standards, industry experts discussed the process ionic contamination test (PICT) standard, which was recently approved by the IEC for publication. Roundtable participants included Teresa Rowe, senior director of assembly and standards technology at IPC, Graham Naisbitt, chairman and CEO of Gen3, Jason Keeping, corporate process development at Celestica, and Doug Pauls, principal materials and process engineer at Collins Aerospace.
Automation War Stories From ICM Controls
Members of the I-Connect007 editorial team met with Andy Kadah, president of ICM Controls, and Kevin Jobsky, senior marketing manager, via teleconference on March 20, 2020. Originally, the purpose of our conversation was to discuss factory automation implementation details. Yet, we conducted the interview in the midst of a rapid-fire and wide-ranging onslaught of executive orders from the federal level on down to the local level meant to curb the spread of the coronavirus.
IPC Europe Shares Technical Education and Standards Awareness
Against a background of COVID-19 uncertainty and unprecedented challenges, but recognizing the vital importance of continuing to educate engineers and share the knowledge and skills required to manufacture boards and assemblies of the highest yields and reliability, the IPC Europe team hosted a technical webinar for the European electronics industry, featuring the expertise of two of I-Connect007’s regular columnists: Mike Carano and Jan Pedersen. Pete Starkey provides an overview.
Cimetrix Helping to Digitize Factories
Dan Feinberg met with Cimetrix’s Ranjan Chatterjee to discuss how their new Sapience software allows factories to establish communication with a wide variety of equipment across multiple lines and multiple facilities across the whole industry.
SMTA Europe’s Electronics in Harsh Environments Conference and Exhibition: A Taste of Things to Come
SMTA Europe’s Electronics in Harsh Environments Conference has become a must-attend annual event; unfortunately, it also became another casualty of the COVID-19 lockdown. Scheduled to take place in Amsterdam, the Netherlands, from April 21–23, 2020, it has now been postponed until December 1–3. Pete Starkey reports on a preview seminar presented by SMTA Europe.
Stencil Cleaning Update With Tom Forsythe
In this video interview from the show, Pete Starkey and Tom Forsythe, executive VP of KYZEN, which celebrated its 30th anniversary, discuss the practicalities of stencil cleaning and describe the characteristics and capabilities of KYZEN's newest versatile stencil cleaning product.
Panasonic: From Hardware to Solutions and Data
In this video interview from the show, Managing Editor Nolan Johnson speaks with Sean Murray—director of sales, service, operations, and logistics process automation at Panasonic—about the company's focus on software and information management on top of their long history in hardware and equipment.
Greg Vance to Serve as SMTA Interim President
Nolan Johnson talks to Greg Vance about taking over the SMTA Board President's role through September. Discussion includes an update on multiple board chair changes, and an update on the board's work to achieve their current set of objectives.
'Coatings Uncoated!' Webinar Series and Automotive Industry Trends
Phil Kinner, global business/technical director of Electrolube’s coatings division, tells Pete Starkey about the positive impact of the “Coatings Uncoated!” webinar series and comments on how the company has responded to the changes in the focus of the automotive industry.
Phil Kinner on Sharing Expertise With the Industry
In this video interview from the show, Technical Editor Pete Starkey speaks with Phil Kinner, global business/technical director of Electrolube's coatings division, about the positive impact of the "Coatings Uncoated!" webinar series. They also discuss some of the ways that the company has responded to recent changes in the focus of the automotive industry.
The Next Generation: 2K Conformal Coatings
In this engaging, 12-part webinar series, Kinner examines conformal coating chemistries in further detail, including their properties, applications, issues to be mindful of, and the processes you should follow to achieve a successful coating outcome. The entire “Coatings Uncoated!” webinar series can be viewed in an hour and covers a comprehensive range of hot topics and application-relevant case-study overviews, as well as back-to-basic subject matter and issues, such as condensation and contamination. Most of the 12 segments can be viewed in five minutes or less.
Watch & Learn! Latest Installment of I-007e Micro Webinar Series Features EV Charging Controller Case Study
The eleventh episode of the popular micro webinar series “Coatings Uncoated!” is now available to view. In “Cycle Time Constrains Coverage,” topic expert Phil Kinner from Electrolube examines the trade-off between cycle time and coverage required while considering an electric vehicle charging controller case study. If you are in the assembly business, an EMS company, or responsible for specifying conformal coating and/or encapsulation, then this free series is for you.
This Month in SMT007 Magazine: Business Practices Drive the Smart Factory, Not the Other Way Around (Part 1)
In Part 1 of this conversation, Sagi Reuven— business development manager at Mentor, a Siemens Business—makes the case that smart factory implementations must start with traditional process analysis and improvement before the data capture process is useful. He also covers how sometimes the key to utilizing Industry 4.0 comes from a change in mindset rather than a drastic change or investment in new equipment or processes.
Watch It! The Perils of Technology Transfer (Selective Spray vs. Selective Dip Application)
The tenth episode of the popular micro webinar series “Coatings Uncoated!” is now available to view. Author of The Printed Circuit Assembler’s Guide to...Conformal Coatings for Harsh Environments and topic expert Phil Kinner from Electrolube shares highly focused educational information on conformal coating and encapsulation. If you are in the assembly business, an EMS company, or responsible for specifying conformal coating and/or encapsulation, then this free series is for you.
Trends From the Show: Solder and Software
In my role as a media representative, my perspective on IPC APEX EXPO may be a bit different from that of many attendees. Since the I-Connect007 team had the opportunity to talk to many attendees and exhibitors and listen to their stories over the course of the week, our view can be particularly wide. When I reflected on all the conversations, pieces from all throughout the week coalesced and provided a different understanding of and takeaway from the show.
IPC APEX EXPO 2020 Attendees Speak: Camille Sybert
"There’s a need for flexible solutions, so people are trying to make the most of the equipment that they buy, and they want to have the equipment that’s able to be flexible in scale with what it is that they’re looking for," said Camille Sybert of Nordson Electronics Solutions. "We have customers asking about future capabilities that they might not be ready for right now, but they want to know that it’s something that can be easily integrated into their processes in the future, as they’re in a position to better be able to do so."
Take Advantage of e-Education: Watch Free Webinar Series ‘Coatings Uncoated!’
The ninth episode of the popular webinar series “Coatings Uncoated!” is now available to view. In this new segment, viewers will learn about an automotive-based application (engine management system). Over a period of two years, the number of field failures escalated beyond all accepted levels, and a new solution was required. Phil discusses the finer details of this interesting case study.
Oren Manor: Mentor Leading Way for Industry 4.0
In this video interview from the show, Guest Editor Steve Williams talks with Oren Manor—director of business development at Mentor, a Siemens Business—about Industry 4.0, robotics, and other applications. They also addressed integration of Mentor's CAD/CAM solutions with Siemens' mechanical offerings.
Watch & Learn! Latest Installment of I-007 Micro Webinar Series Covers UL Approvals: Aerosol Spray Technology
The eighth episode of the popular webinar series “Coatings Uncoated!” is now available to view. In this segment, viewers will learn about a customer application involving aerosol spray coating. The customer reported failures due to arcing, creepage, and corrosion. Kinner explains the relevance of UL approvals and progresses through the details of the case study.
Joe Fjelstad Breaks Down His Occam Process
Joe Fjelstad recently met with the I-Connect007 Editorial Team to discuss the potential benefits of his Occam process for solderless assembly. This technique allows assembly of the PCB without the risks associated with traditional surface-mount processes, such as solder joint failure. Has the time come for the industry to embrace Occam?
This Month in SMT007 Magazine
We recently surveyed readers on the topic of smart factories, specifically exploring reader perceptions of what a smart factory entails, along with implementation plans that may be on readers’ minds. Looking at how respondents ranked their top three from this list of 10 objectives, some patterns do emerge.
