-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Soldering Process for Molded Interconnect Devices in Three Dimensions
October 12, 2015 | Paul Wild and Helmut Oettl, Rehm Thermal SystemsEstimated reading time: 4 minutes
When vacuum is used, the Galden Vapor is distributed uniformly throughout the process chamber instead of forming an ascending vapor front during preheating and soldering. In this way, the disadvantages of the temperature gradient associated with conventional vapor phase systems (the closer to the source of heat the sooner heat up takes place) and with convection systems (the closer to the source of heat the sooner heat up takes place and the hotter it gets) are avoided. This is due to the fact that there are not any large masses of air which have to be displaced, thus permitting quick distribution of the gas molecules into the "empty room". This effect has a positive influence on the profiling of the soldering process and the temperature homogeneity during heat up, and finally on the quality of the soldering result.
Summary
By using vapor phase soldering in combination with in-situ vacuum, geometry-related deviations in the temperature profiles can also be eliminated in addition to reducing void content and void count. As revealed by temperature profile measurements on a MID housing, it was possible to level out the heat gradients at all measurement points to a significant extent with the help of pre-vacuum, and the small temperature difference at peak temperatures which is associated with vapor phase soldering was retained as well. Furthermore, pre-vacuum can be used to assure quicker and more uniform heat-up of components with large thermal masses.
In summary it can be concluded that vacuum during vapor phase soldering provides an additional, highly flexible influencing parameter for the evaluation of an ideal soldering profile and, beyond this, prevents the drag-out of Galden in the case of cup-shaped components.
Page 2 of 2Suggested Items
AIM Solder’s Dillon Zhu to Present on Ultraminiature Soldering at SMTA China East
04/22/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Dillon Zhu will present on the topic: Ultraminiature Soldering: Techniques, Technologies, and Standards at SMTA China East. This event is being held at the Shanghai World Expo Exhibition & Convention Center from April 24-25.
Hentec/RPS Publishes an Essential Guide to Selective Soldering Processing Tech Paper
04/17/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing the critical process parameters that need to be optimized to ensure optimal results and guarantee the utmost in end-product quality.
New Book on Low-temperature Soldering Now Available
04/17/2024 | I-Connect007I-Connect007 is pleased to announce that The Printed Circuit Assembler’s Guide to… Low-temperature Soldering, Vol. 2, by subject matter experts at MacDermid Alpha Electronics Solutions, is now available for download.
Nordson Electronics Solutions Expands the SELECT Synchro Selective Soldering Equipment Family With New Synchro 3 Release
04/03/2024 | BUSINESS WIRENordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, releases the Synchro™ 3, a new model in the SELECT® Synchro™ selective soldering equipment family for high-volume printed circuit board assembly applications.
Revolutionizing Precision Soldering: Introducing the iBot-i1/2s by Sasinno Americas
04/02/2024 | Sasinno AmericasSasinno Americas is pleased to introduce its latest advancement in soldering technology – the iBot-i1/2s. This cutting-edge system redefines precision soldering with groundbreaking features designed to elevate efficiency and performance in electronics manufacturing processes.