High-reliability, Low-temperature Solder Alloys
Increased digitalization and greater connectivity have been driving miniaturization and more complex and integrated designs in electronics. As the real estate on PCBs shrinks, so does the size of packages. However, the drive for finding design solutions for increased performance has continued to expand. The solder joint is an essential part of assemblies for electronic devices as it provides electrical, thermal, and mechanical connections. Therefore, soldering materials have been evolving to enable such a technological revolution.
KYZEN’s Tom Forsythe: The Effects of COVID-19
On May 7, Barry Matties and Tom Forsythe, executive vice president at KYZEN, discussed the effects of COVID-19. During the conversation, Forsythe addressed KYZEN’s strategy to keep the staff and employees healthy as the foremost concern. He also detailed recent changes in interacting with customers and his take on what will be the new long-term changes in how the company does business versus short-term accommodations.
IPC's Dr. John Mitchell: Leadership in Times of Crisis
On May 13, Dr. John Mitchell, IPC president and CEO, spoke with Barry Matties and Nolan Johnson in another installment in our series of industry updates. In this interview, Mitchell discussed the challenges of leadership in crisis situations.
Meet Patrick Crawford, I-Connect007 Columnist
Meet Patrick Crawford, one of our newest I-Connect007 columnists! Patrick’s columns will provide updates on IPC Design activities. He is currently the liaison to the Design Community Leadership, the industry leadership group of IPC Design. Patrick and the Design Community Leadership work to develop the IPC Design program as IPC redoubles its efforts to serve the printed board design engineering industry.
This Month in SMT007 Magazine: Indium Metal Forecast—Supply Chain Strong, Demand Continues to Grow
Indium is a critical metal for the indium-tin oxide (ITO) market and other coating applications. Donna Vareha Walsh—director of sales and global supply chain and trade compliance at Indium Corporation—describes the plentiful global supply of indium and its recycling loop, examines indium’s history of price volatility and the market reactions from the recent Fanya Metal Exchange auction, and provides an overview of indium supply and demand drivers, as well as the impact of recycling efforts.
‘Coatings Uncoated!’ Micro-webinar Series Review
I-Connect007 collaborated with Electrolube’s Phil Kinner to create a 12-part series of 5-minute micro-webinar sessions entitled “Coatings Uncoated!” offering the opportunity to gain a comprehensive basic understanding of the technology of conformal coatings, chemical types and application techniques, benefits and limitations, and the practicalities of where and how to use them.
Smart Factory Implementation, Part 2
During one of our recent interviews, conducted as government leaders around the globe were issuing lockdowns, an industry expert had to pause and whisper some gentle and loving “goodnight and sleep well” words to a small child who was headed off to bed. Under these conditions, we’re working with our families and loved ones gathered close. It reminds me that we all have people for whom we do our work, strive to build successful businesses, and make the world a better place.
Happy’s Smart Factory Protocol Primer
The smart factory concept is built upon data interchange as the foundation. There has been much development in the area of industrial and manufacturing data protocols over the years, stretching back into the 1960s. This article by Happy Holden surveys what are considered the most common protocols in use in the electronics manufacturing industry today, including IPC-CFX/ Hermes, OML, SECS/GEM, and MAPS.
Photography Slideshow by Columnist Mehul Davé
At I-Connect007, we like to work hard, play hard, and highlight our contributors. Mehul J. Davé is a great example of someone who is passionate about the industry as well as his other interests outside of work—especially photography. Here, we feature some of his work.
The Convergence of Technologies and Standards in Smart Manufacturing
Ranjan Chatterjee of Cimetrix and Daniel Gamota of Jabil teamed up to bring you this article, originally published as the paper "The Convergence of Technologies and Standards Across the Electronic Products Manufacturing Industry (SEMI, OSAT, and PCBA) to Realize Smart Manufacturing."
Aurora Circuits’ Chris Kalmus Offers PCBs for Ventilators at No Charge
Electronics manufacturers continue to step up to the plate during these uncertain times. In this interview, Dan Beaulieu speaks with Chris Kalmus, owner of Aurora Circuits in Aurora, Illinois, who announced on April 24 that his company would be offering PCBs for ventilators free of charge.
Case Study: Example of ASKEY Applying QML Validation
The PCB007 China team paid a visit to the ASKEY plant in Wujiang, Jiangsu, to learn more about their QML process. In this interview with Qixian Zhang, vice GM of ASKEY’s Electronics Product Quality Assurance Department, he discusses what QML means to ASKEY and the electronics industry as a whole.
Process Ionic Contamination Test (PICT) Standard Roundtable With Industry Experts
With standards committees set to release the first of four new test standards, industry experts discussed the process ionic contamination test (PICT) standard, which was recently approved by the IEC for publication. Roundtable participants included Teresa Rowe, senior director of assembly and standards technology at IPC, Graham Naisbitt, chairman and CEO of Gen3, Jason Keeping, corporate process development at Celestica, and Doug Pauls, principal materials and process engineer at Collins Aerospace.
Automation War Stories From ICM Controls
Members of the I-Connect007 editorial team met with Andy Kadah, president of ICM Controls, and Kevin Jobsky, senior marketing manager, via teleconference on March 20, 2020. Originally, the purpose of our conversation was to discuss factory automation implementation details. Yet, we conducted the interview in the midst of a rapid-fire and wide-ranging onslaught of executive orders from the federal level on down to the local level meant to curb the spread of the coronavirus.
IPC Europe Shares Technical Education and Standards Awareness
Against a background of COVID-19 uncertainty and unprecedented challenges, but recognizing the vital importance of continuing to educate engineers and share the knowledge and skills required to manufacture boards and assemblies of the highest yields and reliability, the IPC Europe team hosted a technical webinar for the European electronics industry, featuring the expertise of two of I-Connect007’s regular columnists: Mike Carano and Jan Pedersen. Pete Starkey provides an overview.
Koh Young Update With Quintin Armstrong
In this video interview from the show, Quintin Armstrong, Americas service and applications senior manager for Koh Young, updates Guest Editor Dick Crowe on Koh Young America's Technical Services Team, where the focus is on AOI of components and materials on the stuffed board, as well as demonstrations and training at their new facility in Duluth, Georgia.
Dr. John Mitchell: IPC’s Ongoing Efforts Related to COVID-19
On April 14, IPC president and CEO, Dr. John Mitchell, described IPC’s ongoing efforts related to COVID-19 with I-Connect007 Publisher Barry Matties. From a standpoint approximately 30 days into the U.S. shutdown, Mitchell reported that 94% of the executives attending the executive forum are expressing concern. He also outlined many of the chaotic drivers and influences in the industry, including shifting over to different, mandated products; supply shortages; potential declining demand for normal products; and increased shipping costs. Worker and staffing shortages have also become an emerging concern.
SMTA Europe’s Electronics in Harsh Environments Conference and Exhibition: A Taste of Things to Come
SMTA Europe’s Electronics in Harsh Environments Conference has become a must-attend annual event; unfortunately, it also became another casualty of the COVID-19 lockdown. Scheduled to take place in Amsterdam, the Netherlands, from April 21–23, 2020, it has now been postponed until December 1–3. Pete Starkey reports on a preview seminar presented by SMTA Europe.
Stencil Cleaning Update With Tom Forsythe
In this video interview from the show, Pete Starkey and Tom Forsythe, executive VP of KYZEN, which celebrated its 30th anniversary, discuss the practicalities of stencil cleaning and describe the characteristics and capabilities of KYZEN's newest versatile stencil cleaning product.
IPC Education Foundation: STEM and Online Learning Resources
Nolan Johnson recently caught up with Charlene Gunter du Plessis, senior director of the IPC Education Foundation, about how the COVID-19 outbreak is affecting the IPCEF, including how they are continuing to connect with IPC Student Chapter members and seek industry support. Charlene also discussed the increased usage of IPCEF’s online educational modules and shares STEM resources.
Business Practices Drive the Smart Factory, Not the Other Way Around (Pt. 2)
In Part 2 of this conversation, Sagi Reuven— business development manager at Mentor, a Siemens Business—continues his discussion on how smart factory implementations must start with traditional process analysis and improvement before the data capture process is useful.
Panasonic: From Hardware to Solutions and Data
In this video interview from the show, Managing Editor Nolan Johnson speaks with Sean Murray—director of sales, service, operations, and logistics process automation at Panasonic—about the company's focus on software and information management on top of their long history in hardware and equipment.
