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Effect of Solder Composition, PCB Surface Finish and Solder Joint Volume on Drop-Shock Reliability

January 20, 2017 | Jim Wilcox and Francis Mutuku, Universal Instruments Corp.; and Shuai Shao and Babak Arfaei, Binghamton University

Lead free solder joint reliability in drop shock loading has been a recurring issue in mobile and handheld consumer electronics. Changing solder composition may offer an opportunity to improve joint drop reliability. This study focuses on different failure modes in circuit board assemblies as observed based on solder composition, board surface finish, and solder joint volume.

Evaluation of the Use of ENEPIG in Small Solder Joints

January 19, 2017 | Ben Gumpert, William Fox, and C. Don Dupriest, Lockheed Martin

When soldering to ENEPIG, all of the palladium is dissolved into the solder joint, and creates a palladium-rich region at the base of the solder joint. The shrinking solder joint sizes due to the ever decreasing size of parts cause the relative size of this palladium-rich microstructure to grow relative to the overall joint thickness. This study evaluates the impact of industry standard Pd thicknesses on thin solder joints through shear testing.



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