In this article, Keith Sweatman explains how the volume of low-melting-point alloy paste—which delivers the optimum proportion of retained ball alloy for a particular reflow temperature—can be determined by reference to the phase diagrams of the ball and paste alloys.
The word "failure" is as nasty as it gets in our world. It goes against everything we thought we knew. All contract manufacturing facilities strive to build a reliable product, or at least they all should. The problem is too many companies hope they are building reliable products without doing the work required to ensure they are.
Warpage of BGA packages or PCBs can occur when any heating and subsequent cooling cycle is gone through. This may leave the package to bow in the middle. Pushing the corners up or downward will show up in bridging (caught on X-ray) or...
One of the best ways to eliminate possible production issues when you handle your SMT work in-house is to ensure that you have a manufacturable design. Thus, there are several factors to keep in mind when reviewing your designs before...
In the first part of this column series about becoming a preferred supplier to your customers, Alfred Macha provides the fundamental concepts to transform your company's culture with Lean Sigma. The approach introduced in this column...
Optimizing Solder Paste Volume for Low-temperature Reflow of BGA Packages by Keith Sweatman
Size Matters: The Effects of Solder Powder Size on Solder Paste Performance by Tony Lentz
Low-temperature SMT Solder Evaluation by Howard “Rusty” Osgood, et al.
Surface Treatment Enabling Low-temperature Soldering to Aluminum by Divyakant Kadiwala
Failures and Reliability in Soldering by Michael Gouldsmith and Zen Lee
Approaches to Overcome Nodules and Scratches on Wire-bondable Plating on PCBs by Y. K. Song, V. Bukva, and R. Wong
Welcome to Real Time with… IPC APEX EXPO 2019 Show & Tell by Nolan Johnson
Electronics Industry Comes Together at IPC APEX EXPO 2019 by Dr. John Mitchell
Real Time with… IPC APEX EXPO 2019 Video Showcase and Library
Happy’s Highlights by Happy Holden
Leo Lambert, IPC’s 2019 Hall of Fame Inductee by Patty Goldman
Inspiring the Next Generation of Leaders: IPC STEM Student Outreach Program by Patty Goldman
A STEM Student on FIRST Robotics and Career Opportunities by Barry Matties