SMT Prospects and Perspectives: AI Opportunities, Challenges, and Possibilities, Part 1
Nolan’s Notes: Do More, Get More
Global Sourcing Spotlight: Don’t Be Afraid of Global SourcingEssemtec Exhibiting at IPC APEX Expo at Booth 2409
March 12, 2024 | EssemtecEstimated reading time: 2 minutes
We are showcasing our flagship All-in-One platforms FOX and PUMA. The machines will be equipped with the latest innovations in Solder Jetting, Integrated Inspection System, Smart Material Management, and 4 mm EVO feeder – 08004 Pick-and-Place.
The All-in-One platform will demonstrate live the highest standards in electronics assembly on flexible substrates, jetting of multiple fluids three times faster and efficient rework on populated boards.
Essemtec presents its agile dispensing platform on the TARANTULA machine. The machine can be equipped with five different valves, for a comprehensive range of dispensing applications such as Solder Paste and SMT Glue, LED Encapsulation, Silver Epoxy, Dam, and Underfill.
Our in-house rapid prototyping solution will be demonstrated on Nano Dimension’s DragonFly 3D printer and Essemtec FOX equipment with the combined dispensing and components placement capabilities. This is a revolutionary end-to-end concept that accelerates the assembly process, protects IP, and creates supplementary internal synergy.
Under the motto “Our Focus - Your Solution,” we focus on proven new solutions in various segments for electronics production, as NPI, High-Mix/Low-Volume, High-Speed Dispensing, Printed Electronics, and Complex Repair.
High-Speed Solder Paste Jetting - for all product platforms
Essemtec is dedicated to continuous improvement. An increased solder jet speed of 180’000 – 400’000 dots/h can be achieved. It is now possible, with the new increased speed and accuracy, to exchange inflexible traditional solder paste screen printers with a P&P integrated solder paste jetting solution to serve multiple machines in a highly flexible line solution. End users gain the flexibility to solder jet products & place components in the All-in-One Systems or dedicated high-speed dispensers for volume production, integrating the system for process improvement capability.
Integrated Inspection System – for all product platforms
First time in the industry an Integrated Inspection System (I2S) in the Pick and Place and dispensing solutions will be shown. The Integrated Inspection System is available for dispensed and jetted material as well as placed SMD components right after the process. Thus, only good, inspected products are entering the reflow ovens. The process also includes an automated repair function.
The system is already integrated in automotive and complex production sites by various companies.
Smart Material Management - integrated solution for factory 4.0
The affordable material management solution is a fully integrated end-to-end solution for electronics manufacturing factories and covers all different storage locations. The solution enables right material placement at the right time. The traceability is precise down to individual component.
The solution is expandable and flexibly controlled by an intuitive eStorage software, from simple barcode-labelled storage location to fully automated storage cabinets. Smart Material Management The solution offers high ROI and is fully integrated with the production machine and the ERP systems.
Our team of engineers will share best tips for the hottest SMT topics on the market to help you improve the time to market, increase the flexibility of your production line and optimize your manufacturing costs.
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