-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
KYZEN Places Focus on Two Chemistries at SMTA Michigan & Ohio Valley Expos
August 2, 2023 | KYZEN'Estimated reading time: 1 minute
KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Michigan Expo & Tech Forum on Tuesday, August 15, 2023, at Laurel Manor in Livonia, MI, and the SMTA Ohio Valley Expo & Tech Forum on Thursday, August 17, 2023, at the Embassy Suites by Hilton Cleveland-Rockside in Independence, OH.
At both events, the KYZEN clean team will highlight two products, each specializing in a different phase of the cleaning process: AQUANOX A4626 AND KYZEN E5631J. Though they are used at different phases of PCB assembly, both chemistries are formulated with a priority on cleaning efficiency and effectiveness.
AQUANOX A4626 is an environmentally friendly aqueous cleaning agent designed to quickly remove the latest polymeric no-clean flux residues with a wide compatibility window on boards, components, labels and metallic surfaces. A4626 is easy to use and control in addition to possessing long tank life and superior effectiveness for jettable paste applications.
KYZEN E5631J is a ready-to-use understencil wipe solution for removing raw solder paste in online and offline stencil cleaning processes. Formulated with both the worker and environment in mind, E5631J quickly and efficiently cleans all types of raw solder pastes and is proven compatible with common stencils, cleaning equipment and printer manufacturers.
Suggested Items
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.
Vicor Power Orders Hentec Industries/RPS Automation Pulsar Solderability Testing System
04/24/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Vicor Power has finalized the purchase of a Pulsar solderability testing system.
AIM Solder’s Dillon Zhu to Present on Ultraminiature Soldering at SMTA China East
04/22/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Dillon Zhu will present on the topic: Ultraminiature Soldering: Techniques, Technologies, and Standards at SMTA China East. This event is being held at the Shanghai World Expo Exhibition & Convention Center from April 24-25.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Wisconsin Expo & Tech Forum
04/18/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Wisconsin Expo & Tech Forum taking place on May 7 at the Four Points by Sheraton | Milwaukee Airport, in Milwaukee, Wisconsin.