IPC Standards Work Continues to Move Forward
On April 3, 2020, Teresa Rowe, IPC’s director of assembly and standards technology, and David Bergman, vice president, spoke with Barry Matties about ongoing standards activities during the global COVID-19 outbreak. Rowe and Bergman reported that, where one might think that standards committees would be negatively affected, standards work seems to be going stronger than ever.
Averatek’s A-SAP Semi-additive Process Enables HDI
In this video interview from the show, columnist Tara Dunn spoke with Mike Vinson, president and COO of Averatek, who described the company's semi-additive process, A-SAP, with 25-micron features sizes and below, which enables high-density interconnections. Vinson also discusses the papers Averatek presented at IPC APEX EXPO 2020.
This Month in SMT007 Magazine: Exclusive Interview With Burt Rutan, Aerospace Legend
If you follow advancements in aerospace technologies and expeditions, then you know the name Burt Rutan. Described by Newsweek as “the man responsible for more innovations in modern aviation than any living engineer,” Rutan is a bold visionary with a passion for the advancement of technology, who has designed 46 aircraft throughout his career. Following his IPC APEX EXPO keynote presentation, Rutan stopped by the I-Connect007 booth and shared his thoughts on a wide variety of topics.
Arlon Takes on High-Power Failure
In this video interview from IPC APEX EXPO, Pete Starkey and Dave Nelson, director of business development at Arlon Electronic Materials, explore causes of failure in high-power PCBs and explain how resin cracking during drilling can be overcoming using thermally conductive filled resin.
The Formation of the Printed Circuit Engineering Association
Patty Goldman spoke with Gary Ferrari, FTG Corporation, at IPC APEX EXPO 2020 about the formation of the Printed Circuit Engineering Association, which—having been started two months ago—has attained lots of interest from the industry. The PCEA hopes to bring together designers, engineers, fabricators, assemblers through local chapters to focus mainly on education and learning.
Phil Kinner on Sharing Expertise With the Industry
In this video interview from the show, Technical Editor Pete Starkey speaks with Phil Kinner, global business/technical director of Electrolube's coatings division, about the positive impact of the "Coatings Uncoated!" webinar series. They also discuss some of the ways that the company has responded to recent changes in the focus of the automotive industry.
The Next Generation: 2K Conformal Coatings
In this engaging, 12-part webinar series, Kinner examines conformal coating chemistries in further detail, including their properties, applications, issues to be mindful of, and the processes you should follow to achieve a successful coating outcome. The entire “Coatings Uncoated!” webinar series can be viewed in an hour and covers a comprehensive range of hot topics and application-relevant case-study overviews, as well as back-to-basic subject matter and issues, such as condensation and contamination. Most of the 12 segments can be viewed in five minutes or less.
Siemens and Valor: Two Complementary DFM Technologies
Before IPC APEX EXPO kicked off, Andy Shaughnessy attended a Siemens seminar in San Diego on smart manufacturing for electronics and the integration of technologies from Siemens’ digital industry software and Valor. Afterward, Andy spoke with Andy Farrington, director of portfolio development for the Americas, about the event, as well as some of the hot topics and solutions that the speakers addressed.
IPC’s Dr. John Mitchell Commends U.S. Manufacturers and Governors
On March 31, Dr. John Mitchell, IPC president and CEO, gave Barry Matties an update on the industry response to COVID-19 since their conversation on March 20. Mitchell provides an overall update on the industry, commending U.S. manufacturers for their proactive responses.
Industry Outlook With Siemens’ Fram Akiki
In this video interview from the show, Editor Dan Feinberg speaks with Fram Akiki, VP of electronic and semiconductor industries for Siemens, about the biggest challenges in the electronics industry. They also discuss major industry trends, including smart connected devices used in autonomous transportation and robotics, increased complexity, and a reduced time to market.
Advances in Medical Diagnostics Using LoC and LoPCB Technologies
Several techniques for detection and diagnosis of COVID-19 are currently under development, some of which may detect the novel virus exclusively; others may also detect strains that are genetically similar. A detection kit recently announced uses technology based on a portable lab-on-chip (LoC) platform capable of detecting, identifying, and differentiating MERS-CoV, SARS-CoV, and COVID-2019 in a single test.
Mentor's Oren Manor on Automation Business Adjustments
Oren Manor, director of business development at Mentor, a Siemens Business, shares an update with Barry Matties on the recent COVID-19 outbreak. Manor describes how Mentor's automation business operations have adjusted. Manor also provides some projections on how manufacturing may need to adjust as the global economies come out of this time.
EPTAC Preparing Young People for Future in Industry
In this video interview from the show, Guest Editor Kelly Dack and Leo Lambert, VP/technical director of EPTAC Corporation, describe the impact of internships and apprenticeships, the importance of IPC specifications, the effectiveness of certification.
What’s Driving AOI Innovation and Collaboration?
When we look at the optical inspection market growth trajectory, we can see how process challenges helped create innovations. For example, solder paste inspection (SPI) has undergone a shift from 2D to 3D because the 2D inspection technologies manufacturers traditionally used to collect solder deposit images could not solve shadowing problems. Thus, companies developed 3D SPI to capture the printed solder paste height to accurately measure the total volume of paste printed. Several years later, we see the same need for surface-mounted component inspection with AOI systems.
Watch & Learn! Latest Installment of I-007e Micro Webinar Series Features EV Charging Controller Case Study
The eleventh episode of the popular micro webinar series “Coatings Uncoated!” is now available to view. In “Cycle Time Constrains Coverage,” topic expert Phil Kinner from Electrolube examines the trade-off between cycle time and coverage required while considering an electric vehicle charging controller case study. If you are in the assembly business, an EMS company, or responsible for specifying conformal coating and/or encapsulation, then this free series is for you.
InduBond Gets Hot With Induction Heating Lamination
In this video interview from the show, Editor Nolan Johnson sat down to speak with Víctor Lázaro, InduBond’s R&D director and technical manager, about InduBond's latest technology for panel lamination utilizing induction heating. InduBond demonstrates a lamination oven on the IPC APEX EXPO show floor, as well as the advantages of the technology.
What It Takes to Be a Milaero Supplier, Part 2
The decision to pursue military and aerospace (milaero) certification impacts every facet of the organization, and not every shop is prepared to make this transformation. In Part 2, Anaya Vardya focuses on what it takes to be a milaero supplier in the areas of engineering and CAM.
IPC APEX EXPO 2020 Attendees Speak: Heston Singh
"We have been coming here for many years, and we had another good experience this year," said Unitron's Heston Singh. "If it wasn’t good, we wouldn’t be coming back. They have products that are needed for this market, so we’ll be back every year."
IPC Chief Economist Dr. Shawn DuBravac Shares Industry's Financial Outlook
On March 23, IPC Chief Economist Shawn DuBravac, Ph.D., CFA, spoke with I-Connect007 publisher Barry Matties in an exclusive phone interview immediately following DuBravac’s online briefing to IPC member attendees.
IPC President and CEO Dr. John Mitchell: COVID-19 Global Industry Update
On March 20, Dr. John Mitchell, IPC president and CEO, spoke with I-Connect007 publisher Barry Matties in an exclusive phone interview with updates on COVID-19-related current events in the manufacturing industry. In this information-packed 14-minute audio interview, Dr. Mitchell shared key takeaways from Friday’s IPC Executive Forum conference call.
This Month in SMT007 Magazine: Business Practices Drive the Smart Factory, Not the Other Way Around (Part 1)
In Part 1 of this conversation, Sagi Reuven— business development manager at Mentor, a Siemens Business—makes the case that smart factory implementations must start with traditional process analysis and improvement before the data capture process is useful. He also covers how sometimes the key to utilizing Industry 4.0 comes from a change in mindset rather than a drastic change or investment in new equipment or processes.
Watch It! The Perils of Technology Transfer (Selective Spray vs. Selective Dip Application)
The tenth episode of the popular micro webinar series “Coatings Uncoated!” is now available to view. Author of The Printed Circuit Assembler’s Guide to...Conformal Coatings for Harsh Environments and topic expert Phil Kinner from Electrolube shares highly focused educational information on conformal coating and encapsulation. If you are in the assembly business, an EMS company, or responsible for specifying conformal coating and/or encapsulation, then this free series is for you.
DownStream: Smoothing out the Post-Processing Bumps
In this video interview from the show, Joe Clark, co-founder of DownStream Technologies, gives Guest Editor Kelly Dack an overview of the company and their innovative product line, which serves to smooth the bumps that can occur between source design output and manufacturing line input. As Joe explains, 2019 was a great year for the company, and he expects that trend to hold through 2020.
