FEATURED NEWS AND INFORMATION:
FEATURED ARTICLES AND COLUMNS:

Zulki’s PCB Nuggets: Thermal Compression Bonding for Extra Fine Pitch Flip Chips

October 20, 2021 | Zulki Khan, NexLogic Technologies, Inc.

Medical OEMs and others moving toward developing and producing small, portable products may want to investigate the emerging technology of thermal compression bonding or TCB. TCB is ideally suited for miniature products that use fine pitch flip chip devices undergoing PCB microelectronics assembly.

CapEx Planning With Summit Interconnect

October 20, 2021 | I-Connect007 Editorial Team

The I-Connect007 Editorial Team recently spoke with John Vaughan, Greg Halvorson, and Brett McCoy of Summit Interconnect about their capital expenditure (CapEx) strategies. They discuss the challenges they face when planning CapEx after acquiring fabricators with different capabilities, and the need to have dedicated funds ready for expenditures each year.





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Circuit Chronicles: Effective Spokes in the Wheel of QMS

October 5, 2021 | Kim O'Neil, Prototron Circuits

What is a quality management system (QMS)? Over the years I’ve had it explained to me and exposed to many different definitions and forms of what a QMS is. By the way it wasn’t always called a quality management system,...

Standard of Excellence: Great Things Are Accomplished With Partnerships

September 29, 2021 | Team ASC, American Standard Circuits

There are some very simple steps to developing and sustaining a good partnership with your PCB vendor/partners, all based on treating your partners as you want to be treated. It's following the Golden Rule. But before you do that you...

X-Rayted Files: Radiation’s Effects on Electronic Components

September 22, 2021 | Bill Cardoso, Creative Electron

Whether it’s from naturally occurring sources or induced by modern human ingenuity, electronic components, like everything else, are subject to regular exposure to radiation. It is vital to understand the various sources of...

CapEx Planning Featuring:

  • CapEx Planning With Summit Interconnect with John Vaughan, Greg Halvorson, and Brett McCoy
  • Maximizing ROI and Usage of Test Equipment by Dirk de Waart
  • Book Excerpt: Factory Automation–Planning and Implementing by Happy Holden
  • Fane Friberg on Capital Expenditure Project Planning with Fane Friberg
  • Perfecting the Application of Conformal Coatings Without a Capital Investment by Zsolt Pulai
  • Financing Simplifies Process Improvement through Capital Expenditures by Emmalee Gagnon
  • Increase Production Yield by Investing in Leading-Edge Equipment by Brent Fischthal
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