-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
ITW EAE to Showcase Latest Electronic Assembly Equipment Developments at SMT Connect Trade Fair
April 6, 2022 | ITW EAEEstimated reading time: 1 minute
ITW EAE will be showcasing its latest developments at SMT Connect, May 10-12 in Nuremburg, Germany. The ITW EAE booth 4-205 will have MPM, Camalot, Electrovert and Vitronics Soltec Applications experts on hand as well as Sales and Management to answer questions and offer solutions.
Camalot will be presenting live demonstrations of its Advanced Tilt and Rotate dispensing system. This new and innovative system reduces wet out areas and improves capillary flow for underfill and provides access to dispense on side walls, underneath, or around tall components. State-of-the-art rotary actuators provide a fast, high precision, zero backlash mechanism that allows articulation of the dispense pump in sub-degree increments in both axes for total flexibility.
MPM will be presenting live demonstrations of the Edison II ACT (Automatic Changeover Technology) which is in the final stage of development. This innovative patent pending technology provides a simple, cost-effective solution that can be implemented in progressive stages towards full automation. It is designed to be easy to use and simple to adopt and requires no additional skills to operate. The solution utilizes an Edison printer and a cost-effective pairing cart designed to automate the changeover of solder paste cartridges, support tooling, squeegees, and stencils.
MPM will also have the top-performing Momentum II Elite on display. This proven, highly productive printer platform was recently updated with a new set of enhanced technologies for further improvement around machine productivity, yield, ease of use, and flexibility.
ITW EAE will also share advancements they have made on interface solutions for Industry 4.0/MES that will lead to improvements in yield, data collection and overall equipment effectiveness.
Suggested Items
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.
Vicor Power Orders Hentec Industries/RPS Automation Pulsar Solderability Testing System
04/24/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Vicor Power has finalized the purchase of a Pulsar solderability testing system.
AIM Solder’s Dillon Zhu to Present on Ultraminiature Soldering at SMTA China East
04/22/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Dillon Zhu will present on the topic: Ultraminiature Soldering: Techniques, Technologies, and Standards at SMTA China East. This event is being held at the Shanghai World Expo Exhibition & Convention Center from April 24-25.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Wisconsin Expo & Tech Forum
04/18/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Wisconsin Expo & Tech Forum taking place on May 7 at the Four Points by Sheraton | Milwaukee Airport, in Milwaukee, Wisconsin.
Hentec/RPS Publishes an Essential Guide to Selective Soldering Processing Tech Paper
04/17/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing the critical process parameters that need to be optimized to ensure optimal results and guarantee the utmost in end-product quality.