Trends From the Show: Solder and Software
In my role as a media representative, my perspective on IPC APEX EXPO may be a bit different from that of many attendees. Since the I-Connect007 team had the opportunity to talk to many attendees and exhibitors and listen to their stories over the course of the week, our view can be particularly wide. When I reflected on all the conversations, pieces from all throughout the week coalesced and provided a different understanding of and takeaway from the show.
Are Trade Shows at a Crossroads?
With the cancellation of this year’s E3 show, the biggest gamer conference, the event’s format is shifting to a more fluid, online communication method. This may be the wave of the future. Can you imagine if the COVID-19 outbreak had occurred just three months earlier? Would there have been a Consumer Electronics Show, DesignCon, or IPC APEX EXPO? If the coronavirus is still in play in six months, will these shows take place in 2021?
IPC APEX EXPO 2020 Attendees Speak: Travis Smith and Mindy Sanchez
"I’m seeing a lot of great manufacturers and different equipment that’s available in the market, as well as new, emerging technologies," said Travis Smith of Ball Aerospace. "I’m learning a lot more about some of IPC’s standards and committees as well. It has been a fantastic week of educating ourselves for manufacturing processes going forward. And the IPC booth has a wealth of information."
IPC APEX EXPO 2020 Attendees Speak: Camille Sybert
"There’s a need for flexible solutions, so people are trying to make the most of the equipment that they buy, and they want to have the equipment that’s able to be flexible in scale with what it is that they’re looking for," said Camille Sybert of Nordson Electronics Solutions. "We have customers asking about future capabilities that they might not be ready for right now, but they want to know that it’s something that can be easily integrated into their processes in the future, as they’re in a position to better be able to do so."
Show & Tell Feature: New Developments and Opportunities
“Elevate the Excellence of Electronics” was the theme for this year’s IPC APEX EXPO. As expected, the show set the bar high with technical sessions, professional development sessions, committee meetings, numerous networking opportunities, and an exhibitor list that included all aspects of the electronics supply chain. Columnist Tara Dunn explains how she repeatedly found herself interested in multiple sessions being hosted at the same time, and having to pick and choose which session to attend.
Take Advantage of e-Education: Watch Free Webinar Series ‘Coatings Uncoated!’
The ninth episode of the popular webinar series “Coatings Uncoated!” is now available to view. In this new segment, viewers will learn about an automotive-based application (engine management system). Over a period of two years, the number of field failures escalated beyond all accepted levels, and a new solution was required. Phil discusses the finer details of this interesting case study.
Semiconductors in Charge: The Changing Face of PCB Manufacturing
The I-Connect007 editorial team recently spoke with Chuck Bauer and Dana Korf in a technical discussion that spanned a number of topics around shrinking components, such as redistribution layers (RDLs), active embeddeds, and why even the most revolutionary technologies must show ROI to be successful.
IPC APEX EXPO 2020 Attendees Speak: Gerry Padnos
"Overall, it has been a successful show for us," said Gerry Padnos. "We have mainly seen serious shoppers, not just window shoppers. We have done a lot of good work here, and we have a lot of interest in our products."
Oren Manor: Mentor Leading Way for Industry 4.0
In this video interview from the show, Guest Editor Steve Williams talks with Oren Manor—director of business development at Mentor, a Siemens Business—about Industry 4.0, robotics, and other applications. They also addressed integration of Mentor's CAD/CAM solutions with Siemens' mechanical offerings.
2020 EIPC Winter Conference, Day 1
Pete Starkey recaps how the 2020 EIPC Winter Conference, held in mid-February, attracted around 90 delegates from a dozen European countries—as well as a few from North America—to an outstanding learning and networking experience for members of the PCB community. The theme of this year's event was: “The Needs for Next-Generation Electronic Devices and Changes in Fabrication Solutions for PCBs, PCBAs, Materials, and Technologies.”
MacDermid Alpha Electronics: Stronger With Kester Acquisition
In this video interview from the show, Technical Editor Pete Starkey and Tim Williams, VP of assembly solutions, discuss the structure and strategy of MacDermid Alpha Electronics Solutions, and how the company benefits from the Kester acquisition.
Inspiring Next-Generation Engineers Through STEM
Through the STEM Student Outreach Program, IPC invites high school students to visit IPC APEX EXPO for a day. Last year, they had about 100 participating students, and this year, it doubled. The program is designed to introduce students to our industry at a younger age. During one event planned for them, the students had a chance to participate in a hands-on soldering track, creating wearable buttons to take home with them.
Watch & Learn! Latest Installment of I-007 Micro Webinar Series Covers UL Approvals: Aerosol Spray Technology
The eighth episode of the popular webinar series “Coatings Uncoated!” is now available to view. In this segment, viewers will learn about a customer application involving aerosol spray coating. The customer reported failures due to arcing, creepage, and corrosion. Kinner explains the relevance of UL approvals and progresses through the details of the case study.
Michael Ford Explains the Benefits of IPC-CFX
In this video interview from the show, Guest Editor Dan Beaulieu and Michael Ford, senior director of emerging industry strategy at Aegis Software, discuss the IPC-CFX standard that allows machines to communicate with other machines. They also focus on some strategies that can turn any factory with old or new equipment into a smart factory.
This Month in SMT007 Magazine
We recently surveyed readers on the topic of smart factories, specifically exploring reader perceptions of what a smart factory entails, along with implementation plans that may be on readers’ minds. Looking at how respondents ranked their top three from this list of 10 objectives, some patterns do emerge.
IPC APEX EXPO 2020 Attendees Speak: Mike Montesi
"One of the biggest challenges for me selling is educating customers that they can generate oxygen and nitrogen on their own for up to 90% savings versus getting trucked in deliveries," said Mike Montesi of On Site Gas Systems. "It’s all about education because 98–99% of customers are used to the high cost of delivered gases, where we can separate it on-site with their own equipment, and the payback is typically under a year."
David Bergman: CFX a Key Ingredient of Smart Factories
In this video interview from the show, Jennie Hwang and David Bergman, IPC's VP of standards and training, address the use of CFX to facilitate plug-and-play smart factories. IPC APEX EXPO 2020 offered a variety of demonstrations of CFX, IPC’s Connected Factory Exchange.
Randy Cherry: IPC Validation Services Continues to Expand
In this video interview from the show, Randy Cherry, IPC's director of validation services, gives Guest Editor Judy Warner his annual update on IPC's Validation Services, which is growing along with ever-increasing IoT and connectivity.
I-007e Micro Webinar: Primary Flight Control Case Study on Condensation and Coverage
The seventh episode of the popular webinar series “Coatings Uncoated!” is now available to view. Author of "The Printed Circuit Assembler’s Guide to Conformal Coatings for Harsh Environments" and topic expert Phil Kinner from Electrolube shares highly focused educational information on conformal coating and encapsulation. If you are in the assembly business, an EMS, or responsible for specifying conformal coating and/or encapsulation, then this free series is for you.
The Success of IPC’s STEM Student Outreach Program
The IPC Education Foundation (IPCEF) hosted its STEM Student Outreach Event on February 6 at IPC APEX EXPO in San Diego. Nine local high schools attended bringing 193 students and 30 educators from Mission Hills High School, Morse High School, North County Trade Tech High School, Saint Marcos High School, E3 Civic High School, Point Loma High School, Otay Ranch High School, Mount Miguel High School, Otay Ranch High School—Girls in STEM. Twice as many students were able to participate this year, and each participating high school received a $1,000 grant and soldering station to enhance STEM-related learning at their school.
IPC APEX EXPO 2020 Attendees Speak: Katie Carl
"We have a wide range of kids. All of them have some sort of interest in technology, which is why they wanted to come in general," said Katie Carl, a high school teacher escorting a group of kids at IPC APEX EXPO. "It’s neat when they start seeing how these technologies are created because a lot of them have seen robotics or have done a tiny bit of soldering with little circuits, but when they can see how those things are built and created in the industry, it makes it more applicable for them."
Watch Coatings Uncoated Webinar, Part 6 Now: Field Failures, Silicon vs. Sulfur
The sixth episode of the popular webinar series, "Coatings Uncoated," is now available to view. Based on an interesting case study concerning a telecommunications giant experiencing a high degree of field failures, coatings specialist Phil Kinner explains the mechanism behind the failures and why the silicone option proved unsuccessful. Part six of this micro webinar series concludes with a full explanation of the successful solution.