IPC APEX EXPO 2020 Attendees Speak: Mike Montesi
"One of the biggest challenges for me selling is educating customers that they can generate oxygen and nitrogen on their own for up to 90% savings versus getting trucked in deliveries," said Mike Montesi of On Site Gas Systems. "It’s all about education because 98–99% of customers are used to the high cost of delivered gases, where we can separate it on-site with their own equipment, and the payback is typically under a year."
Stencils: Not As Simple As They Seem
Stephanie Hardin of Integrated Ideas and Technologies Inc. discusses her role in the supply chain as a stencil manufacturer, improvements she sees from micromachined step stencils, and why she believes trying to have standardized stencil layouts is wishful thinking due to the many fluctuating variables.
I-007e Micro Webinar: Primary Flight Control Case Study on Condensation and Coverage
The seventh episode of the popular webinar series “Coatings Uncoated!” is now available to view. Author of "The Printed Circuit Assembler’s Guide to Conformal Coatings for Harsh Environments" and topic expert Phil Kinner from Electrolube shares highly focused educational information on conformal coating and encapsulation. If you are in the assembly business, an EMS, or responsible for specifying conformal coating and/or encapsulation, then this free series is for you.
The Success of IPC’s STEM Student Outreach Program
The IPC Education Foundation (IPCEF) hosted its STEM Student Outreach Event on February 6 at IPC APEX EXPO in San Diego. Nine local high schools attended bringing 193 students and 30 educators from Mission Hills High School, Morse High School, North County Trade Tech High School, Saint Marcos High School, E3 Civic High School, Point Loma High School, Otay Ranch High School, Mount Miguel High School, Otay Ranch High School—Girls in STEM. Twice as many students were able to participate this year, and each participating high school received a $1,000 grant and soldering station to enhance STEM-related learning at their school.
Watch Coatings Uncoated Webinar, Part 6 Now: Field Failures, Silicon vs. Sulfur
The sixth episode of the popular webinar series, "Coatings Uncoated," is now available to view. Based on an interesting case study concerning a telecommunications giant experiencing a high degree of field failures, coatings specialist Phil Kinner explains the mechanism behind the failures and why the silicone option proved unsuccessful. Part six of this micro webinar series concludes with a full explanation of the successful solution.
Solder Paste Printing From the Stencil’s Perspective
Jeff Schake of ASM Assembly Systems discusses the complications surrounding printing and solder paste that he sees from his perspective as a stencil expert.
Will Moisture Management Expand to the U.S. Market?
Rich Heimsch, Super Dry director, chats with Nolan Johnson about the growing demand for moisture management in North America versus its earlier adoption in Europe, and how moisture management fits into Industry 4.0 and the smart factory.
IPC APEX EXPO 2020 Attendees Speak: Joel Scutchfield
"Based on traffic and attendance, we have had a great week. We had 40+ more scans than what we did last year at this point, and we’re waiting for the final tally today," said Joel Scutchfield, Koh Young's director of sales for the Americas.
IPC Government Relations: Focus on Supply Chain Resiliency
During IPC APEX EXPO, Editor Nolan Johnson sat down with Chris Mitchell, VP of global government affairs, to discuss IPC’s latest initiative with industry intelligence programs. As Chris explains, some of these efforts are focused on improving the DoD’s supply chain. This includes moving the DoD from leaded to lead-free components to help avoid millions of dollars in rework. He also discusses the team’s drive to unite with partners around the world and create a truly global organization.
Watch and Learn: Not All Acrylics Are Created Equally
How can additional data, including test results, ensure a greater understanding of the most suitable coating for your application? The fifth episode of the popular webinar series, "Coatings Uncoated," is now available to view. Author of "The Printed Circuit Assembler’s Guide to Conformal Coatings for Harsh Environments" and topic expert Phil Kinner from Electrolube shares highly focused educational information on conformal coating and encapsulation.
LPKF on Stencils and Depaneling
Stephan Schmidt and Mirela Orlowski of LPKF Laser & Electronics North America discuss laser technology in cutting stencils and depaneling circuit boards as a factor in shrinking component sizes and why few people in the industry realize how much of an impact the stencil can have on the manufacturing line.
True or False: CFX Edition
Since the release of IPC-2591—Connected Factory Exchange (CFX), Version 1.0—there has been a lot of buzz regarding CFX within the industry from all segments. Still, with all of the buzz, there are also some misconceptions floating around the industry regarding CFX. David Bergman takes some of those statements, using feedback from Subcommittee members, and plays a little game of “True or False: CFX Edition.”
I-007e Micro Webinars Releases Part 4 in ‘Coatings Uncoated!’ Series
What is creepage, and how does it impact clearance? Can conformal coatings reduce creepage? The fourth episode of the popular webinar series, Coatings Uncoated, is now available to view. Author of The Printed Circuit Assembler’s Guide to Conformal Coatings for Harsh Environments and topic expert Phil Kinner from Electrolube shares highly focused educational information on conformal coating and encapsulation.
Upcoming IPC APEX EXPO Offers Sessions on 5G
Dave Hoover of TTM discusses the Sessions @ the Intersection set for IPC APEX EXPO 2020—specifically, the two-part session he will host around the topic of 5G and materials.
IPC Solder Stencil Task Group—Inviting OEM Input to IPC APEX EXPO Meeting
Jeff Schake of ASM Assembly Systems is chairman of IPC’s Solder Stencil Task Group. In this conversation with Nolan Johnson and Barry Matties, Jeff discusses what they will be meeting about at the upcoming IPC APEX EXPO.
I-007e Micro Webinars Releases Part 3 in ‘Coatings Uncoated!’ Series
Have you ever wondered about the process of corrosion and the formation of tin whiskers? The third episode of the popular webinar series, "Coatings Uncoated," is now available to view. Author of "The Printed Circuit Assembler’s Guide to Conformal Coatings for Harsh Environments" and topic expert Phil Kinner from Electrolube shares highly focused educational information on conformal coating and encapsulation.
CES: The Main Halls
CES 2020 is now over, and the next round of shows is underway (NAMM is also over now, IPC APEX EXPO is next week, followed by AWE and others). CES displayed electronics related to gaming, monitors, computers, smartwatches, TVs, vehicles, cellphones, etc. However, the effect on the industry and the way we live will be felt until the next CES. The largest and most influential participants are usually found at the Las Vegas Convention Center.
New From I-007e Micro Webinars: Part 2 in ‘Coatings Uncoated!’ Series
Got five minutes? Watch Phil Kinner's the latest segment, Never Underestimate the Importance of the Application Process, which examines the pivotal role that application plays in the overall success of coating, and presents a great opportunity to grasp the importance of the process.
Foundations of the Future: Get More Engaged in 2020
Since the inception of the IPC Education Foundation in January 2019, the mission remains to create connections between electronics manufacturers and supply chain companies, academia and the emerging workforce. In this debut column, Charlene Gunter du Plessis describes plans for engaging in 2020, including scholarships and more, and the IPC APEX EXPO 2020 STEM Student Outreach event.
New From I-007e Micro Webinars: The 5-Minute Webinar Series
I-Connect007 takes the on-demand webinar to a new level. A perfect companion to our I-007 Micro eBook series, these bite-sized webinars are released weekly, exclusively at I-Connect007, and are also available all at once for those who can’t wait for the next installment.
CFX Preview at IPC APEX EXPO 2020
The I-Connect007 Editorial Team chats with IPC’s Chris Jorgensen about the advances CFX has made in the past year and where the standard is in the standardization process. Chris also previews the CFX line that will be on display at the upcoming IPC APEX EXPO and shares IPC’s plans on educating and providing support solutions to potential users of CFX to implement it more easily.
Updates on Cleaning Standards and Committees
Graham Naisbitt of Gen3 discusses the changes he's seeing in cleaning, including how the WP-019 white paper has caused a closer look at electrochemical reliability. As a long-time head of committees, Graham also breaks down many of the topics he hopes are addressed at this year’s IPC APEX EXPO.
