Reflow Perspectives to Flex Circuit Assemblies

July 13, 2018 | Stephen Las Marias, I-Connect007

At the recent NEPCON China 2018 event in Shanghai, I spoke with Ralf Wagenfuehr, plant manager at Rehm Thermal Systems, to gain insight into flex circuit assembly, and the challenges of reflow soldering. He also speaks about the need for industry forums focused on soldering flex printed circuits.

Is There an End in Sight to the Electronic Components Crisis?

July 12, 2018 | Neil Sharp, JJS Manufacturing

As new and innovative technology continues to evolve on a daily basis, the need for electronic components has reached unprecedented levels, with passive manufacturers in particular among those struggling to cope with demand. Electronic component shortages are now such an issue that many OEMs are predicting their forecasted growth for 2018-2019 will be thwarted if they are unable to source the parts they need.

IPC Addresses Skills Gap

July 4, 2018 | John Mitchell, IPC--Association Connecting Electronics Industries

A recent IPC global survey found that while the skills gap may vary depending on the job role and geographic location surveyed, many companies in the industry are struggling to find the talent they need, and the problem is expected to...

Advanced Digitalization Makes Best Practice Part 1: Digital Remastering

July 2, 2018 | Michael Ford, Aegis Software

As digitalization and the use of IoT in the manufacturing environment continues to pick up speed, critical changes are enabled, which are needed to achieve the levels of performance and flexibility expected with Industry 4.0. This...

Raising the Capability Ceiling: SMTA Upper Midwest Chapter Expo

June 25, 2018 | Tara Dunn, Omni PCB

An energetic and engaged crowd filled the recent SMTA Upper Midwest Expo & Tech Forum. The event, held in June 14 in Minneapolis, Minnesota, hosted 57 exhibiting companies and had over 100 pre-registered attendees. The underlying...