IPC APEX EXPO 2020 Attendees Speak: Joel Scutchfield
"Based on traffic and attendance, we have had a great week. We had 40+ more scans than what we did last year at this point, and we’re waiting for the final tally today," said Joel Scutchfield, Koh Young's director of sales for the Americas.
IPC Government Relations: Focus on Supply Chain Resiliency
During IPC APEX EXPO, Editor Nolan Johnson sat down with Chris Mitchell, VP of global government affairs, to discuss IPC’s latest initiative with industry intelligence programs. As Chris explains, some of these efforts are focused on improving the DoD’s supply chain. This includes moving the DoD from leaded to lead-free components to help avoid millions of dollars in rework. He also discusses the team’s drive to unite with partners around the world and create a truly global organization.
Solder in PCBA: Can’t Live Without It... or Can We?
For most of its historical use in electronics, the solder alloy of choice was tin-lead, either an Sn60/Pb40 alloy or the Sn63/ Pb37 eutectic version of the tin-lead alloy. These two alloys were the workhorses of the industry. They were both well understood in terms of their processing and reliability—that is, until the advent of lead-free, a well-meaning but ill-conceived and poorly executed conversion, forced on the industry by the European Union in 2006.
IPC APEX EXPO 2020 Attendees Speak: Dr. Martin Anselm
"The biggest challenge I’ve encountered a number of different times is the migration to much larger packaging," said Dr. Martin Anselm, director of CEMA Lab. "Devices are getting much larger, and with the thousands of I/O of solder joints, and they are not just single-die, multi-chip modules in different forms or 2.5D technologies.
Manncorp: An SMT One-Stop Shop
In this interview, Joe Fjelstad speaks with Ed Stone, sales manager of Manncorp. Ed details the operations at Manncorp’s two locations in San Diego and Philadelphia, including production of LEDs for Manncorp’s daughter companies. As Ed says, describing the steady traffic at his booth, “We have something that everyone at the show needs.”
Watch and Learn: Not All Acrylics Are Created Equally
How can additional data, including test results, ensure a greater understanding of the most suitable coating for your application? The fifth episode of the popular webinar series, "Coatings Uncoated," is now available to view. Author of "The Printed Circuit Assembler’s Guide to Conformal Coatings for Harsh Environments" and topic expert Phil Kinner from Electrolube shares highly focused educational information on conformal coating and encapsulation.
iNEMI: Emerging Technologies Driving Rapid Industry Development
During IPC APEX EXPO, Editor Joe Fjelstad spoke with Grace O'Malley, iNEMI's VP of technical and project operations, about the well-attended roadmap sessions and other iNEMI meetings taking place at the show. Topics covered included emerging applications and how these technologies are driving industry development across the board, and at a fast pace.
RTW IPC APEX EXPO: John Mitchell Discusses the Show's Evolution
During IPC APEX EXPO, Technology Editor Dan Feinberg spoke with John Mitchell, CEO and president of IPC, about the event’s evolution from a strictly PCB show into a miniature Consumer Electronics Show, including new ideas and prototypes. They also discussed several new IPC initiatives, including IPC Design.
Phil Carmichael: IPC Asia Continues Solid Growth
Phil Carmichael, IPC president of Asia Pacific, talks with Barry Matties at the HKPCA show during the first week of December 2019 about the continued growth and increased engagement by Asian member companies with IPC, with over 320 members in standards committees now working on the development of the next-generation standards.
True or False: CFX Edition
Since the release of IPC-2591—Connected Factory Exchange (CFX), Version 1.0—there has been a lot of buzz regarding CFX within the industry from all segments. Still, with all of the buzz, there are also some misconceptions floating around the industry regarding CFX. David Bergman takes some of those statements, using feedback from Subcommittee members, and plays a little game of “True or False: CFX Edition.”
I-007e Micro Webinars Releases Part 4 in ‘Coatings Uncoated!’ Series
What is creepage, and how does it impact clearance? Can conformal coatings reduce creepage? The fourth episode of the popular webinar series, Coatings Uncoated, is now available to view. Author of The Printed Circuit Assembler’s Guide to Conformal Coatings for Harsh Environments and topic expert Phil Kinner from Electrolube shares highly focused educational information on conformal coating and encapsulation.
‘A Night of Happy-ness’ and 2020 Good for the Industry Awards
The Horton Grand Hotel in San Diego was the site of “A Night of Happy-ness” on the evening of Monday, February 3, 2020. I-Connect007 transformed the Regal Ballroom into a cozy lecture hall with two key objectives: to award the I-Connect007 Good for the Industry awards, and to celebrate the life, achievements, and personality that is industry pioneer Happy Holden.
Risk Mitigation: An Essential Guide
Risk mitigation in the global supply chain is nothing new to many industries. What is new, however, is the exponential rise in potential risks and the reality that those are risks that simply cannot be predicted. What are some factors for a winning strategy that might not immediately come to mind? Here are a few essential recommendations to the global PCB industry that might significantly lower the risk impact on a company’s productivity, time to market, and financial success.
EIPC Winter Conference: Business, Technology, and Community
Managing Editor Nolan Johnson recently spoke with Kristen Smit-Westerberg about the upcoming EIPC Winter Conference, February 13−14, 2020, in Rotterdam.
CES: The Main Halls
CES 2020 is now over, and the next round of shows is underway (NAMM is also over now, IPC APEX EXPO is next week, followed by AWE and others). CES displayed electronics related to gaming, monitors, computers, smartwatches, TVs, vehicles, cellphones, etc. However, the effect on the industry and the way we live will be felt until the next CES. The largest and most influential participants are usually found at the Las Vegas Convention Center.
Fresh Thinking on the Logistics of Laminate Distribution
Mark Goodwin, COO of Europe and the Americas for Ventec International Group, sits down with Barry Matties to explain his approach to supply chain management, efficient distribution, and maintaining definitive product identity at every stage.
Flexibility Is Key to Direct Imaging Success
Brendan F. Hogan, managing director of MivaTek, explains that while each industry has its own set of requirements and difficulties, the lines between semiconductor and PCB markets are blurring, demanding more flexibility from equipment suppliers.
IPC APEX EXPO Technical Session Preview
Brook Sandy-Smith, IPC technical conference program manager, previews the technical side of IPC APEX EXPO 2020, which includes the customary technical sessions, but also some new wrinkles like the fundamentals program and “sessions @ the intersection” to encourage more interaction.
IPC Validation Services: What to Expect at IPC APEX EXPO 2020
IPC’s Randy Cherry previews what to expect from IPC APEX EXPO 2020, including a full line on display demonstrating CFX/Hermes, further development of the Validation Services program, as well as testimonials from member companies that have been participating in IPC’s new trusted supplier program to the Department of Defense (DoD).
IPC APEX EXPO Technical Conference, Featuring Fundamentals and the Intersection
IPC's Brook Sandy-Smith brings us a preview of the Technical Conference at IPC APEX EXPO 2020. In addition to the Sessions @ the Intersection and the Technical Conference, the Fundamentals Program is new at IPC APEX EXPO 2020. The program provides curated content for industry newcomers and anyone interested in a broader view through the many facets of electronics manufacturing. Attendees will learn important concepts, terminology, and background as preparation for the detailed content on new studies and technologies presented at the technical conference.
Streamlining Inspection and Verification
Barry Matties speaks with Vladi Kaplan, VP of marketing for CIMS, about the company’s newest verification station, the benefits operators will see from its colorized real-time video, and how it makes verification much faster and much more efficient for companies pushing 100% inspection.
New From I-007e Micro Webinars: Part 2 in ‘Coatings Uncoated!’ Series
Got five minutes? Watch Phil Kinner's the latest segment, Never Underestimate the Importance of the Application Process, which examines the pivotal role that application plays in the overall success of coating, and presents a great opportunity to grasp the importance of the process.
Foundations of the Future: Get More Engaged in 2020
Since the inception of the IPC Education Foundation in January 2019, the mission remains to create connections between electronics manufacturers and supply chain companies, academia and the emerging workforce. In this debut column, Charlene Gunter du Plessis describes plans for engaging in 2020, including scholarships and more, and the IPC APEX EXPO 2020 STEM Student Outreach event.
IPC APEX EXPO: Sessions @ the Intersection
In this short video, Brook Sandy-Smith, IPC’s technical conference program manager, explains how “the lntersection” will be a new meeting place In between this year's IPC APEX EXPO show floor and the technical conference available to attendees and the free sessions that are open to any registration type.
