-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
ITW EAE MPM Introduces Edison II ACT Stencil Printer for Factory Automation
October 30, 2023 | ITW EAEEstimated reading time: 1 minute
MPM® announces the new Edison™ II ACT stencil printer a simple to use, easy to adopt and scalable solution for automation. The MPM® Edison™ II ACT is integrated with automated changeover technology that is fast and consistent with reduced operator requirement resulting in error-free changeover, and increased yield and throughput.
The MPM® Edison™ II ACT is the industry’s most accurate printer in the market with advanced technology needed for ultra-fine pitch and micro aperture printing processes. This makes it ideally suited for advanced semiconductor stencil printing applications. The MPM® Edison™ II ACT has a proven print process capability greater than 2 Cpk for 0201 metric components. With a built-in ±8 micron machine alignment, and ±15 micron wet print accuracy (≥2 Cpk @ 6 sigma, Edison's wet print accuracy is 25% better than the next best printers.
MPM® Edison™ II ACT has a transfer efficiency that exceeds requirements for the smallest apertures. A single high precision load-cell with closed-loop pressure control and motor driven system enable precise and consistent squeegee force control across the entire print stroke in both directions, which helps improve yields. Innovative machine design achieves ultra-tight coplanarity between stencil and substrate enabling yield improvement for ultra-thin stencil printing.
Suggested Items
DuPont Wins Four 2022 Edison Awards, Highlighting Innovative Technologies
04/25/2022 | PRNewswireDuPont is proud to announce that four of its innovative, breakthrough technologies were recognized with the prestigious 2022 Edison Award.
ITW EAE Announces New SECS/GEM Communication Package for MPM Edison Stencil Printer
01/25/2021 | ITW EAEITW EAE announces a new SECS/GEM communication package for the MPM® Edison™ Printer. SECS/GEM is a semiconductor market communication standard that provides a common interface between manufacturing equipment. The Edison package collects and logs process data which can be used to optimize the production line.
RoboSense Smart LiDAR Sensor Wins the 2020 Edison Awards
04/02/2020 | RoboSenseRoboSense, the world’s leading autonomous driving LiDAR perception solution provider, has been honored as a winner in Transportation & Logistics Category for 2020 Edison Awards.
ITW EAE Announces New EdgeLoc Board Clamping and Board Staging Options for Edison Printers
10/29/2019 | ITW EAEITW EAE releases new features for the MPM® Edison™ Printer. Board staging, designed to meet the demands from automotive manufacturers for reduced cycle time, will now be a feature on the Edison. And the new EdgeLoc™ II is a robust addition to the side-clamming capability on the Edison.
ITW EAE's MPM Edison Printer Wins VA Excellent Award at SMT China Vision Awards
05/10/2016 | ITW EAEITW EAE’s recently-introduced MPM Edison Printer earned a coveted VA Excellent Award from the SMT China Vision Awards at the recent NEPCON China exposition and conference in Shanghai.