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Tin Whisker Mitigation Methodologies Report from SMART Group, Part 2

December 8, 2016 | Pete Starkey, I-Connect007

In the second part of this two-part article series, I-Connect007's Pete Starkey concludes his review of the SMART Group's recent seminar, which is focused on tin whisker mitigation methodologies and strategies.

While at the 2016 SMTA International conference and show, I had the lucky opportunity to talk with Indium Corporation’s Dr. Ron Lasky. He gave a great synopsis of the extensive testing done by Indium Corporation’s Chris Nash on solder voids, outlined in a paper co-authored by the two, which was being presented by Ron at the conference.



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