Visit the Newcomers’ Lounge at IPC APEX EXPO
The Newcomers’ Lounge will open on February 2, will remain open through February 6, and is conveniently located near the technical conference and meetings area, where it will serve as a dedicated resource center for newcomers to get their questions answered and meet other newcomers. Use the lounge to take a break from the hustle and bustle of a busy day, catch up on emails, or grab a quick snack or refreshment.
New From I-007e Micro Webinars: The 5-Minute Webinar Series
I-Connect007 takes the on-demand webinar to a new level. A perfect companion to our I-007 Micro eBook series, these bite-sized webinars are released weekly, exclusively at I-Connect007, and are also available all at once for those who can’t wait for the next installment.
Meet Two New CID Grads: Kalen Brown and Michael Steffen
At PCB West, I spoke with two newly minted Certified Interconnect Designers: Kalen Brown of EaglePicher and Michael Steffen of Crystal Group. After passing the CID exam, they attended the IPC Designers Council Executive Board Meeting, where the more “seasoned” veterans were very happy to meet them.
CES Press Kickoff Presentation
On January 5, Editor Nolan Johnson attended the CES press kickoff presentation “2020 Trends to Watch,” which was hosted by CES Vice President of Research Steve Koenig and CES Director of Research Lesley Rohrbaugh. Koenig and Rohrbaugh set the stage for the week with their presentation, answering the question, “What’s happening in the industry?”
CES 2020: The Intelligence of Things
Show week for CES 2020 starts well ahead of the actual exhibition dates because it is huge. The organizers of CES state that there are more than 4,400 exhibiting companies and nearly three million net square feet of exhibit space. On the floor, you can find 307 of the 2018 Fortune Global 500 companies. Over the week, I-Connect007 Editors Dan Feinberg and Nolan Johnson will bring you some of the most interesting news, products, and announcements from 5G to IoT, semiconductor developments, autonomous vehicle technology, interconnect, fabrication materials, and much more.
What You Need to Know About the Digital Factory
Barry Matties spoke with Oren Manor, director of business development for Mentor, A Siemens Business, during productronica about the many benefits of a digital factory and what’s keeping companies from becoming one. Oren also gives examples of big data analytics along with the move to a lot size of one.
What You Need to Know About a PCB Design Career
Never stop learning. Why? Because the industry never stops changing. Those that continuously stay in that state of learning are the ones who succeed. The old saying “Knowledge is power,” often attributed to Sir Francis Bacon, has never been truer. Fortunately, there is never a lack of things to learn. Don’t ever become apathetic about learning. Make a point of keeping a running list of ideas or subjects that you want to research, and then purposely set aside time in your week strictly to study and learn about these things anywhere you can.
UV-curable Materials and Conformal Coatings
Pete Starkey and Phil Kinner, global business and technical director, coatings division, Electrolube, discuss the characteristics and benefits of the company’s new UV-cured conformal coatings. Phil also describes the development of coatings for critical avionics applications and Electrolube’s collaboration with the U.K. National Physical Laboratory to establish a new condensation test.
CyberOptics Sensors: So Good That Their Rivals Use Them
Editor Nolan Johnson and Subodh discuss CyberOptics’ latest precision 3D systems, such as the SQ3000, which offers AOI, SPI and CMM functionalities. The inline CMM system includes top-of-the-line software for metrology grade measurements of critical points. Subodh points out that some of his competitors even utilize CyberOptics sensors in their equipment.
Is Captive Making a Comeback?
Andy Shaughnessy recently spoke with Altium’s Steve Chalgren, senior VP of business strategy and planning. Steve shared his thoughts about why improved manufacturing and automated EMS equipment, such as robotics, might lead smaller OEMs to become captive shops like the old days. Is captive making a comeback?
Accurate, Uniform Data With KIC’s Smart Reflow Analyzer
Editor Nolan Johnson and Miles discuss KIC’s newest system, the SRA, a smart reflow analyzer that can provide the customer with information about their machines: Is the airflow adequate? Is there proper heat transfer to the product? Is this data uniform from week to week and month to month? Miles explains how the SRA uses the latest in laser technology to track conveyor speed and heat transfer more accurately than ever.
BTU Discusses its Next-generation Flux Management System
At productronica 2019, Nolan Johnson spoke with Peter Franklin, managing director of BTU Europe, about BTU’s next-generation solder reflow flux management system—Aqua Scrub. A winner of the show’s Global Technology Award for Soldering, Peter breaks down the specifics of what makes Aqua Scrub such an intriguing technology.
Nolan’s Notes: A Tour of the Industry
As far back as the 1600s, and lasting through the mid-1800s, young, imperial English aristocrats would leave the island to travel “the world;” however, this often simply meant visiting continental Europe on an out-and-back trip, resembling a golf outing, before returning home to settle down to the business of running their family estate and/or the country. This practice was commonly called “the Grand Tour.”
CIMS Galaxy: More Than an Inspection System
Editor Pete Starkey and Vladi discuss the newest CIMS AOI platform, Galaxy, which is more compact and more versatile than the previous Phoenix model. The Galaxy is scalable and can be equipped with more functions and connected to a variety of Industry 4.0 databases. Vladi explains that the Galaxy can be used for everything from inner layer inspection to final inspection, detecting defects down to 1 pixel. The system is available with multiple metrology options as well.
A Walking Tour of Mycronic Equipment at productronica 2019
I-Connect007 pays a visit to the Mycronic booth at productronica 2019 in Munich, and Jeff Leal, product manager for Mysmart, takes us on a walking tour of just one of the lines on display at the show. Jeff takes us through a series of dispensing and conformal coating machines.
Practical Verification of Void Reduction Method for BTC Using Exposed Via-in-pad
The method explored in this article regards the use of exposed via-in-pad. A dedicated test vehicle was designed for two types of QFN components. The main variables accounted for were the component size, number of exposed vias in the thermal pad, via pitch, via size, and solder paste coverage. The responses sought in this experiment include a thermal pad void level and solder wicking down the via barrel with resulting solder protrusion on the opposite side of the PCB.
SEMI Discusses Benefits of SMT-ELS Protocol
Editor Nolan Johnson and Tom Salmon discuss the SMT- ELS protocol, which is being developed collaboratively as a replacement for SMEMA. Salmon overviews the technology involved and industry acceptance so far. He also explains SEMI’s focus on information and control standards, including the newest solution which allows companies to perform switchovers much faster, thanks to the TCP/IP protocol. This platform also works with traditional PLC systems, shrinking development time from one month to several days.
The Future of the World Is Truly in the Hands of Our Youth
At I-Connect007, we are proud to once again sponsor the STEM Outreach Program at the upcoming IPC APEX EXPO 2020. Another way we support our youth is by sharing the stories of young people who are doing amazing things. Dylan Nguyen is a great student, musician, and creative thinker. Recently, he shared with me the details of his school science fair project, “Kite: Powering the Future,” which solved a problem that he faced. Dylan is a leader with a bright future, and the world is lucky to have kids like him.
Indium Discusses New Materials and Plans for 2020
Editor Nolan Johnson sits down with Nash and Mackie to discuss Indium’s focus on creating innovative products for the 5G, automotive, semiconductor, and high-reliability segments. Mackie offers a preview of Indium’s plans for 2020 and beyond, including lead-free drop-in sintering materials that can be dispensed and printed more quickly than ever before.
Mirtec's Approach to Raw Data: The 'Sushi Principle'
Editor Pete Starkey and Brian D’Amico discuss the company’s new Alpha system, designed for the automotive market. D’Amico explains why Mirtec is focusing on providing customers with raw data instead of “cooked” data, what he terms the “sushi principle.” He says that the system is able to pick up tiny defects that would otherwise be filtered away if the system were not using raw data. D’Amico also discusses their use of artificial intelligence, and some of the possible benefits from using AI going forward.
AltiumLive Frankfurt 2019: Carl Schattke Keynote
“How many here can remember manually taped artworks?” No more than three hands were raised in an audience of over 230 at the AltiumLive 2019 European PCB Design Summit in Frankfurt, Germany, as IPC Advanced Certified Interconnect Designer Carl Schattke introduced his keynote, entitled “Making and Breaking the Rules.” Schattke had learned PCB layout as his father’s apprentice, hand-taping several hundred PCB designs in the 1970s.
