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Hentec Industries/RPS Automation Receives Order from Fisk Alloy Incorporated for Photon Steam Aging System
January 11, 2024 | Hentec Industries/RPS AutomationEstimated reading time: Less than a minute
Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Fisk Alloy Incorporated has purchased a Photon steam aging system. The Photon steam aging system is used for accelerated life testing to simulate elongated storage conditions for high-reliability applications.
These steam aging systems complement the Odyssey component lead tinning machines specifically designed to perform component re-tinning, tin whisker mitigation, gold removal and BGA de-balling for high reliability and military application in accordance with all relevant GEIA-STD-0006, MIL-PRF-38535, MIL-PRF-38524E and ANSI-J-STD-002 standards.
Suggested Items
Hentec/RPS to Exhibit Vector Selective Soldering and Odyssey Lead Tinning Systems at IPC APEX EXPO 2024
04/04/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability testing equipment, is pleased to announce it will exhibit its Vector 300 selective soldering and Odyssey 925 lead tinning systems at the upcoming IPC EXPO 2024.
Astranis Space Technologies Orders Hentec Industries/RPS Automation Odyssey Component Lead Tinning System
12/13/2023 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Astranis Space Technologies Corp has finalized the purchase of a Hentec/RPS Odyssey 1325 robotic hot solder dip component lead tinning machine.
HyRel to Showcase Robotic Hot Solder Component Tinning Innovation at SMTA Silicon Valley Expo & Tech Forum
11/15/2023 | HyRelHyRel Technologies, a global provider of quick turn semiconductor modification solutions, is pleased to announce plans exhibit its groundbreaking Robotic Hot Solder Component Tinning technology at the SMTA Silicon Valley Expo & Tech Forum on Thursday, Dec. 7, 2023, hosted at Flextronics in Milpitas, CA.
TE Connectivity Orders Hentec Industries/RPS Automation Odyssey 1750 Component Lead Tinning System
11/02/2023 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation is pleased to announce that TE Connectivity has ordered a Hentec/RPS Odyssey 1750 robotic hot solder dip component lead tinning system for installation in their Mount Joy, Pennsylvania facility.
Hentec Industries/RPS Automation Publishes the Critical Role of RHSD Processing for High-Reliability Applications Tech Paper
10/18/2023 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing hot solder dip processing.