What You Need to Know About a PCB Design Career
Never stop learning. Why? Because the industry never stops changing. Those that continuously stay in that state of learning are the ones who succeed. The old saying “Knowledge is power,” often attributed to Sir Francis Bacon, has never been truer. Fortunately, there is never a lack of things to learn. Don’t ever become apathetic about learning. Make a point of keeping a running list of ideas or subjects that you want to research, and then purposely set aside time in your week strictly to study and learn about these things anywhere you can.
How to Become a Certified IPC Trainer
The Blackfox Certified IPC Trainer (CIT) programs are best suited for experienced and skilled electronics technicians, engineers, and supervisors who have the will and passion to teach and train colleagues about the quality standards of IPC. They also provide successful candidates with a credential that confirms their knowledge and understanding of IPC quality systems.
Clean vs. No-clean: A Generational Difference
Tom Forsythe, executive VP of KYZEN, discusses what readers should know about cleaning as reliability expectations continue to increase. He also explains what is driving the new interest in cleaning and why engineers from the no-clean generation may not even realize they need to learn more about cleaning.
MacroFab: Manufacturing Digitized
MacroFab CEO Misha Govshteyn explains how a digital manufacturing platform connected to a network of vetted partner factories can help eliminate a lot of variability from the fabrication process.
UV-curable Materials and Conformal Coatings
Pete Starkey and Phil Kinner, global business and technical director, coatings division, Electrolube, discuss the characteristics and benefits of the company’s new UV-cured conformal coatings. Phil also describes the development of coatings for critical avionics applications and Electrolube’s collaboration with the U.K. National Physical Laboratory to establish a new condensation test.
BTU Discusses its Next-generation Flux Management System
At productronica 2019, Nolan Johnson spoke with Peter Franklin, managing director of BTU Europe, about BTU’s next-generation solder reflow flux management system—Aqua Scrub. A winner of the show’s Global Technology Award for Soldering, Peter breaks down the specifics of what makes Aqua Scrub such an intriguing technology.
A Walking Tour of Mycronic Equipment at productronica 2019
I-Connect007 pays a visit to the Mycronic booth at productronica 2019 in Munich, and Jeff Leal, product manager for Mysmart, takes us on a walking tour of just one of the lines on display at the show. Jeff takes us through a series of dispensing and conformal coating machines.
Practical Verification of Void Reduction Method for BTC Using Exposed Via-in-pad
The method explored in this article regards the use of exposed via-in-pad. A dedicated test vehicle was designed for two types of QFN components. The main variables accounted for were the component size, number of exposed vias in the thermal pad, via pitch, via size, and solder paste coverage. The responses sought in this experiment include a thermal pad void level and solder wicking down the via barrel with resulting solder protrusion on the opposite side of the PCB.
Reliability Testing in Automotive and Digital Factories
Barry Matties spoke with Gen3’s Andrew Naisbitt about what readers should know about SIR and CAF testing, what to consider if you’re thinking of bringing it in-house, and how reliability testing fits into automotive and the digital factory.
LA/Orange County SMTA Expo and Tech Forum Review
Dan Feinberg recently attended the LA/Orange County SMTA Expo and Tech Forum, which was held in Long Beach, California. He provides an overview of the activities, from the show floor to the presentations.
The Digital Medical Revolution
Zulki Khan, founder and CEO of NexLogic Technologies Inc., offers his unique perspective on manufacturing trends as a PCB turnkey solutions provider based in Silicon Valley. He discusses additional requirements that are now necessary to compete in different industry sectors, most notably medical, which he says is set for a “digital revolution.”
KYZEN on Stencil Cleaning
In this video interview, part of the productronica 2019 coverage, we spoke with Tom Forsythe, executive VP for KYZEN. The discussion revolves around the challenges of stencil cleaning, particularly as aperture sizes continue to decrease. Tom also introduces KYZEN’s E5631 aqueous-based stencil cleaner.
David Meyers on Digital Twin and ‘Cobots’
With over 30+ years in the industry, David Meyers recently took on a new role at Siemens as a global solutions director in the Electronics Industry team of Siemens Digital Industries Software, working on improving communications between CMs and their OEM partners. In a conversation with Nolan Johnson and Happy Holden, David speaks on the digital twin and virtual environment software that should help establish that communication early in the process.
Digi-Key on Adapting to the Changing Industry Landscape, Pt. 1
The I-Connect007 editorial team recently spoke with Chris Beeson, executive vice president of global supplier and new business development at Digi-Key Electronics, about trends and the changing landscape of the industry. Beeson describes how Digi-Key is looking to continue growing its user community as a design service provider while providing greater services for the entire PCB.
Requirements of Being a MIL-certified Shop
Barry Matties speaks with American Standard Circuits’ VP of Business Development David Lackey, who has nearly 40 years of experience producing PCBs for the mil/aero market. David talks about what it’s like being a MIL-certified shop and the stringent quality and reporting requirements that it entails.
Explaining the QSFP-DD Data Center Interconnect Standard
According to Cisco’s report, most IP traffic either originates or terminates in data centers. Yet as massive as the flows between centers are becoming, the data managed within those same facilities is going even higher. All of this activity means that “hyperscale” is the word of the future. Roughly one-quarter of all servers installed in 2016 went to hyperscale facilities, but that number will grow to almost one-half by next year.
Meet Ray Prasad, SMT007 Columnist
Meet Ray Prasad, one of our SMT007 columnists! Prasad’s columns explore DFM, manufacturing processes, yield improvement, quality control, IPC standards, and much more.
The Ecosystem of Industry Standards
I-Connect007 reached out to representatives from several industry standards organizations and talked with them about how they participate in the standards process. Along the way, these conversations clarify which group does what, how they all work together as well as clarify and dispel a couple of industry myths.
Juan Arango on Koh Young’s New U.S. Headquarters
At a recent open house, Managing Director Juan Arango talks about his role in the company’s transition from their Arizona facility to a new headquarters located outside of Atlanta, Georgia. Juan details many of the benefits customers can expect, including brand new spaces dedicated to customer demos as well as training.
Meet Zulki Khan, SMT007 Columnist
Meet Zulki Khan, one of our newest SMT007 columnists! Khan’s columns address new frontiers in upcoming manufacturing techniques, including challenges in the marriage of SMT and microelectronics manufacturing and the critical aspects involved.
Discover the Benefits of a Technology Center
Nico Fahrner, application engineer at Rehm Thermal Systems, talks with Barry Matties about the benefits prospective customers get from being able to fully test their systems in-line at Rehm’s technology centers before purchasing.
Catching up With Niche Electronics
Niche Electronics President Frank Bowman speaks with Dan Beaulieu about his company, their services, how they help their customers, and their plans for the future.
SMTAI 2019: Michael Ford on IPC-CFX and the Effects of Industry 4.0
Michael Ford, senior director of emerging industry strategy at Aegis Software, and Nolan Johnson discuss some of the long-term, global effects of Industry 4.0 and life beyond IPC-CFX.
SMTAI 2019: Nir Benson Discusses Mentor's Challenges and Solutions
Nir Benson, business development manager at Mentor, a Siemens Business, talks with Andy Shaughnessy about his work to integrate the two companies' solutions, some of the challenges he sees, and his efforts to optimize their cloud-based systems.
SMTAI 2019: Happy Holden’s On-the-Scene Report
Last week concluded the 2019 SMTAI conference in Rosemont, Illinois. Overall, I think the show was successful and covered all aspects of SMT processes.
Real Time with… SMTAI 2019 Slideshow
The SMTA International 2019 Conference and Exhibition closed last week on a high note. For those who were not able to attend the event, held at Stephens Convention Center in Rosemont, Illinois, the slideshow contains a selection of photos from the exhibition show floor as well as the conference.
