SPOTLIGHT
Libra Industries Names New Product Launch & Component Engineering Techs
Libra Industries, a privately held electronics manufacturing services provider, is pleased to announce the promotion of two associates to New Product...
IMI Wins Best Paper Award at ASEMEP National Tech Symposium
Integrated Micro-Electronics Inc.’s Jaziel Vitug-Gotauco, Randall Bryan Chua and Peter John Canoy of Test and Systems Development group...
Incap CEO to Step Down
Incap Corporation's Board of Directors and the President and CEO Vesa Mäkelä have agreed that Vesa Mäkelä will leave his position. Mr Otto Pukk has been appointed as the interim CEO starting from 25 June...
Yamaha Reveals Total Line Solution at SMT Hybrid Packaging 2018
Yamaha Motor Europe IM Division has shown how surface-mount assembly can continue to boost productivity and quality control, by introducing new and...
IPC APEX EXPO 2019 … Exhibit Space Going Fast
IPC – Association Connecting Electronics Industries reports that 85 percent of exhibit floor space has been sold for IPC APEX EXPO 2019. Three...
AIM Solder to Donate Solder Paste to CENALTEC High Technology Training Center
AIM Solder is pleased to announce their donation of solder paste materials for training at the CENALTEC High Technology Training Center in Chihuahua,...
Flex Receives Lenovo Diamond Award
Flex recently received the Diamond Award, the highest recognition Lenovo presents to select global suppliers and partners, for the delivery of high quality, on time, innovative support and outstanding...
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Raising the Capability Ceiling: SMTA Upper Midwest Chapter Expo
June 25, 2018 | Tara Dunn, Omni PCB
An energetic and engaged crowd filled the recent SMTA Upper Midwest Expo & Tech Forum. The event, held in June 14 in Minneapolis, Minnesota, hosted 57 exhibiting companies and had over 100 pre-registered attendees. The underlying theme for the technical presentations was "Raising the Capability Ceiling!" Here's a wrap-up of the event.
The Michigan SMTA Expo & Tech Forum 2018: A Review
June 22, 2018 | Happy Holden, I-Connect007
In May, I had the adventure of driving across Michigan to visit the SMTA Michigan Expo & Tech Forum. This well-organized and attended expo and technical forum featured over 75 exhibitors and two interesting presentations. Read on.
Masking of Conformal Coating During Assembly and Rework
June 11, 2018 | Bob Wettermann, BEST, Inc.
Masking of printed circuit boards post rework/repair as well as for initial PCB assembly is often required if the PCB is to be conformal coated. If a board that has conformal coating on it needs to be reworked or repaired, the...
The Role of Bismuth (Bi) in Electronics, Part 4
June 4, 2018 | Dr. Jennie Hwang, H-Technologies Group
Dr. Jennie Hwang's column series continues in Part 4, which addresses two pivotal questions: Why SAC is not able to be a universal interconnecting material for electronic circuits, and why a quaternary alloy system offers a more...
One World, One Industry: Meet IPC’s Vice President of Global Government Relations, Chris Mitchell
May 29, 2018 | John Mitchell, IPC--Association Connecting Electronics Industries
In this new role, Chris will work closely with IPC’s Government Relations Steering Committee and its government relations team based in Washington, D.C. Chris will represent IPC and the electronics manufacturing industry before...
This issue Flex Circuit Assembly Featuring:
Tackling the Challenges in Flexible Circuit Assembly
Flex Circuit Assembly: Challenges and Strategies for Success
Reflow Perspectives to Flex Circuit Assemblies
Conversation with… Miraco: Strategies for Successful Flex Circuit Assembly
Conversation with… Vexos: Doing it Right the First Time
Conversation with… Thermaltronics: Addressing Temperature Challenges in Flex Circuit Rework