Day 1 Coverage of International Electronics Circuit Exhibition in Shenzhen
The newly named International Electronics Circuit Exhibition, formerly known as the HKPCA Show, kicked off today in Shenzhen, China. This event is now part of a cooperation between the CPCA and HKPCA associations. This is the largest trade show serving the south China region, with 3,537 booths from 621 exhibitors this year.
André Bodegom on European Challenges, Automation, and Automotive
Editor Pete Starkey speaks with André Bodegom, managing director for Adeon Technologies in the Netherlands, about changes he has seen over the years in major industry sectors, challenges in the European market, and other areas of growth.
The Digital Medical Revolution
Zulki Khan, founder and CEO of NexLogic Technologies Inc., offers his unique perspective on manufacturing trends as a PCB turnkey solutions provider based in Silicon Valley. He discusses additional requirements that are now necessary to compete in different industry sectors, most notably medical, which he says is set for a “digital revolution.”
KYZEN on Stencil Cleaning
In this video interview, part of the productronica 2019 coverage, we spoke with Tom Forsythe, executive VP for KYZEN. The discussion revolves around the challenges of stencil cleaning, particularly as aperture sizes continue to decrease. Tom also introduces KYZEN’s E5631 aqueous-based stencil cleaner.
Rehm Thermal Systems’ Three-mode Oven
During productronica 2019, the I-Connect007 Editorial Team met with some of the industry's top executives, managers, and engineers. In this video interview, part of the productronica coverage, the I-Connect007 team speaks with Michael Hanke, Chief Sales Officer for Rehm.
David Meyers on Digital Twin and ‘Cobots’
With over 30+ years in the industry, David Meyers recently took on a new role at Siemens as a global solutions director in the Electronics Industry team of Siemens Digital Industries Software, working on improving communications between CMs and their OEM partners. In a conversation with Nolan Johnson and Happy Holden, David speaks on the digital twin and virtual environment software that should help establish that communication early in the process.
Digi-Key on Adapting to the Changing Industry Landscape, Pt. 1
The I-Connect007 editorial team recently spoke with Chris Beeson, executive vice president of global supplier and new business development at Digi-Key Electronics, about trends and the changing landscape of the industry. Beeson describes how Digi-Key is looking to continue growing its user community as a design service provider while providing greater services for the entire PCB.
Oren Manor on the Siemens-Mentor Integration
In this video interview, part of the productronica coverage, the I-Connect007 team speaks with Oren Manor, director of business development for Siemens, in the Siemens booth. Oren introduces us to the in-booth production equipment that integrates factory automation, motion controls, and MES solutions. He points out that the recent effort to automate SMT lines is now expanding into the areas of final assembly, box build, and manual assembly as well.
EIPC Winter Conference—Speakers and Papers
I recently spoke with Kirsten Smit-Westenberg, executive director of EIPC, who is planning the EIPC winter conference set for February 2020 in Rotterdam, Netherlands. Kirsten discusses the conference topics, which are based around the needs of the next-generation electronic devices, and changes in fabrication solutions for PCBs, PCBAs, materials, and technologies.
Koh Young Europe Celebrates 16,000 Installed Systems
During productronica 2019, the I-Connect007 Editorial Team met with some of the industry's top executives, managers, and engineers. In this video interview, Editor Nolan Johnson and Harald Eppinger, managing director at Koh Young Europe, discuss the company’s milestone of 16,000 installed systems, the Zenith Alpha, and market trends in AOI systems.
Global Political Turmoil Creating Uncertainties for the Industry
From where I sit, representing the interests of electronics manufacturers and related companies around the world, I regret to say that the future of our industry—while bright overall—is fraught with uncertainties, from trade policy disputes to government leadership turnovers and economic and social megatrends. IPC is working with all governments and parties to overcome these uncertainties, but there is a lot to tackle.
AI Cameras Help Park Rangers Stop Poachers
Eric Dinerstein, the director of biodiversity and wildlife solutions at the non-profit organization RESOLVE, discusses the organization’s TrailGuard AI camera—a low-cost, durable, easy-to-use, efficient, and low-power burglar alarm system for Africa’s national parks—that alerts rangers at headquarters in near real-time of intruders and potential poachers coming into the park. With the help of leading companies, Eric explains how the project came to life, including implementing artificial intelligence (AI) and a satellite modem, making it the first of its kind.
Why Does the PCB Industry Still Use Gerber?
Every so often, I hear technologists ask why so many PCB designers still use Gerber. That is a fair question. Ucamco has over 35 years of experience in developing and supporting cutting-edge software and hardware solutions for the global PCB industry. Our customers—small, medium, and large PCB fabricators—include the electronics industry’s leading companies, and many of them have been with us for over 30 years. We are dedicated to our industry and excellence in everything we do, which includes our custodianship of the Gerber format.
Keith Bryant on Growth in the European Market
Pete Starkey interviews Keith Bryant, chairman of the European division of the Surface Mount Technology Association (SMTA), about his view on the outlook of the industry, including growth in the European electronics manufacturing industry as well as the need for young engineers.
Meet Alfred Macha, SMT007 Columnist
Meet Alfred Macha, one of our SMT007 columnists! Macha’s columns concentrate on process validation, supply chain management, quality management systems, government contracts, FDA regulations, process controls, and more. Alfred Macha brings 20 years of senior leadership roles in quality and operations management working for Sanmina, DDi (now TTM Technologies), Anaren (now TTM Technologies), and HEI Microelectronics.
Explaining the QSFP-DD Data Center Interconnect Standard
According to Cisco’s report, most IP traffic either originates or terminates in data centers. Yet as massive as the flows between centers are becoming, the data managed within those same facilities is going even higher. All of this activity means that “hyperscale” is the word of the future. Roughly one-quarter of all servers installed in 2016 went to hyperscale facilities, but that number will grow to almost one-half by next year.
Meet Ray Prasad, SMT007 Columnist
Meet Ray Prasad, one of our SMT007 columnists! Prasad’s columns explore DFM, manufacturing processes, yield improvement, quality control, IPC standards, and much more.
Design For Excellence: Karen McConnell on Standards
During the IPC Summer Meetings, I spoke with Karen McConnell, senior staff CAD CAM engineer with Northrop Grumman Mission Systems. Karen is a veteran PCB designer as well as an IPC committee chair and mentor. She offered an update on some of the IPC committees she chairs, the need for more mentor programs in this industry, and why you can call something a ham sandwich if you define it correctly in the standard.
The Changing Landscape
SMTAI featured two keynote speakers: Adam Steltzner, a NASA Jet Propulsion Laboratory (JPL) engineer who led the Mars Science Laboratory's Entry, Descent, and Landing (EDL) Phase for the Curiosity rover and the chief engineer for the Mars 2020 Project; and Dr. Mike Hawes, Lockheed Martin Vice President for Human Space Exploration and Orion Program Manager. The energy at both keynotes was palpable. We’re returning to extra-orbital space with human crews, and the demands of such missions drive innovation.
Koh Young Opens New North American Facility
Koh Young America recently opened its new corporate headquarters for the Americas outside of Atlanta, Georgia. I attended the open house and spoke with Joel Scutchfield, director of sales for the Americas, about the state-of-the-art facility and the benefits of relocating to the East Coast.
So Many Standards Committees, So Little Time
During the IPC Summer Meetings and Panelpalooza in Raleigh, North Carolina, I met with Leo Lambert, vice president and director of technology at EPTAC. We discussed IPC’s recent efforts to revamp the way standards are developed and interpreted as well as changes to training and education committees and a variety of methods for eliminating errors and duplicated comments when revising standards.
Juan Arango on Koh Young’s New U.S. Headquarters
At a recent open house, Managing Director Juan Arango talks about his role in the company’s transition from their Arizona facility to a new headquarters located outside of Atlanta, Georgia. Juan details many of the benefits customers can expect, including brand new spaces dedicated to customer demos as well as training.
Is Your EMS Partner Up to Speed With WEEE 'Open Scope?'
E-waste encompasses a myriad of "unseen" metals, semi-metals, and chemical compounds that are found inside circuit boards, wires, and electrical connections. If not handled correctly, chemicals—such as cadmium, barium, lithium, lead, mercury, and beryllium—can present a significant health risk through direct contact, the inhalation of toxic fumes, or the build-up of toxins in water, soil, and food products.
SMTAI 2019: To the Moon and Beyond
W. Michael Hawes, D.Sc., gave a great keynote at SMTAI 2019 titled, “To the Moon! Orion's Next Giant Leap Into Deep Space.” Dr. Mike Hawes is currently the VP for human space exploration and the Orion Program manager for Lockheed Martin. Barry Matties spoke with him afterward to discuss the technology innovations that empower the next-generation spacecraft to take astronauts to explore farther than humankind has ever ventured.
