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Hentec/RPS to Exhibit Vector Selective Soldering and Odyssey Lead Tinning Systems at IPC APEX EXPO 2024

04/04/2024 | Hentec Industries/RPS Automation
Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability testing equipment, is pleased to announce it will exhibit its Vector 300 selective soldering and Odyssey 925 lead tinning systems at the upcoming IPC EXPO 2024. 

Astranis Space Technologies Orders Hentec Industries/RPS Automation Odyssey Component Lead Tinning System

12/13/2023 | Hentec Industries/RPS Automation
Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Astranis Space Technologies Corp has finalized the purchase of a Hentec/RPS Odyssey 1325 robotic hot solder dip component lead tinning machine. 

HyRel to Showcase Robotic Hot Solder Component Tinning Innovation at SMTA Silicon Valley Expo & Tech Forum

11/15/2023 | HyRel
HyRel Technologies, a global provider of quick turn semiconductor modification solutions, is pleased to announce plans exhibit its groundbreaking Robotic Hot Solder Component Tinning technology at the SMTA Silicon Valley Expo & Tech Forum on Thursday, Dec. 7, 2023, hosted at Flextronics in Milpitas, CA.

TE Connectivity Orders Hentec Industries/RPS Automation Odyssey 1750 Component Lead Tinning System

11/02/2023 | Hentec Industries/RPS Automation
Hentec Industries/RPS Automation is pleased to announce that TE Connectivity has ordered a Hentec/RPS Odyssey 1750 robotic hot solder dip component lead tinning system for installation in their Mount Joy, Pennsylvania facility.

Hentec Industries/RPS Automation Publishes the Critical Role of RHSD Processing for High-Reliability Applications Tech Paper

10/18/2023 | Hentec Industries/RPS Automation
Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing hot solder dip processing. 
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