SMTAI 2019: Technical Sessions Overview and 2020 Preview
Karlie Severinson, SMTA events and administrative manager, gives Nolan Johnson an overview of the SMTAI 2019 technical sessions and plans for next year's event.
IPC Panel on Bottom-terminated Components
During the IPC Summer Meetings in Raleigh, North Carolina, I sat down with Tom Rovere, a materials and process engineer at Lockheed Martin in Owego, New York. We explored a panel discussion on bottom-terminated components (BTCs) that Tom participated in as well as the challenges and issues related to BTCs and the important role that designers play in that process.
Real Time with... SMTAI 2019 Videos Now Live
If you couldn't make it to SMTAI 2019, be sure to catch I-Connect007’s video interviews with the movers and shakers of the electronics industry. We’ve updated our video presentation for a better experience for our users, so check it out!
Standards Through Time: Changing to Stay the Same
The use of standards has, ultimately, propelled civilization forward. As the electronics manufacturing industry works to create, revise, update, and restructure standards, it helps to take a moment to review how standards, and the process of creating them, have occurred throughout history.
Combating ESD: The Silent Assassin in Electronics Manufacturing
ESD is a constant but invisible force within electronics manufacturing that can have a powerfully detrimental impact on production yield, product and product reliability, and company profitability. And as the circuitry within electronic devices continues to get faster, smaller, and more sophisticated, their sensitivity to the effects of ESD is only likely to increase.
The Long Road to a New Standard
Graham Naisbitt, chairman and CEO of Gen3 Systems, has spent decades leading cleanliness testing standards in a number of different standards organizations like IPC, IEC, and ISO around an assortment of testing methods, such as CAF, SIR, and even introducing a new standard this year for his own testing method—process ionic contamination testing (PICT). Naisbitt breaks down his long involvement with standards and where they stand currently.
The Convergence: IPC Merging CFX With IPC-2581
Gary Carter of XPLM and Michael Ford of Aegis Software are heading a group tasked with combining the IPC-2581 standard, now referred to as Digital Product Model Exchange (DPMX), with IPC’s Connected Factory Exchange (CFX). In this interview, they discuss the benefits that can be expected when these standards are fully merged for both PCB designers and process engineers on the manufacturing floor.
How Digitalization Is Transforming the Electronics Manufacturing Industry
The rise of the "digital" supply network—such as the cloud, big data, 3D printing, augmented reality, or the internet of things (IoT)—promises to address issues such as increasing global competition, rising consumer expectations, and the increasingly complex patterns of consumer demand, by providing a greater level of transparency, innovation, and resiliency. And there is a growing belief among business strategists that the more digitalized our manufacturing supply chains can become, the greater our efficiency will be.
Comparing Soldering Results of ENIG and EPIG Post-steam Exposure
Electroless nickel immersion gold (ENIG) is now a well-regarded finish used to enhance and preserve the solderability of copper circuits. Electroless palladium immersion gold (EPIG), meanwhile, is a new surface finish also for enhancing and preserving solderability—but with the advantage of eliminating electroless nickel from the deposit layer. This feature has become increasingly important with the increasing use of high-frequency PCB designs whereby nickel’s magnetic properties are detrimental.
Selecting the Proper Flex Coverlayer Material
Coverlayers are polymer materials used to cover and protect the copper traces of the flex circuit product. There are a number of different options available for protecting the circuits, and they serve different design requirements in terms of cost, performance, and flexural endurance optimization. When specifying the choice, it is critical to call out not just the type of coverlayer material but also the thickness requirement. This can be very important in certain types of constructions, especially when a flex circuit will experience dynamic flexing during use.
eSMART Factory Conference 2019, Day 2
Happy Holden continues his report on the the eSMART Factory Conference Dearborn, Michigan, with highlights from the event's second day, which includes a keynote from Brian Toleno titled "Augmented Reality: Next-Generation Computing for Front-Line Workers."
Meet Our Newest Columnists From NCAB Group
Meet our newest I-Connect007 columnists from NCAB Group! Jeff Beauchamp, Ruben Contreras, and Harry Kennedy are field application engineers from NCAB Group's technical team. In their columns, they will explore fresh PCB concepts, including medical and telecommunications applications, topics related to RoHS, and much more.
Automated Conformal Coating of CCAs Using Polyurethane
The development of an automated circuit card assembly (CCA) conformal coating process using a low-outgassing polyurethane material was essential for meeting the increase in customer demand from 3,000 to 60,000 units per year.
Conformal Coating Processes and Trends
The I-Connect007 editorial team spoke with one of Nordson ASYMTEK’s conformal coating experts, Camille Sybert, to discuss where the coating industry is trending and, with the rise of Industry 4.0 and automation, how it is much less about providing the right applicator and more about addressing the entire conformal coating process.
Dispensing EMI Shielding Materials: An Alternative to Sputtering
Shielding electronic systems against EMI has become a hot topic. Technological advancements toward 5G standards, wireless charging of mobile electronics, in-package antenna integration, and SiP adoption are driving the need to apply more effective EMI shielding and isolation to component packages and larger modules. For conformal shielding, EMI shielding materials for exterior package surfaces have mostly been applied with a PVD process of sputtering, leveraging front-end packaging technologies to back-end packaging applications.
Whizz Systems on Competing in Silicon Valley
Whizz Systems is an EMS provider located in Silicon Valley that has managed to survive and thrive through many of the industry ups and downs of the past two decades. President Muhammad Irfan discusses the company's assembly and design services, as well as trends he’s seeing from the industry in the Valley. He also details how choosing the right type of customer has led Whizz to see sustained success in one of the most difficult and expensive areas for an assembly shop to survive.
Nano Dimension Details New DragonFly LDM
Dan Feinberg talks with Nano Dimension CEO Amit Dror about the new DragonFly LDM 3D printer technology announced by the Israeli company on July 24, 2019, aimed at increasing machine uptime and moving forward from prototyping to higher production volumes.
The Role of Parylene Conformal Coatings in Next-gen Electronics
Designers and manufacturers of electronics are under pressure to make packages smaller, lighter, and more environmentally friendly, while ensuring that their new technologies perform reliably in their operating environments. This article takes a closer look at Parylene conformal coatings and the role they can play in helping manufacturers address current and future challenges in the electronics industry.
Development of Flexible Hybrid Electronics
This article will present a hybrid manufacturing process to manufacture FHE systems with a two-layer interconnect structure utilizing screen printing of silver conductive ink, filled microvias to connect ink traces at the different layers, and use of the traditional reflow process to attach the semiconductor chips to the printed substrates.
Seven Key Steps to Selecting a New EMS Partner
Choosing to outsource your electronics manufacturing to an EMS provider requires careful planning and consideration. And even once you’ve made your decision, there may still be things that test you or that don’t go quite to plan. An experienced EMS partner has been there before; they understand the challenges, and they’ll be able to support you through the process to ensure you achieve your goals.
Conformal Coating Selection: Conventional vs. Two-part
As assemblies become more densely populated, and housing/casing designs become more permeable to save weight, the use of conformal coatings is essential to protect the assembly from its operating environment and ensure acceptable reliability for the application intended, especially when operating in hostile environments.
Which Matters Most: Unit Cost or Total Cost of Supply?
The primary objective for any OEM is to design, manufacture, and deliver high-quality products in the most cost-effective way possible. When demand patterns change, or there is an increase in competition, it can be easy to rely on the calculation of unit cost to relieve the price pressure. But, as many manufacturers are discovering, choosing to base their outsourcing decisions purely on unit cost may not always reap the expected benefits in the long term.
Advancement of SPI Tools to Support Industry 4.0 and Package Scaling
This paper evaluates the current state of inline SPI tools from multiple vendors for solder paste measurement accuracy and capability. It discusses a measurement capability analysis that was carried out against a golden metrology tool across a range of volume deposits, and highlights the results from the study.
