NIST Resources for CHIPS Act Participants

January 27, 2023 | Nolan Johnson, I-Connect007

At the recent IPC Advanced Packaging Symposium, Dr. Frank W. Gayle, deputy director of the Advanced Manufacturing National Program Office, an interagency team with core staff hosted at the U.S. National Institute of Standards and Technology (NIST), gave a presentation on the work NIST has recently undertaken in support of both the semiconductor and R&D sectors, and the CHIPS and Science Act.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

January 27, 2023 | Nolan Johnson, I-Connect007

This week, the IPC APEX EXPO event has cast a long shadow across the news feeds. No, that’s not the right metaphor. No, not a shadow; shadows are dark. It would be more accurate to say IPC APEX EXPO cast a beam of illumination upon the news feeds for the electronics manufacturing industry. To that end, the APEX EXPO news makes a prominent appearance in this week’s editor’s picks.



Sensible Design: Automotive Conformal Coating Applications

January 25, 2023 | Team Electrolube, Electrolube

Conformal coatings are all around us. The benefits they offer are discreet but intensely purposeful, as they protect electronic circuitry against harsh environments and help to extend the reliability and lifetime of our devices. With...

Punching Out: Here’s the Deal About 2022

January 23, 2023 | Tom Kastner, GP Ventures, Ltd.

Last year turned out to be a fairly slow year for mergers and acquisitions (M&A) in the North American PCB and EMS sectors. We counted just seven completed or announced deals in the PCB sector last year, compared to 13 in 2021,...

SMT Perspectives & Prospects: Creating a Better World Through Engineering

January 18, 2023 | Dr. Jennie Hwang, H-Technologies Group

What is the role of an engineer? In my definition, an engineer plays a crucial role in bridging science and society. In this spirit, The National Academies of Engineering (one of the triad Academies of The National Academy of Science,...

The Impact of Advanced Packaging Featuring:

  • The Nuts and Bolts of Advanced Packaging interview with Matt Kelly
  • Advanced Packaging Beyond the Zetabyte Era by Tom Rucker
  • Key Findings From Semiconductor Fabrication Research by IPC
  • Integra Redefining Die Prep in the U.S. by Matt Bergeron
  • Durability and Cost Benefits Drive Mil-Aero Demand for OCPP by Sam Sadri
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