IPC Electronics Materials Forum 2019
IPC will be holding its Electronics Materials Forum 2019 from November 5–7, 2019, in Bloomington, Minnesota. The Electronics Materials Forum is a new technical conference focused on developments in materials and processes associated with advanced electronics assembly and manufacturing.
SMTAI 2019: KIC's New, Smart Factory Products
MB Allen, manager of applications and sales for KIC, and Karl Pfluke, regional sales manager, update Nolan Johnson on their new product announcement from earlier this year. They also address the company's ongoing work on smart factory products.
Chuck Bauer: SMTAI 2019 Founder's Award Recipient
At the recent SMTAI conference and exhibition, Chuck Bauer, Ph.D., senior managing director at TechLead Corporation, received the Founder's Award, a prestigious award given to a member who has made exceptional contributions to the industry and provided ongoing support and service to the SMTA.
SMTAI 2019: Chris Bastecki on Low-temperature Solder Challenges and Products
Chris Bastecki, director of global PCB assembly at Indium Corporation, discussed challenges of low-temperature solder and the company's new product, Durafuse LT, which provides novel properties and reliability.
SMTAI 2019: Company Updates and Future J-STD-001 Changes
Nolan Johnson speaks with Graham Naisbitt, chairman and CEO of Gen3 Systems, and Andy Naisbitt, operations director, about how they just signed an agreement with a new distributor. Graham also discussed upcoming J-STD-001 changes and Gen3's shift to a more consultative customer model.
SMTA Additive Electronics Conference: Industry Trends
Mainstream PCB manufacturing is often limited to 50-75 microns (mm) line and space. But the electronics industry is evolving quickly. Propelled by the demand for more sophisticated electronics, PCB design is being tasked with finer lines, thinner materials, and smaller via sizes.
ODB++: Transforming Ideas Into Products
The ODB format originated with the objective of delivering on this need. The format was originally introduced for use by PCB fabricators, eliminating the need for a collection of CAM files in multiple formats—such as Gerber, Excellon, IPC-356, or even IPC-350, which was an early attempt to simplify this process. The key to the success of ODB was that it obtained industry acceptance.
Real Time with... SMTAI 2019 Video Interviews
The SMTA International Conference and Exhibition 2019, which took place September 22–26, 2019, at the Donald E. Stephens Convention Center in Rosemont, Illinois, concluded successfully. For those of you who were not able to make it to the show, catch our video interviews with the movers and shakers of the electronics industry. We've updated our video presentation for a better experience for our users, so check it out!
SMTAI 2019: Juan Arango Discusses Koh Young America's New Headquarters
Andy Shaughnessy speaks with Juan Arango, managing director of Koh Young America, about their new corporate headquarters in Atlanta, Georgia, which is located near most of their U.S. customer base.
SMTAI 2019: Nir Benson Discusses Mentor's Challenges and Solutions
Nir Benson, business development manager at Mentor, a Siemens Business, talks with Andy Shaughnessy about his work to integrate the two companies' solutions, some of the challenges he sees, and his efforts to optimize their cloud-based systems.
Real Time with… SMTAI 2019 Slideshow
The SMTA International 2019 Conference and Exhibition closed last week on a high note. For those who were not able to attend the event, held at Stephens Convention Center in Rosemont, Illinois, the slideshow contains a selection of photos from the exhibition show floor as well as the conference.
SMTAI 2019: Lenora Clark Discusses Company Changes and Her New Role
Lenora Clark, director of autonomous driving and safety technology at MacDermid Alpha Electronics Solutions (and co-organizer for the upcoming SMTA Additive Electronics Conference), and Nolan Johnson discuss her new role, recent company reorganization, and the synergies customers are seeing.
SMTA 2019 International Awards
The SMTA International conference—held September 22–29, 2019, at the Stephens Convention Center in Rosemont, Illinois—honored industry members with awards for their contributions to the industry. I-Connect007 has compiled an unofficial list of award recipients. The official list from SMTA will be released shortly, and I-Connect007 will publish it as soon as it is available.
IPC Panel on Bottom-terminated Components
During the IPC Summer Meetings in Raleigh, North Carolina, I sat down with Tom Rovere, a materials and process engineer at Lockheed Martin in Owego, New York. We explored a panel discussion on bottom-terminated components (BTCs) that Tom participated in as well as the challenges and issues related to BTCs and the important role that designers play in that process.
Leo Lambert on Training the Next Generation of Technologists
I sat down for an interview with Leo Lambert, VP of technical director for EPTAC Corporation, during the IPC Summer Meetings in Raleigh, North Carolina. We discussed the company’s growth, including plans to have training centers across different regions of the country to help cut down on students’ travel times, and why training methods must constantly evolve to remain effective.
Standards Through Time: Changing to Stay the Same
The use of standards has, ultimately, propelled civilization forward. As the electronics manufacturing industry works to create, revise, update, and restructure standards, it helps to take a moment to review how standards, and the process of creating them, have occurred throughout history.
Combating ESD: The Silent Assassin in Electronics Manufacturing
ESD is a constant but invisible force within electronics manufacturing that can have a powerfully detrimental impact on production yield, product and product reliability, and company profitability. And as the circuitry within electronic devices continues to get faster, smaller, and more sophisticated, their sensitivity to the effects of ESD is only likely to increase.
Additive Electronics Conference Set for October 2019
Tara Dunn, president of Omni PCB and I-Connect007 columnist, and Lenora Clark, director of autonomous driving and safety technology at MacDermid Alpha Automotive, discuss what can be expected from the upcoming Additive Electronics Conference in San Jose, California, the impetus and motivation behind the conference, and who can benefit the most from attending.
Meet Chris Ellis, SMT007 Columnist
Meet Chris Ellis, one of our newest SMT007 columnists! In his columns, Ellis addresses common problems that Manncorp customers have had with the in-house conversion process, and shares solutions that have worked in the past.
The Long Road to a New Standard
Graham Naisbitt, chairman and CEO of Gen3 Systems, has spent decades leading cleanliness testing standards in a number of different standards organizations like IPC, IEC, and ISO around an assortment of testing methods, such as CAF, SIR, and even introducing a new standard this year for his own testing method—process ionic contamination testing (PICT). Naisbitt breaks down his long involvement with standards and where they stand currently.
The Convergence: IPC Merging CFX With IPC-2581
Gary Carter of XPLM and Michael Ford of Aegis Software are heading a group tasked with combining the IPC-2581 standard, now referred to as Digital Product Model Exchange (DPMX), with IPC’s Connected Factory Exchange (CFX). In this interview, they discuss the benefits that can be expected when these standards are fully merged for both PCB designers and process engineers on the manufacturing floor.
To Improve the Standards Process, Get Involved
Jan Pedersen, senior technical advisor at Elmatica, and Ray Prasad, president of Ray Prasad Consultancy Group, spoke with the I-Connect007 team about the current state of PCB standards and where the process might need improvements, including the many difficulties around transparency, slow updates, limitless numbers of variations, and a variety of other topics.
How Digitalization Is Transforming the Electronics Manufacturing Industry
The rise of the "digital" supply network—such as the cloud, big data, 3D printing, augmented reality, or the internet of things (IoT)—promises to address issues such as increasing global competition, rising consumer expectations, and the increasingly complex patterns of consumer demand, by providing a greater level of transparency, innovation, and resiliency. And there is a growing belief among business strategists that the more digitalized our manufacturing supply chains can become, the greater our efficiency will be.
Solder Mask Evolves into a Truly Additive Process
The 5G era is creating quite a bit of work for many PCB engineers as the materials required to keep up with the speed, frequency, and latency requirements need to be defined and qualified. Solder mask, for example, now becomes a truly additive process. Read on to find out how and why.
Selecting the Proper Flex Coverlayer Material
Coverlayers are polymer materials used to cover and protect the copper traces of the flex circuit product. There are a number of different options available for protecting the circuits, and they serve different design requirements in terms of cost, performance, and flexural endurance optimization. When specifying the choice, it is critical to call out not just the type of coverlayer material but also the thickness requirement. This can be very important in certain types of constructions, especially when a flex circuit will experience dynamic flexing during use.
eSMART Factory Conference 2019, Day 2
Happy Holden continues his report on the the eSMART Factory Conference Dearborn, Michigan, with highlights from the event's second day, which includes a keynote from Brian Toleno titled "Augmented Reality: Next-Generation Computing for Front-Line Workers."