While conformal coatings may have been something of an afterthought at the front of the design process, that can no longer be the case. Conformal coatings are now a critical part of any board assembly that might be subjected to challenging conditions. But coatings can also contribute to increased mean time between failure in any conditions, even environmentally controlled environments.
Words of Advice: Making Life Easier for Fabrication and Assembly
In a recent survey, we asked the following question: What steps do you take to make the job easier for your fabrication and assembly providers? Here are a few of the answers, edited slightly for clarity.
Outsourcing Electronics Manufacturing: Key to Growth?
Deciding to outsource part or all of your electronics manufacturing operations could provide the means to increase production capacity and improve your sales lead times. But before you choose to hand over responsibility to an EMS provider, it’s important to take stock not just of the tangible benefits but also of the potential risks.
Practical Implementation of Assembly Processes for Low Melting Point Solder Pastes (Part 2)
In the last three to five years, there has been a resurgence of interest in the use of low melting point alloys for SMT applications. Typically, the compositions are around the eutectic bismuth-tin alloy, perhaps with additions of other elements to increase the robustness of certain alloy properties. Now, there are several new products on the market and numerous ongoing reliability projects in industry consortia.
The Four Things You Need to Know About Test
The electronics manufacturing process can often be extremely complex, and the costs associated with product recalls can be astronomical. A robust approach to test is key to ensuring the quality of your product and the satisfaction of your end user.
Approaches to Overcome Nodules and Scratches on Wire-Bondable Plating on PCBs
Initially adopted internal specifications for acceptance of printed circuit boards (PCBs) used for wire bonding was that there were no nodules or scratches allowed on the wirebond pads when inspected under 20X magnification. This paper details if wire bonding could be successfully performed over nodules and scratches and if there was a dimensional threshold where wire bonding could be successful.
Practical Implementation of Assembly Processes for Low Melting Point Solder Pastes (Part 1)
Since 2006 and the implementation of the RoHS directive, the interest in bismuth-tin solder alloys—whose melting point around 140°C is very desirable because it allows for the use of lower temperature laminate materials and reduces thermal stress on sensitive components—has only increased as the industry has searched for Pb-free alternatives to the chosen standard, SAC305, which melts at considerably higher temperatures than the incumbent tin-lead alloys.
Surface Treatment Enabling Low-Temperature Soldering to Aluminum
An increasingly popular method to meet the need for lower cost circuitry is the use of aluminum on polyester (Al-PET) substrates. This material is gaining popularity and has found wide use in RFID tags, low-cost LED lighting, and other single-layer circuits. However, both aluminum and PET have their own constraints and require special processing to make finished circuits.
Dissecting the IPC Regional Survey on PCB Technology Trends
Sharon Starr, Denny Fritz, and Mike Carano talk about the global 2018 IPC Technology Trends Report released early this year—the size of the survey, how it was conducted, the general findings, and regional differences. They also shared their takeaways and regional insights, and the industry outlook over the next five to 10 years.
Size Matters: The Effects of Solder Powder Size on Solder Paste Performance
Solder powder size is a popular topic in the electronics industry due to the continuing trend of miniaturization of electronics. And the question commonly asked is, "When should we switch from Type 3 to a smaller solder powder?" Read more to find out.
Low-Temperature SMT Solder Evaluation
Until recently, the use of Sn/Bi-based SMT solder materials has been investigated with negative consequences for high strain rate (drop-shock) applications; thus, these alloys have been avoided. Recent advances in alloy 'doping' have opened the door to revisit Sn/Bi alloys as a possible alternative to SAC-305 for many applications.
Cavity Board SMT Assembly Challenges (Part 2)
This article describes the details of a study of assembling SiP BGA packages into a cavity. It points out the challenges involved in the board cavity design and assembly of components in a cavity. The authors discussed the board design challenge of having a cavity and defining the proper depth of the cavity to accommodate the board fabricator, the product design, and the SMT assembly.
Clean vs. No-clean Solder Process
Although IPC suggests clear guidelines, agreeing on the cleanliness (or otherwise) of a PCB assembly can often be a subjective and even contentious subject within the electronics manufacturing industry. If you’ve chosen to outsource your assemblies, how do you decide what to specify to your EMS partner? Find out here.
Smart Manufacturing Roadmap: Data Flow Considerations for the Electronics Manufacturing Industry
The 2019 iNEMI Roadmap features a new chapter on smart manufacturing. The chapter identifies key technology gaps and needs and offers recommendations to guide the electronics manufacturing industry in realizing the benefits of smart manufacturing. This article is based on information excerpted from the chapter.
Digitalization: Key to the Future of Electronics Manufacturing?
Electronics manufacturers have long relied on automation to streamline their production processes. The concept of the smart factory takes this one step further with artificial intelligence (AI), robotics, analytics, big data, and the Internet of Things (IoT) promising an even greater level of autonomy, agility, and connectivity.
Cavity Board SMT Assembly Challenges (Part 1)
The concept behind Component-in-Cavity (CiC) is straightforward. If the tallest component(s) on the motherboard can be placed into a recession created in the motherboard, their thickness relative to the components on the surface of the PCB will thus effectively be reduced. While this concept may be straightforward, its implementation is not. That implementation is the focus of this paper. Read on.
Here's What You Need When Outsourcing Box Build Assembly
Box build, or top-level assembly, can be less well-defined. A box build can mean many things—from a PCBA in a small enclosure to a large cabinet full of wires or a complex fully integrated electromechanical system with electronics and pneumatics. Here's what you will need to consider to get an accurate quote and help the build process go smoothly with your EMS partner.
Data: Key to Automating Right the First Time
Michael Ford, senior director of emerging industry strategy, reflects on his first two years with Aegis Software Corporation and looks to the future of the data-driven manufacturing environment. Michael shares how the CFX and data collection model can play an important role in the streamlining processes, including Industry 4.0 and the supply chain.
The Effectiveness of 75% IPA/25% DI Extraction Solution on No-clean Flux Residues
The continuous challenge in the electronics industry is to keep up with the demand for smaller, faster, and more reliable electronics. When it comes to cleaning, this rapid development of manufacturing and reliability challenges is juxtaposed with the slow pace of new test method development.
Laserssel Brings High-speed Soldering to New Application Areas
In this interview with I-Connect007, Denis Barbini, general manager of Laserssel, talks about the company's new laser-selective reflow solution aimed at reducing a typical reflow oven’s 10-minute cycle down to just 10 seconds as well as the overall benefits manufacturers could see from streamlining this process.
4 Key Considerations When Auditing a New EMS Partner
Choosing whether (or not) to outsource your electronics manufacturing is likely to bring with it a multitude of questions—and some understandable doubts. Outsourcing is a critical decision—and it’s one that will rely on thorough research, close examination and the asking of some tough questions. This article summarizes four key areas that you'll want to scrutinize as you embark on your supplier selection process.
PCB Fabricators’ Tech Capabilities Exceed OEMs’ Needs in Many Areas
Some interesting differences showed up in the board property data reported by the OEMs and PCB fabricators that participated in IPC’s PCB Technology Trends 2018 study.
Synergy Between Smart Manufacturing and the Secure Supply Chain (Part 2)
With the trend of shortening lead-times within the material ordering process, and the frequency with which urgent orders for materials from the grey market are made, there is increased opportunity for the ingress of counterfeit materials. The situation is made far worse when a genuine shortage of materials in the supply chain occurs. The consequences of not being able to eliminate the risk of defects getting through into the market will be disastrous for individuals as well as for the company brand image, not to mention the associated costs of recovery. It is only a matter of time, unless something very significant changes.
Smart Factory Transitions Are Attainable—With a Plan
In a white paper, Zac Elliott, technical marketing engineer at Mentor, a Siemens company, outlines a structured organization for smart factory implementation. While there can be one set of challenges to overcome when building a smart factory on a greenfield site, firms restricted to pre-existing facilities face a different set of hurdles. In this interview, Elliott discusses how things have proceeded since the paper was published, and talks about strategies for smaller firms and brownfield companies.
