Optimizing Solder Paste Volume for Low-Temperature Reflow of BGA Packages

July 22, 2019 | Keith Sweatman, Nihon Superior Co. Ltd

In this article, Keith Sweatman explains how the volume of low-melting-point alloy paste—which delivers the optimum proportion of retained ball alloy for a particular reflow temperature—can be determined by reference to the phase diagrams of the ball and paste alloys.

Quest for Reliability: The F Word

July 19, 2019 | Eric Camden, Foresite

The word "failure" is as nasty as it gets in our world. It goes against everything we thought we knew. All contract manufacturing facilities strive to build a reliable product, or at least they all should. The problem is too many companies hope they are building reliable products without doing the work required to ensure they are.



Knocking Down the Bone Pile: BGA and PCB Warpage—What to Do

July 10, 2019 | Bob Wettermann, BEST, Inc.

Warpage of BGA packages or PCBs can occur when any heating and subsequent cooling cycle is gone through. This may leave the package to bow in the middle. Pushing the corners up or downward will show up in bridging (caught on X-ray) or...

One of the best ways to eliminate possible production issues when you handle your SMT work in-house is to ensure that you have a manufacturable design. Thus, there are several factors to keep in mind when reviewing your designs before...

In the first part of this column series about becoming a preferred supplier to your customers, Alfred Macha provides the fundamental concepts to transform your company's culture with Lean Sigma. The approach introduced in this column...

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