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Vapor Degreasing Chemistries to Remove Difficult Lead-Free and No-Clean Fluxes from PCBs
May 26, 2017 | Venesia Hurtubise, Elizabeth Norwood, Wells Cunningham, and Laura LaPlante, MicroCare Corp.Estimated reading time: 7 minutes
Cost of Ownership
Although cleaning is crucial to many electronics industries, it is still only one aspect of the total manufacturing process, and so the cost of cleaning needs to remain reasonable to the overall manufacturing cost. Fortunately, the cost-per-cleaning for the vapor degreasing process is considerably low and can be comparable or less than that of aqueous cleaning. When comparing solvent vapor degreasing to aqueous cleaning systems, there are many factors to consider including capital investment, equipment footprint, power supply, cleaning time, detergent/solvent supply, and waste disposal. In other words, a vapor degreaser and an aqueous machine capable of cleaning the same number of parts-per cycle will have different overall costs, thus different costs-per-part cleaned. Aqueous systems typically have larger working footprints, power requirements, and longer cleaning cycles; these are due to the need for several washing and rinsing stations, high temperature inputs, and reliance on mechanical spraying and washing mechanisms4. Although vapor degreasers require less time and overall maintenance, the cleaning solvents are typically more expensive than aqueous detergents; however, properly maintained equipment should retain solvent, and the distillation process keeps solvent pure for continuous use.
To read the full version of this article, which appeared in the April 2017 issue of SMT Magazine, click here.
Page 3 of 3Suggested Items
Indium Experts to Present on High-Temperature, Lead-Free Solder Paste and High Reliability Liquid Metal Alloys Poster at ECTC
05/16/2024 | Indium CorporationIndium Corporation Research Associate Kyle Aserian will deliver a presentation at the 74th Electronic Components and Technology Conference (ECTC) on May 31, in Denver, Colorado.
Indium Experts to Present at Electronics in Harsh Environments SMTA Conference
05/13/2024 | Indium Corporationndium Corporation Technical Manager for Europe, Africa, and the Middle East, Karthik Vijay, will deliver a technical presentation and Indium Corporation Senior Technologist, Dr. Ronald Lasky, will deliver both a workshop and technical presentation at the Electronics in Harsh Environments SMTA Conference on May 14-16 in Copenhagen, Denmark.
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
05/08/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce a new distribution partnership with Shinil Fl Ltd., a prominent supplier of technological solutions in the SMT and semiconductor sectors.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.