Streamlining, but Streamlining What?
Electronics continue to grow in application areas, capabilities, and complexities. With such growth in the raw number of circuit boards being produced globally, the pressure is on to build more faster with higher quality and greater reliability. But this isn't new. What is new is the thinking and problem-solving that will need to happen at the manufacturing floor level to deliver on this coming need.
The GraftWorx Fluid Management Patch Story
The GraftWorx vision is to connect patients to clinicians with clinical data that will have a meaningful impact on their care. Its first application is to monitor patients with end-stage renal disease or kidney failure using a wearable device called the SmartPatch that records numerous clinical cardiovascular metrics. This article details how GraftWorx was designed, fabricated, and assembled.
Synergy Between Smart Manufacturing and the Secure Supply Chain (Part 1)
As MRP and ERP functions follow computing trends and start to migrate into the cloud, a fundamental question is being raised as to whether these are still the right tools to use in today’s modern Industry 4.0 driven factory, or whether these need to evolve, be enhanced, or even replaced in order to meet the more extreme requirements of operational flexibility, as well as cope with volatile material availability in the market.
Collaboratively Creating Wearable Medical Products
Patty Goldman, Barry Matties, and Happy Holden recently spoke with David Moody and Rich Clemente of Lenthor Engineering along with Anthony Flattery and Amit Rushi—their customers at GraftWorx. They discussed a recent project and how they worked together to solve a difficult problem by designing a rigidized flex circuit for their product.
4 Ways Electronics Manufacturers are Growing Their Businesses in 2019
At a time when many manufacturers are struggling to remain profitable, and with the uncertainty of the Brexit negotiations still looming large, finding new ways to nurture and grow your electronics manufacturing business has never been more crucial. Yet, despite the current challenges, some EMS providers are bucking the trend with reports of sustained growth. Here is their secret.
Whizz Systems on Knowing Your Strengths and Building Customer Relationships
Located in the heart of the Silicon Valley, Whizz Systems Inc. provides electronics product design, development and manufacturing services. Muhammed Irfan, president of the company, speaks with Nolan Johnson about knowing your strengths, engaging start-ups, and building strong customer relationships through education and preparation.
Green Circuits' Three Tips to Be a Well-prepared Customer
Nolan Johnson speaks with Joe Garcia, VP of sales and marketing at Green Circuits, about how they can help on both the front and back end of the process, their hidden gem—design services—as well as three tips to be a well-prepared customer.
Communication and Information: Two Keys to Success
Nolan Johnson and Duane Benson, an I-Connect007 columnist and a representative from Milwaukee Electronics, discuss how assemblers can help their customers through submitting and maintaining accurate information, and engaging in open communication early and often about the highly important bill of materials.
From DataED’s NPI Center to the Manufacturing Floor
The I-Connecct007 team recently spoke with a team of technologists and managers at Data Electronic Devices (DataED). Jeff Hamlett, director of sales and marketing; Lori Giglio, general manager at the NPI Engineering Center; Vic Giglio, president and CEO; and Ron Sprizza, VP of quality for DataED, provided an overview of the importance of company culture and making your customers the first priority.
Five Key Components of an NPI Report
An NPI report is an opportunity for your contract manufacturer to highlight any outstanding issues that will need to be addressed for future builds. The information that your EMS partner provides can play a pivotal role in ensuring that they continue to deliver your products on time, within budget, and to the highest quality standards.
Incoming CEO Steve Pudles on the Acquisition of Zentech
Nolan Johnson talks to Steve Pudles about the recent acquisition of Zentech Manufacturing Inc. by BlackBern Partners LLC and Zentech management. Steve, also an investor in Zentech, steps in as the incoming CEO of the new organization and discusses the deal, his new role, changes to management, and the company's plans post-sale.
Smart Design Data Is Essential for Industry 4.0 Manufacturing
Almost all of the conversation regarding Industry 4.0 is centered on the manufacturing floor, which is where the effect of the initiative is most felt initially. Little attention is given to the starting data for manufacturing—the data that comes from design. However, you can’t have smart manufacturing if your process begins with dumb data. As Pink Floyd said, “You can’t have your pudding if you don’t eat your meat!”
Five Key Questions Your EMS Partner Should Be Asking in the Supplier Selection Process
As we've continued to observe the impact of the ongoing global electronics components shortage, any challenge to the supply chain has the potential to cause major disruption. Whether you currently manage your own end-to-end electronics manufacturing, or you have opted to outsource to an EMS provider, there are five essential issues (and potential risks) to bear in mind when assessing the value and reliability of any proposed new supplier.
Impact of Stencil Foil Type on Solder Paste Transfer Efficiency for Laser-cut SMT Stencils (Part 2)
In the first part of this two-part article, Greg Smith talks about a study wherein a test vehicle was created to show transfer efficiency over a wide array of area ratios. Part 2 discusses the results of the experiment, including discussions of the different SEM results featuring the paste transfer efficiencies of each material, to better understand how the aperture wall surface smoothness compares to SMT stencil performance.
Catching up With Darrel Yarbrough of YES
Yarbrough Electronic Sales (YES) is one of the fastest growing contract manufacturers in the Southwest. As people get to know them better, they are becoming the go-to company in their area. In this interview, long-time industry veteran Darrel Yarbrough, owner of YES, provides a background about the company, its capabilities, and his outlook for the industry.
The Perfect Job
After all the days and weeks invested into developing the schematic, the PCB design, poring over the data sheets and online libraries for component parts, and running the calculations for mechanical clearances inside the enclosure, you—designers—are ready to be done. You're ready for the next design challenge—not for a week or so perfecting the bill of materials and the design notes. And there's the rub. Find out why.
Ralf Wagenfuehr on Developing Rehm Thermal Systems' RDS Semico Oven
Ralf Wagenfuehr, plant manager of Rehm Thermal Systems, describes Rehm's new oven—the RDS Semico—and gives an in-depth analysis about how it was designed specifically with the semiconductor industry in mind. Ralf also discusses the semiconductor industry as a whole and outlines the company’s desire to gain market share in Taiwan and Korea in the upcoming year.
How Electronics Manufacturers Can Reduce Their Environmental Impact
With OEMs demanding ever greater value for money from their suppliers, EMS providers can find themselves facing increasing pressure on every front. To remain competitive, there's a growing recognition of the need to continually improve, adapt, and evolve the manufacturing process.
Impact of Stencil Foil Type on Solder Paste Transfer Efficiency for Laser-cut SMT Stencils (Part 1)
As innovation and demand continue to drive miniaturization in electronics, manufacturers face the constant challenge of assembling smaller and smaller components with repeatable processes and high yields. Stencil printing is the first step in the PWB assembly process, and improvements to the SMT stencil can significantly improve yields, especially for more challenging miniaturized products.
Eileen Hibbler and Jason Emes on Improving the West Penn SMTA Chapter
At the recent West Penn SMTA Expo, Eileen Hibbler, a chapter support specialist at SMTA, and Jason Emes, the current president of the West Penn SMTA Chapter, discuss ways to improve meeting attendance and develop a new slate of chapter officers.
Preparing to Enter the Workforce With PCB Design Experience
Nolan Johnson recently spoke with Alex Burt, a computer engineering student at George Fox University, at a well-attended college career fair on the GFU campus in Newberg, Oregon. In the interview, Alex discusses his PCB classwork, challenges of design, and how it has impacted his internship experience as he prepares to enter the workforce upon graduation in the spring semester of 2019.
Tips & Tricks: Water Contamination and Flux Expiry
Solder joints that form properly are not expected to exhibit reduced reliability. However, a higher number of defects created tends to lead to a higher chance that defective connections escape detection through inspection and functional testing, and that’s not a risk to be taken lightly.
