-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
3D Electronic Devices With Additive Manufacturing
November 29, 2022 | Shavi Spinzi, Nano DimensionEstimated reading time: 1 minute
Imagine fabricating PCBs without the hassle of drilled vias and metal plating. Imagine PCBs with near-perfect registration. If we take it to the next stage, imagine drawing electronics in 3D space.
There is a way to do all this with additively manufactured electronics (AME). We just need to start to think in 3D. This will allow us to abandon the 2D limitations that we have become so used to and expand our horizons so that we can climb to higher levels of performance.
In this article, I will explore the two fundamental capabilities that are the cornerstones for drawing electronics in 3D space, which is where AME technology and 3D design capabilities converge.
The First Cornerstone of AME: Isolation and Conductive Materials
More than a decade ago, we saw the rise of printed electronics (PE), which is printing of conductive traces on a predefined substrate. The substrate is fixed, can be planar or a 3D shape and the printing process—either inkjet, aerosol jetting, or any other method—places the conductor on top of it.
AME differs from PE because it uses more than one material. The simplest configuration for AME consists of two materials: one conductive and one isolation/dielectric. It has the potential to grow to more than two materials by adding combinations of different conductive and isolation materials as well as sacrificial materials to build channels and different complex structures.
Why Do We Need 3D PCB Structures?
The first stage of AME was to imitate traditional PCB 2D structures by building multilayer boards (MLB), plated through-holes (PTH), and microvias to prove that AME can replace "traditional" PCB processes. It certainly is doable, but it does not achieve the full potential and capabilities of 3D AME.
To read this entire article, which appeared in the November 2022 issue of PCB007 Magazine, click here.
Suggested Items
SPEA Expands in Southeast Asia with New Subsidiary in Thailand
05/17/2024 | SPEASPEA, a global leader in automatic test equipment for the manufacturing of semiconductor, microelectronic and electronic devices, today announced the opening of its new subsidiary in Thailand. This expansion marks a significant step forward in SPEA's commitment to serving the growing Southeast Asian microchip and electronics market with leading-edge manufacturing machinery and equipment.
Indium Corporation to Showcase Sustainable Solutions for Power Electronics at PCIM
05/17/2024 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation® will proudly showcase a selection of innovative products at PCIM Europe, June 11-13, in Nuremberg, Germany.
Siemens, Foxconn Team Up to Optimize Forward-thinking Manufacturing
05/16/2024 | FoxconnSiemens AG, a leading technology company, and Hon Hai Technology Group (Foxconn), the world’s largest electronics manufacturer, have signed a memorandum of understanding (MoU) to drive digital transformation and sustainability in smart manufacturing platforms.
IPC Releases May 2024 Global Sentiment of the Electronics Supply Chain Report
05/16/2024 | IPCSentiment among electronics manufacturers fell this month, after hitting a new high in April. Despite the decline, sentiment remains historically high according to IPC’s May Sentiment of the Global Electronics Manufacturing Supply Chain Report.
Sypris Reports Q1 2024 Results; Revenue Up 10%
05/15/2024 | Sypris Solutions Inc.The Company’s first quarter 2024 consolidated revenue increased 10.1% to $35.6 million compared with the prior-year quarter, representing the 11th quarter of double-digit year-over-year growth during the past 12 quarterly periods.