Stephanie Hardin of Integrated Ideas and Technologies Inc. discusses her role in the supply chain as a stencil manufacturer, improvements she sees from micromachined step stencils, and why she believes trying to have standardized stencil layouts is wishful thinking due to the many fluctuating variables.
The seventh episode of the popular webinar series “Coatings Uncoated!” is now available to view. Author of "The Printed Circuit Assembler’s Guide to Conformal Coatings for Harsh Environments" and topic expert Phil Kinner from Electrolube shares highly focused educational information on conformal coating and encapsulation. If you are in the assembly business, an EMS, or responsible for specifying conformal coating and/or encapsulation, then this free series is for you.
Duane Benson describes the latest board design project he has been working on in his off-hours—a motion-sensitive lapel pin—including compromises, mistakes, and lessons...
According to the database at Tom Kastner's firm, the number of PCB companies in North America is now down to 199. This is a psychologically significant number for the industry. Tom unpacks this number, provides insights on trends, and...
This year marks the 20th anniversary of IPC APEX EXPO, and IPC is thrilled to celebrate this event milestone with attendees, exhibitors, and presenters. Their dedication to and involvement in IPC APEX EXPO is directly responsible for...
Congratulations to Steve Pudles! IPC Hall of Fame 2020 Inductee by Patty Goldman
The Success of IPC’s STEM Student Outreach Program by Charlene Gunter du Plessis
Inspiring Next-generation Engineers Through STEM by Barry Matties
Semiconductors in Charge: The Changing Face of Board Manufacturing Interview with Chuck Bauer and Dana Korf
What’s Driving AOI Innovation and Collaboration? by Brent Fischthal
The Big Picture on Small Components Interview with Ray Prasad
LPKF on Stencils and Depaneling Interview with Stephan Schmidt and Mirela Orlowski
Increased Miniaturization Poses Soldering Challenges Interview with Chris Nash
Evolving Solder Capabilities for Shrinking Components Interview with Yuya Suzuk
Big Trouble Comes in Tiny Packages by Eric Camden
Size Matters: The Digital Twin by Michael Ford