A Working Definition of Automation
Automation in a working context means more than just automatic machinery. Machinery implies mechanization. Automation also means the system information directs and controls people, materials, and machines. This concept is also known as systemization. Therefore, automation is made up of two components: mechanization (material flow) and systemization (information flow). Find out more.
Tips & Tricks: Humidity Level for Electronics Assembly
Low relative humidity (RH) can allow for higher static charges to build on objects. It can also affect solder pastes, especially OR-class pastes, and this can reduce print performance and stencil life. Read on to find out what level of RH you need for your assembly facility.
Which IPC-A-610 Class is Best for Your PCBA?
For many EMS providers, IPC-A-610 is the agreed standard to define what's acceptable and what's not in the world of PCBA production. As an OEM, it's important that you're clear on the basic principles that separate those classes so that you have a clear and realistic expectation of what the results are going to be.
WPC's Standardized Cordless Power Solutions
Phoebe Francis, a Wireless Power Consortium (WPC) representative who works as a senior manager in the Dallas offices for Golin, a PR firm, provides a rundown on WPC and what it means for printed circuit manufacturing.
Bill Cardoso Discusses Creative Electron’s Inspection Strategy
At PCB West in Santa Clara, California, Dr. Bill Cardoso of Creative Electron held a class on advanced packaging and X-ray inspection strategy. Guest Editor Tim Haag and Publisher Barry Matties met with Bill to further discuss his class and the importance of turning inspection data into information.
Tips & Tricks: Wave Solder Bridging
Wave solder bridging is the most difficult defect to troubleshoot because it has a number of potential causes. The key is to understand the role of flux during wave contact—thus reducing the surface tension of the solder to reduce the tendency to bridge between pins as the board leaves the wave.
Octane Open Concept Solution: Innovative Analytics and Floor-control Software
Octane Open Concept targets the contract manufacturer and is well along in the development process for a pair of software tools designed to optimize assembly and testing results tracking on the manufacturing floor. In an interview, CEO Craig Reiselt discusses the company and the products and opportunities in front of Octane.
Automation on Full Display at Recent China Exhibitions
With the rising cost of labor in China, the growing demand for automation has never been stronger. At the recent productronica China 2019, and accompanying shows, one hall was packed full of automation technology. This video gives you a glimpse into what was on display… and the new workforce.
Nano Dimension Offers Update on Dragonfly 3D Printer a Year After Launch
The Nano Dimension Dragonfly 3D printer arrived in much fanfare a little over a year ago. The company has been selling them to customers around the world, many of whom are using them to print antennas, sensors, and PCBs. At AltiumLive in Munich, I asked Product Manager Robert Even to discuss what they’ve learned in the year since the Dragonfly debuted, and some potential uses for 3D printing technology.
No Rest for the Weary: Supply Chain Pressures Are Here to Stay!
As we leave 2018 behind, it should be noted that the challenges faced by all consumers of electronic components in our industry this year have stretched teams both physically and mentally. We will continue to see pressures across the supply chain through 2019 and beyond, so there is no rest for the weary.
Jennie Hwang: Get Ready for Disruptive Technologies
At IPC APEX EXPO 2019, Dr. Jennie S. Hwang, a columnist, author, and all-around an expert in PCB assembly, discusses some of the changes she has seen since joining the industry, and disruptive technologies that technologists we are going to have to face in the near future. Are you ready for the future?
Smart Factories: A Shift in Thinking
The components that make up the smart factory foundation are not new, at least not at a basic technological level. Factory automation still uses PLCs, sensors, robotics, etc. But two things are quite different today: governments and key industry players across the globe are striving for cleaner, greener factories for the sake of the environment; and the 21st century allows for interconnected, multifaceted use of the data available through all these sensors and robotics.
IPC Validation Services: New Programs and Updates
At the recent IPC APEX EXPO 2019 show, Randy Cherry, director of IPC Validation Services, gives Judy Warner an overview of a new IPC-1791 QML program focused on prime contractors and OEMs, and provides updates on existing programs.
Four Hidden Materials Handling Costs Every OEM Should Know
Many of the expenses within your electronics manufacturing business are highly visible and undergo regular scrutiny. But there can also be much to be gained by keeping track of those less obvious material costs that may not be formally accounted for in your monthly reporting.
Automation and the Smart Factory: Introduction to Industry 4.0
The characteristics of successful automation application in manufacturing depend on how well business and technical management understand and promote the strategies, tactics, and philosophies used in modern manufacturing. This article briefly outlines the background of computer-integrated manufacturing (CIM) and its evolution to Industry 4.0 and smart factories.
2019 IPC EMS Management Meeting Wrap-up
At the recent EMS Management Meeting during IPC APEX EXPO 2019, EMS leaders gathered to discuss issues critical to EMS providers today, including supply chain issues, customer contracts, labor optimization and talent shortages. The highlight of the day was a supply chain challenges panel and discussion featuring supplier, distributor, and end-user perspectives on addressing component supply and lead time challenges.
Industry Outlook from IPC's Sharon Starr
Sharon Starr, IPC's director of market research, provides updates on the EMS and PCB industry outlook, benefits of IPC membership and participation, plans to expand the EMS statistical program, and new studies being published.
What Do You Know About Automation?
Test what you know in this 10-question automation quiz! Hint: It helps to download and read I-Connect007’s free eBook Automation and Advanced Procedures in PCB Fabrication, which provides an in-depth look at automation, computer-integrated and computer-aided manufacturing, mechanization, and chemical monitoring and control.
What Drives Your Optimism?
In our previous I-Connect007 survey, we asked the following question: "What drives your optimism?" Here are just a few of the replies, slightly edited for clarity.
RTW IPC APEX EXPO 2019: Standards Updates—IPC-7093 & IPC-7530
Ray Prasad, IPC Hall of Famer and chairman for multiple committees, gives Guest Editor Joe Fjelstad an update on two IPC standards: IPC-7093 on bottom-termination components (BTCs), and IPC-7530 progress with reflow characterization. Prasad talks about the many challenges in dealing with BTCs, including circuit/board design, manufacturing, voiding, connections (or lack thereof), warpage, and reliability. He also addresses no-clean flux and its challenges.
Nate Ramanathan on Choosing a Prototype Partner and Production Supplier
AEye, a developer of perception systems for autonomous vehicles, has transitioned from initial engineering development into the final design for production and manufacturing of very large quantities. In an interview with I-Connect007, Nate Ramanathan, VP of operations at AEye, speaks about the criteria and his perspective on selecting vendors.
RTW IPC APEX EXPO 2019: Aculon on Technology Developments and Partnership with Henkel
Aculon CEO Edward Hughes and Editor Pete Starkey discuss surface modification technologies based on nanochemistry. Of particular interest to electronics technologists are recent developments in waterproofing treatments for assemblies, and how Aculon's strategic partnership with Henkel opens up new opportunities.
Digi-Key’s Dave Doherty: Tweaking the Supply Chain
In an interview with I-Connect007, Digi-Key COO Dave Doherty discusses supply chain disruptions and shortages and shares a number of ways in which Digi-Key is helping to smooth out the delivery of components even with the current turmoil.
Todd Westerhoff Discusses His New Position and Much More
At DesignCon, I met with our old friend Todd Westerhoff, a veteran signal integrity engineer. Todd joined Mentor, a Siemens Business, since we last spoke. We discussed his new job responsibilities, his drive to get more designers and engineers to use SI tools, and the increasing value of cost-reduced design techniques versus overdesigning PCBs.
Advice to OEM System Designers
In our previous survey, we asked the following question: "What advice would you give an OEM system designer?" Here are just a few of the replies, slightly edited for clarity.
Two Full CFX Demo Lines at IPC APEX EXPO 2019
During IPC APEX EXPO, Editor Dan Feinberg spoke with David Bergman, IPC VP of standards and technology, about CFX, IPC’s Connected Factory Exchange software for machine-to-machine communication. With more than companies now supporting CFX, IPC set up two full lines for demonstration at the show.
