Implementing a Capacity Planning Tool

September 22, 2017 | David Prunier, MC Assembly

One of the more common challenges we see in the EMS world is that through the outsourcing of their manufacturing, many OEMs have forgotten the fundamentals of supply chain management and expect quick turnaround on orders without taking into consideration the whole supply chain constraints or the impact of not providing accurate forecasts to the EMS partner.

RTW SMTAI: MIRTEC on Staying Ahead of the Curve

September 21, 2017 | Real Time with...SMTAI

Brian D’Amico, president of MIRTEC, talks with I-Connect007 Managing Editor Andy Shaughnessy about some of the latest 3D AOI challenges, including dealing with highly reflective surfaces of solder joints or wafer-level die, which make it impossible to characterize in 3D. He says it's not just plain SMT boards anymore, but an integration of wafer-level manufacturing, which they see as coming down more and more.


The Role of Bismuth (Bi) in Electronics: A Prelude

August 24, 2017 | Dr. Jennie Hwang, H-Technologies Group

When it comes to considering applications in electronics and microelectronics industry, over last three decades, the industry has shied away from using bismuth (Bi), at least not in standard practices in mass production. However, an...

EPTE Newsletter: Reborn Sharp Pushes Drastic Reforms

August 11, 2017 | Dominique Numakura, DKN Research

Hon Hai Precision Industry is the world’s largest contract electronics manufacturer. Last week, the company announced plans to build a $10 billion LCD panel plant in Wisconsin. Hon Hai acquired Japanese electronics manufacturer...

Analyzing the Cost of Material in Today’s Global Economy, Part 3

August 7, 2017 | Tom Borkes, The Jefferson Project

Any increase in material cost based solely on an assembly operation's geographic location could, in itself, cause a condition that would not allow a turnkey electronic product assembler to successfully compete on the global...

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