I-Connect007 Editor’s Choice: Five Must-Reads for the Week

July 23, 2021 | Nolan Johnson, I-Connect007

In this week’s top five: a high profile surprise merger between Autodesk and Altium, which had been in the works, resolved this week; financial news from fabs and assemblers around the globe is reporting strong bookings and sales as the industry bounces back from pandemic-related shutdowns; component demands continue to exert pull pressures on the semiconductor suppliers, keeping the market (overly?) competitive pricewise. The tiles are indeed being stirred. Which pieces will you be dealt?

How to Troubleshoot Your Testing Processes

July 22, 2021 | Graham Naisbitt, Gen3 Systems

There are a multitude of electronic circuit assembly manufacturers, high-volume/low-product mix to low-volume/high-product mix. Only you will know where you are in that definition.



Foundations of the Future: IPC's Generous Support to Upskill Students

July 21, 2021 | IPC Education Foundation, IPC

The electronics industry faces the challenge of attracting talent. The IPC Education Foundation (IPCEF) aims to help solve this challenge by increasing awareness of the industry and equipping students with valuable industry-standard...

Her Voice: Game Changer at the Top

July 14, 2021 | Christine Davis, EMS Specialist

Columnist Christine Davis went searching to find female executives who would teach her to lead and to be inspired by. She found one such inspiration in Maggie Hardy...

Maggie Benson's Journey: SMT Process Optimization

July 12, 2021 | Ronald C. Lasky, Indium Corporation

In this fictional account, Maggie Benson's time on the golf course with her professor leads to important improvements at the...

Reliability Featuring:

  • Cleanliness Behind Many Assembly Challenges Interview with Eric Camden
  • The Meaning of (PCB) Life by Bob Neves
  • Ductility is Your Greatest 'Alloy'—Avoiding Drop Shock by Ranjit Pandher
  • How to Troubleshoot Your Testing Processes by Graham Naisbitt
  • IPC-WP-019: The How to Behind the Cleanliness Requirements in IPC J-STD-001G by Debora Obitz
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