Stephanie Martin: Component Supply Challenges from the Catbird Seat
Vexos Senior Vice President for Global Supply Stephanie Martin gives the I-Connect007 editorial team a wide-ranging and insightful overview of the current parts supply situation from the perspective of procurement at a contract manufacturer.
How Inspection Improved the Manufacturing Process
In our previous survey, we asked how inspection has helped improve the manufacturing process. Here are just a few of the replies, slightly edited for clarity.
RTW IPC APEX EXPO 2019: BTU Discusses New Solder Flux Reclamation Solutions
Bob Bouchard, corporate marketing manager at BTU International Inc., updates I-Connect007 Managing Editor Nolan Johnson on new solder flux reclamation solutions and details the new aqueous scrub methodologies, their increased ROI and efficiencies, and reduced maintenance.
RTW IPC APEX EXPO 2019: Making Components Count
VJ Electronix is filling the void in pre-build component count verification challenges. Don Naugler, president and general manager, sits down with Guest Editor Kelly Dack to explain details of the machine, how it works, and who benefits from it.
RTW IPC APEX EXPO 2019: Manncorp Highlights Custom SMT Lines
Ed Stone, sales manager for Manncorp Inc., sits down with I-Connect007 Guest Editor Dan Beaulieu and discusses how they are helping customers with low- to medium-volume type production needs by installing custom SMT lines within 48 hours.
RTW IPC APEX EXPO 2019: Lenthor Discusses Facility Expansion and New Equipment
Rich Clemente, general manager of Lenthor Engineering, discusses with Dan Feinberg, I-Connect007 Guest Editor, the company’s expansion and new facility and equipment. He also talks about his outlook for the electronics manufacturing industry in North America.
RTW IPC APEX EXPO 2019: MacDermid Alpha Highlights Solutions to Combat Voids in Solder
Joe Fjelstad speaks with Paul Salerno, global portfolio manager at MacDermid Alpha Electronics Solutions, about their latest product and process solutions to combat voids in solder including modifications in pastes, preforms, and vacuum assist soldering.
Award-winning Koh Young Process Optimizer
Joel Scutchfield, sales director with Koh Young America, discusses the company's outlook and new product offerings for 2019, including their Koh Young Process Optimizer (KPO), which won an award at IPC APEX EXPO 2019 for the process control software category.
Dan Schoenfelder: Searching for Parts in Real Time
The I-Connect007 editors recently sat down with Dan Schoenfelder, vice president of business development at Octopart. We discussed online parts libraries and the impact they can have on choosing parts based on availability data during the design process.
Improving the Efficiency of Your PCBA Production
Ensuring you're hitting your build times is always a major priority in surface mount production. The challenge for many OEMs, however, is that the processes involved with PCBA can be numerous and complex. And the smallest of details can make the biggest of differences.
Flex Circuit Supply Chain Challenges
In our recent Flex and Rigid-Flex survey, we asked the following question: "Do you have problems with your flex circuit supply chain?" Below are just a few of the explanations of those who answered "Yes", slightly edited for clarity.
RTW IPC APEX EXPO 2019: Electrolube Discusses Overcoming Secondary Cure Issues
Phil Kinner, technical director of Electrolube's coatings division, speaks with I-Connect007 Technical Editor Pete Starkey about how secondary cure issues with UV conformal coatings have been overcome and shows some typical examples.
RTW IPC APEX EXPO 2019: Enabling Complete Automation for Customers
Steve Williams and Saki CEO Norihiro Koike discuss Saki's AOI equipment and complete solution for electronic manufacturers, the industry-leading accuracy of their 3D equipment, and their recent Panasonic IoT certification to provide process data back to the pick-and-place equipment.
RTW IPC APEX EXPO 2019: Panasonic Highlights New Products, IPC STEM Student Outreach Program
Sean M. Murray, GM of North American Sales EAG Group for Panasonic, and Nolan Johnson, I-Connect007 Managing Editor, discuss two new product announcements at the show—PanaCIM process tracker software and MPM-WX—and being a sponsor for the IPC STEM Student Outreach Program.
Super Dry Storage Options to Manage Intermetallic Growth
Guest Editor Kelly Dack speaks with Richard Heimsch, director of Super Dry, about some of the differences between storing components and other materials for assembly floor storage versus long-term storage, and how Super Dry can help combat intermetallic growth.
Supply Chain in Crisis
In a traditional design flow, the project team tends to use the parts they already know and have footprints for—maybe a little long in the tooth, but known quantities, after all. Except these are not traditional times. Component supplies, prices, and lead times are in a great deal of turmoil. The automotive, IoT, and telecommunications sectors are vacuuming components out of the supply chain at a record pace, exerting influences like early obsolescence of older components and more.
Critical Process Issues
In our recent I-Connect007 survey, we asked what the top three critical issues are in the production process. Below are just a few of the replies, slightly edited for clarity.
RTW IPC APEX EXPO 2019: ASM Updates Mid-Level Machines
ASM CEO Americas Jeffery L. Timms and Technica President and CEO Frank Medina give Nolan Johnson a product update on ASM's mid-speed machines—EbySIPLACE and EbyDEK. By bringing key features from ASM's high-end products to their new mid-level models, ASM's new machines are gaining attention Timms and Medina discuss the how and why.
IPC APEX EXPO 2019 Day Two: Do You Hear That Buzz?
On the IPC APEX EXPO show floor Wednesday, the energy and action peaked with control software and interconnected machine communication continuing to be the buzz at the show.
Happy Anniversary, Gerber Format: Looking Ahead to Digital Innovation
This year, we celebrate the 55th anniversary of the introduction of the Gerber machine language format. We can thank H. Joseph Gerber, the man who took manual PCB design to the next level with the automated photoplotter, for giving us this format in 1964. Gerber immigrated to the United States in 1940 with his mother following the death of his father during the Holocaust. Gerber started Gerber Scientific Instrument Company in 1948 to commercialize his first patented invention—the variable scale.
Electrolube Overcomes Secondary Cure Issues with New UV-cured Conformal Coatings
Electrolube Managing Director Ron Jakeman and Marketing Manager Julia Vorley speak with I-Connect007 Technical Editor Pete Starkey about the successful outcome of the international collaboration between the company's R&D teams in the UK and China, which resulted in a brand-new range of solvent-free UV-cured conformal coatings about to be launched at the upcoming IPC APEX EXPO 2019.
STEM: The Future of Our Industry
Facing a growing shortage of talented labor with which to fill the employment positions in America, IPC is working to help solve this problem. Colette Buscemi, senior director of IPC’s education programs, is encouraging IPC members to better engage pre-college and post-secondary college students at the local level. Barry Matties spoke with Colette about the educational programs IPC has put in place to invest in future generations, including the STEM program at this year’s IPC APEX EXPO.
IPC APEX EXPO 2019 to Demo Operating CFX Line
A year on from their first demonstration, IPC’s Connected Factory Exchange (CFX) now nears the release of version 1.0 at this year’s upcoming IPC APEX EXPO. The I-Connect007 team spoke with CFX specialists Michael Ford and Dave Bergman about how far the program has come from the first initial public demo all the way through now becoming a published standard, and what users can expect from the demonstrations planned for the 2019 show.
The Future of the Customer Experience in Mobility
Based on the protocol stack that starts with 5G, moves up to AI, and continues to layer integrations and user interfaces and experiences on top of those lower-level technologies, how does this all apply to the current mobile experience? A panel on the future of mobility with representatives from several major companies covered this and more at CES.
Solder Paste Selection/Qualification
In a recent SMT007 survey, we asked the following question: " What are your challenges when it comes to solder paste selection/qualification?" Here are just a few of the replies, slightly edited for clarity.
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