Meet Dr. Bill Cardoso, SMT007 Columnist
Dr. Bill Cardoso started his first company at age 17 in Brazil, selling it a few years later to work for the U.S. Department of Energy’s Fermi National Accelerator Laboratory, where he led research in nuclear physics to build the equipment that discovered the Higgs Boson (and the 2013 Nobel Prize in Physics). After 10 years at Fermilab, he moved from Chicago to sunny San Diego to start Creative Electron in his garage in 2008.
eSMART Factory Conference 2019, Day 1
The recent eSMART Factory Conference in June in Dearborn, Michigan, was the second annual conference on the smart factory. SMTA described it as "A technical conference with a focus on electronics manufacturing from software systems/processes to augmented reality and smart inspection." In this article, Happy Holden gives us the highlights of the conference.
Meet Our Newest Columnists From NCAB Group
Meet our newest I-Connect007 columnists from NCAB Group! Jeff Beauchamp, Ruben Contreras, and Harry Kennedy are field application engineers from NCAB Group's technical team. In their columns, they will explore fresh PCB concepts, including medical and telecommunications applications, topics related to RoHS, and much more.
IEEE’s 5G Future
Dan Feinberg speaks with Kathy Grise, IEEE Future Directions senior program director, at the AWE conference recently in San Jose, California. In this excerpt, Dan and Kathy discuss the impending impact of 5G technology and related immersive technologies, including autonomous driving, XR, AR, and VR.
Conformal Coating Processes and Trends
The I-Connect007 editorial team spoke with one of Nordson ASYMTEK’s conformal coating experts, Camille Sybert, to discuss where the coating industry is trending and, with the rise of Industry 4.0 and automation, how it is much less about providing the right applicator and more about addressing the entire conformal coating process.
Dispensing EMI Shielding Materials: An Alternative to Sputtering
Shielding electronic systems against EMI has become a hot topic. Technological advancements toward 5G standards, wireless charging of mobile electronics, in-package antenna integration, and SiP adoption are driving the need to apply more effective EMI shielding and isolation to component packages and larger modules. For conformal shielding, EMI shielding materials for exterior package surfaces have mostly been applied with a PVD process of sputtering, leveraging front-end packaging technologies to back-end packaging applications.
The Role of Parylene Conformal Coatings in Next-gen Electronics
Designers and manufacturers of electronics are under pressure to make packages smaller, lighter, and more environmentally friendly, while ensuring that their new technologies perform reliably in their operating environments. This article takes a closer look at Parylene conformal coatings and the role they can play in helping manufacturers address current and future challenges in the electronics industry.
Meet Chris Mitchell, I-Connect007 Columnist
Chris Mitchell is vice president for global government affairs at IPC—Association Connecting Electronics Industries—where he is responsible for development and implementation of the organization’s global advocacy efforts and public policy agenda with a focus on electronics industry business improvement, environment, health and safety, and defense initiatives.
Conformal Coating Selection: Conventional vs. Two-part
As assemblies become more densely populated, and housing/casing designs become more permeable to save weight, the use of conformal coatings is essential to protect the assembly from its operating environment and ensure acceptable reliability for the application intended, especially when operating in hostile environments.
IEEE's Future Directions Programs Target Reliability
Dan Feinberg speaks with Kathy Grise, IEEE Future Directions senior program director, at the AWE conference recently in San Jose, California. In this excerpt, Dan and Kathy discuss the importance of reliability, blockchain, recruiting younger generations, etc.
Recent Advances in X-ray Technology: SMTA Webinar Recap
Technical Editor Pete Starkey recently attended a webinar on advances in X-ray technology and its applications in the electronics industry, as presented by Keith Bryant, Chair of SMTA Europe, on behalf of SMTA India. Here are the highlights of the webinar.
IPC Reliability Forum Wrap-up With Brook Sandy-Smith
I attended the recent IPC High-Reliability Forum and Microvia Summit in Baltimore, Maryland. The speakers and panelists focused on a variety of topics, but one issue that kept popping up was the failure of some microvias on military and aerospace PCBs. Fortunately, some smart technologists are focusing on determining the cause of these via failures. I asked Brook Sandy-Smith, IPC’s technical education program manager, to give us a quick wrap-up of this event.
Which Matters Most: Unit Cost or Total Cost of Supply?
The primary objective for any OEM is to design, manufacture, and deliver high-quality products in the most cost-effective way possible. When demand patterns change, or there is an increase in competition, it can be easy to rely on the calculation of unit cost to relieve the price pressure. But, as many manufacturers are discovering, choosing to base their outsourcing decisions purely on unit cost may not always reap the expected benefits in the long term.
IPC High-reliability Forum and Microvia Summit Review, Part II
The Microvia Summit on May 16 was a special feature of the 2019 event in Baltimore, since microvia challenges and reliability issues have become of great concern to the PCB manufacturing industry. It provided updates on the work of members of the IPC V-TSL-MVIA Weak Interface Microvia Failures Technology Solutions Subcommittee and opportunities to learn about latest developments in methods to reveal and explain the presence of latent defects, identify causes and cures, and be able to consistently and confidently supply reliable products.
How Do I Get Smart With IPC CFX? (Part 1)
Today's assembly factories are seeing the biggest challenge to face the industry in a generation, called by many the next industrial revolution. However, in essence, the challenge is a simple extrapolation of trends that have been occurring and increasing in assembly manufacturing for decades. In Part 1 of this two-part article, Michael Ford writes about the history behind the drive for automation in the SMT assembly industry and where CFX fits in.
IPC High-reliability Forum and Microvia Summit Review, Part I
The IPC High-Reliability Forum and Microvia Summit covered a broad range of topics related to reliability and provided interactive opportunities to share expert knowledge and experience in determining and understanding the causes of failure and selecting the best design rules, materials, processes, and test methods to maximise product reliability.
Practical Implementation of Assembly Processes for Low Melting Point Solder Pastes (Part 2)
In the last three to five years, there has been a resurgence of interest in the use of low melting point alloys for SMT applications. Typically, the compositions are around the eutectic bismuth-tin alloy, perhaps with additions of other elements to increase the robustness of certain alloy properties. Now, there are several new products on the market and numerous ongoing reliability projects in industry consortia.
Crowded Congressional Calendar Affects Industry Priorities
More than five months remain in 2019, but U.S. congressional leaders are already running out of time as they face a long list of must-pass bills before year’s end. Although some of these bills do not affect the electronics industry, some of them do, and the overall agenda does affect the opportunities and risks we face.
A Conversation with Karen McConnell—An Emerging Engineer Program Mentor
IPC’s Emerging Engineer program, launched in 2016, provides early career professionals an opportunity to learn from dedicated industry volunteers who participate in IPC standards development. IPC’s editorial staff had the opportunity to talk with one of those dedicated volunteers, mentor Karen McConnell, Senior Staff Engineer CAD CAM, Northrop Grumman, about why she participates as a mentor in IPC’s Emerging Engineer program.
Practical Implementation of Assembly Processes for Low Melting Point Solder Pastes (Part 1)
Since 2006 and the implementation of the RoHS directive, the interest in bismuth-tin solder alloys—whose melting point around 140°C is very desirable because it allows for the use of lower temperature laminate materials and reduces thermal stress on sensitive components—has only increased as the industry has searched for Pb-free alternatives to the chosen standard, SAC305, which melts at considerably higher temperatures than the incumbent tin-lead alloys.
Surface Treatment Enabling Low-Temperature Soldering to Aluminum
An increasingly popular method to meet the need for lower cost circuitry is the use of aluminum on polyester (Al-PET) substrates. This material is gaining popularity and has found wide use in RFID tags, low-cost LED lighting, and other single-layer circuits. However, both aluminum and PET have their own constraints and require special processing to make finished circuits.
Dissecting the IPC Regional Survey on PCB Technology Trends
Sharon Starr, Denny Fritz, and Mike Carano talk about the global 2018 IPC Technology Trends Report released early this year—the size of the survey, how it was conducted, the general findings, and regional differences. They also shared their takeaways and regional insights, and the industry outlook over the next five to 10 years.
Failures and Reliability in Soldering
The definition of failure is "the lack of success in doing or achieving something, especially in relation to a particular activity." If the activity is concerning a soldering process, such a failure can have a downstream impact far beyond the actual solder joint. In this regard, it is first necessary to understand what constitutes a good solder joint because appearance is too often deemed a success.