-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Koh Young USX Series of Inspection Machines of Ultra Large, Heavy Boards Wins Two Prestigious Awards During SMTA Guadalajara
October 25, 2023 | Koh Young TechnologyEstimated reading time: 1 minute
Koh Young Technology, the leader in True3D™ measurement-based inspection solutions, proudly announced another pair of innovation awards. This time, Mexico EMS acknowledged the new USX Series of solder paste (SPI), automated optical inspection (AOI), and dispense process inspection (DPI) machines for ultra large, heavy boards with the coveted Editor’s Choice Award and the Best New SPI Product Award. Mexico EMS Editor Ron Friedman presented both awards to Koh Young during SMTA Guadalajara on 25 October 2023 at the Westin Guadalajara in Jalisco, Mexico.
“PCBs are becoming increasingly complex. Applications like LED, EV, communications, and even storage challenge manufacturers with large, heavy board designs” said Brent Fischthal, Head of Global Marketing at Koh Young Technology. “We developed and designed our new USX Series with manufacturers to help them address these challenges.” With solutions for solder paste, components, and dispensed materials like conformal coating, underfill, and flux, the USX Series handles 1,800mm (70 inch) long boards weighing upwards of 15kg (33lbs), while still delivering all the measurement-based inspection capabilities that made Koh Young the global market leader.
An extension of its award-winning product line-up, the newly introduced USX Series continues to deliver on Koh Young’s promise to deliver critical inspection solutions to eliminate process issues and maximize production quality. Besides increased board handling capabilities, features like active warp compensation, pad-referencing, self-diagnosing maintenance, automated process controls, and foreign material inspection are just some features manufacturers can use to improve yields.
We revolutionized the inspection process years ago with our innovative technology and became the market leader. Today, based on that proven 3D measurement-based technology, Koh Young continues to conquer new manufacturing challenges facing our industry with solutions optimized for extra-long and heavy board applications.
You can explore our solder paste inspection and award-winning True3D inspection solutions at www.kohyoungamerica.com or through these FREE downloads from Koh Young:
- The Printed Circuit Assembler's Guide to...SMT Inspection: Today, Tomorrow, and Beyond eBook
- The Companion Guide to…SMT Inspection: Today, Tomorrow, and Beyond eBook
Suggested Items
Real Time with… IPC APEX EXPO 2024: Exploring Electronic Card Testing and AI Integration with SPEA
05/02/2024 | Real Time with...IPC APEX EXPOLuca Fanelli, president of SPEA, and vice president Andrea Furnari discuss the company and its business units. The challenges in testing electronic cards and SPEA's solutions are discussed, and its focus on the US market is emphasized. The use of AI in testing, particularly in optical inspection and test program execution, is also examined.
Koh Young Extends Invitation to the 2024 IEEE Electronic Components and Technology Conference
04/30/2024 | Koh YoungKoh Young, the industry leader in True3D measurement-based inspection solutions, invites you to join us at the at the 2024 IEEE Electronic Components and Technology Conference from May 28-31, 2024, in Denver, Colorado at the Gaylord Rockies Resort & Convention Center.
Latest Test and Inspection Solutions from GOEPEL electronic at SMTconnect 2024
04/29/2024 | GOEPEL electronicGOEPEL electronic will be demonstrating automated test and inspection equipment at SMTconnect, taking place in Nuremberg from June 11 to 13, 2024.
Koh Young Showcases Award-winning Inspection Solutions at SMTconnect with SmartRep in Hall 4A.225
04/25/2024 | Koh Young TechnologyKoh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will showcase an array of award-winning inspection and measurement solutions at SMTconnect alongside its sales partner, SmartRep, in booth 4A.225 at NürnbergMesse from June 11-13, 2023. The following offers a glimpse into what Koh Young will present at the tradeshow:
ViTrox Pioneering the Future of Smart Manufacturing at NEPCON China 2024
04/18/2024 | ViTroxViTrox, which aims to be the World’s Most Trusted Technology Company, is pleased to announce its participation in the NEPCON China 2024 at Booth #1H27 at Shanghai World Expo Exhibition & Convention Center from 24-26 April 2024.